JP2568209B2 - Cantilever for semiconductor processing - Google Patents
Cantilever for semiconductor processingInfo
- Publication number
- JP2568209B2 JP2568209B2 JP17741587A JP17741587A JP2568209B2 JP 2568209 B2 JP2568209 B2 JP 2568209B2 JP 17741587 A JP17741587 A JP 17741587A JP 17741587 A JP17741587 A JP 17741587A JP 2568209 B2 JP2568209 B2 JP 2568209B2
- Authority
- JP
- Japan
- Prior art keywords
- cantilever
- semiconductor processing
- wafer
- quartz glass
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体ウェハの拡散処理等に用いられるカン
チレバーの改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement of a cantilever used for diffusion processing of semiconductor wafers and the like.
半導体拡散処理用の治具として、カンチレバーが用い
られている。従来のカンチレバーは、ウェハをセット
したボートを載せて使用するタイプのものと、カンチ
レバー先端部にウェハ支持溝を設け、直接ウェハをセッ
トするタイプものとがあった。A cantilever is used as a jig for semiconductor diffusion processing. Conventional cantilevers include a type in which a boat on which a wafer is set is mounted and used, and a type in which a wafer supporting groove is provided at the tip of the cantilever and a wafer is directly set.
しかし、のタイプのものは、セットするボートの重
量が重いため、カンチレバーに大きなたわみを生じさせ
るという問題があった。また、のタイプのものは、カ
ンチレバー自体にウェハ支持溝が設けられているため強
度が著しく低下するうえ、洗浄の際には長尺のカンチレ
バー全体を取扱わなければならず洗浄が困難であった。However, the type (3) type has a problem in that the cantilever is largely bent because the weight of the boat to be set is heavy. In addition, since the cantilever itself is provided with a wafer supporting groove in the type (3), the strength is significantly reduced, and the entire long cantilever must be handled during cleaning, which makes cleaning difficult.
本発明は上記問題点を解決するためになされたもので
あり、たわみや強度低下を招くことなく、しかも洗浄も
容易な半導体処理用カンチレバーを提供することを目的
とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide a cantilever for semiconductor processing which does not cause bending or strength reduction and is easy to clean.
本発明の半導体処理用カンチレバーは、炭化ケイ素か
らなるカンチレバー本体に、多数のウェハ支持溝が形成
された石英ガラスからなるロッドを複数着脱可能に取付
けたことを特徴とするものである。A semiconductor processing cantilever according to the present invention is characterized in that a plurality of rods made of quartz glass having a large number of wafer supporting grooves are detachably attached to a cantilever body made of silicon carbide.
このような半導体処理用カンチレバーによれば、ウェ
ハボートを使用しないので、カンチレバーのたわみはほ
とんど問題とならない。また、カンチレバー本体にウェ
ハ支持溝を設けていないので、強度が低下することもな
い。しかも、石英ガラスからなるロッドを取り外して容
易に洗浄することができる。According to such a semiconductor processing cantilever, since the wafer boat is not used, the bending of the cantilever is not a problem. Further, since the cantilever body is not provided with the wafer supporting groove, the strength does not decrease. Moreover, the rod made of quartz glass can be removed for easy cleaning.
なお、本発明において、それぞれカンチレバー本体と
して炭化ケイ素を、ロッドとして石英ガラスを用いるの
は以下のような理由による。すなわち、炭化ケイ素は高
温における強度が大きいので、使用中のカンチレバー本
体が熱によって変形することがなくウェハの重量を充分
に支持することができる。また、石英ガラスは高純度で
あるためウェハを汚染することがなく、しかも支持溝を
容易に加工できる。In the present invention, the reason why silicon carbide is used as the cantilever body and quartz glass is used as the rod is as follows. That is, since silicon carbide has a high strength at high temperatures, the weight of the wafer can be sufficiently supported without the cantilever body being used being deformed by heat. Further, since the quartz glass has high purity, it does not contaminate the wafer and the supporting groove can be easily processed.
以下、本発明の実施例を説明する。なお、第１図
（ａ）は本発明の一実施例におけるカンチレバーの斜視
図、同図（ｂ）は断面図である。Examples of the present invention will be described below. 1 (a) is a perspective view of the cantilever in one embodiment of the present invention, and FIG. 1 (b) is a sectional view.
