JP2599005Y2 - Wafer support boat - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer support boat used for heat treatment of a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, there is a technique in which a plurality of wafers are stored in a wafer support boat and inserted into a processing tube of a heat treatment apparatus such as a diffusion furnace or a CVD to perform a predetermined heat treatment.
A wafer support boat is generally composed of a plurality of support rods and holding members for holding the support rods at both ends, and a support portion for supporting a plurality of wafers is formed on the support rods. .

[0003]

When the wafer is heat-treated by the wafer support boat, the following problems occur as the wafer diameter increases. That is, as the wafer diameter increases, the support rod also becomes thicker, and when the wafer is inserted into the furnace at around 1200 ° C., the time for the wafer to adjust to the furnace temperature and the time for the support rod (support portion) to adjust to the furnace temperature. And as a result, a temperature difference occurs at the contact portion between the wafer and the supporting portion, and a thermal shock occurs on the wafer. The present invention has been made in order to solve such a conventional problem, and it has been made to minimize the temperature difference at a contact portion by measuring a decrease in a difference in a time at which a wafer and a support portion adapt to a furnace temperature. It is an object of the present invention to provide