第１図（ａ）及び（ｂ）において、炭化ケイ素製のカ
ンチレバー本体１の先端部は、ウェハの形状に対応して
凹状をなしており、その先端部の上端２個所及び底部の
合計３個所に、長手方向に沿って嵌合溝が形成されてい
る。そして、各嵌合溝に多数のウェハ支持溝2aが形成さ
れた石英ガラス製ロッド２が着脱可能に嵌合されてい
る。第１図（ｂ）に示すように、これら石英ガラス製ロ
ッド２のウェハ支持溝2aによってウェハ10が支持され
る。In FIGS. 1 (a) and 1 (b), the tip portion of the silicon carbide cantilever body 1 has a concave shape corresponding to the shape of the wafer, and the tip portion has two upper ends and three bottom portions in total. A fitting groove is formed along the longitudinal direction. Then, a quartz glass rod 2 having a large number of wafer supporting grooves 2a formed in each fitting groove is detachably fitted. As shown in FIG. 1 (b), the wafer 10 is supported by the wafer supporting grooves 2 a of the quartz glass rods 2.
上記半導体処理用カンチレバーによれば、ウェハボー
トを使用しないので、カンチレバーのたわみはほとんど
問題とならない。また、カンチレバー本体１にはウェハ
支持溝を設けていないので、強度が低下することもな
い。しかも、石英ガラス製ロッド２を取り外すことがで
きるので、洗浄や交換も容易になる。According to the above semiconductor processing cantilever, since the wafer boat is not used, the bending of the cantilever is not a problem. Further, since the cantilever body 1 is not provided with the wafer supporting groove, the strength does not decrease. Moreover, since the quartz glass rod 2 can be removed, cleaning and replacement are facilitated.
なお、上記実施例では、石英ガラス製ロッドを３本取
付けたカンチレバーを示したが、第２図図示のような形
状の炭化ケイ素製のカンチレバー本体３に２本の石英ガ
ラス製ロッド４を着脱可能に取付けたカレンチレバー
や、第３図図示のような形状の炭化ケイ素製のカンチレ
バー本体５に４本の石英ガラス製ロッド６を着脱可能に
取付けたカンチレバーでも上記実施例と同様な効果を得
ることができる。In the above embodiment, the cantilever having three quartz glass rods attached is shown, but two quartz glass rods 4 can be attached to and detached from the silicon carbide cantilever body 3 having the shape shown in FIG. The same effect as in the above-described embodiment can be obtained with a cantilever attached to the vehicle or a cantilever in which four quartz glass rods 6 are detachably attached to a silicon carbide cantilever body 5 having a shape shown in FIG. it can.
以上詳述したように本発明の半導体処理用カンチレバ
ーによれば、たわみや強度低下を招くことなく、しかも
洗浄も容易になる等顕著な効果を奏するものである。As described in detail above, according to the semiconductor processing cantilever of the present invention, it is possible to achieve remarkable effects such as the ease of cleaning without causing any bending or reduction in strength.
第１図（ａ）は本発明の実施例における半導体処理用カ
ンチレバーの斜視図、同図（ｂ）は同カンチレバーの断
面図、第２図は本発明の他の実施例における半導体処理
用カンチレバーの断面図、第３図は本発明の更に他の実
施例における半導体処理用カンチレバーの断面図であ
る。 １、３、５……炭化ケイ素製カンチレバー本体、２、
４、６……石英ガラス製ロッド、10……ウェハ。1 (a) is a perspective view of a semiconductor processing cantilever according to an embodiment of the present invention, FIG. 1 (b) is a sectional view of the cantilever, and FIG. 2 is a semiconductor processing cantilever according to another embodiment of the present invention. A sectional view and FIG. 3 are sectional views of a semiconductor processing cantilever according to still another embodiment of the present invention. 1, 3, 5 ... Silicon carbide cantilever body 2,
4, 6 ... Quartz glass rod, 10 ... Wafer.
Claims (1)
多数のウェハ支持溝が形成された石英ガラスからなるロ
ッドを複数着脱可能に取付けたことを特徴とする半導体
処理用カンチレバー。1. A cantilever body made of silicon carbide,
A cantilever for semiconductor processing, wherein a plurality of rods made of quartz glass having a large number of wafer supporting grooves are detachably attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17741587A JP2568209B2 (en) | 1987-07-16 | 1987-07-16 | Cantilever for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17741587A JP2568209B2 (en) | 1987-07-16 | 1987-07-16 | Cantilever for semiconductor processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420615A JPS6420615A (en) | 1989-01-24 |
| JP2568209B2 true JP2568209B2 (en) | 1996-12-25 |
Family
ID=16030525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17741587A Expired - Fee Related JP2568209B2 (en) | 1987-07-16 | 1987-07-16 | Cantilever for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2568209B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7055702B1 (en) | 2000-06-06 | 2006-06-06 | Saint-Gobain Ceramics & Plastics, Inc. | Slip resistant horizontal semiconductor wafer boat |
| CN117170087A (en) * | 2017-11-22 | 2023-12-05 | 奇跃公司 | Thermally actuated cantilever optical scanner |
-
1987
- 1987-07-16 JP JP17741587A patent/JP2568209B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6420615A (en) | 1989-01-24 |
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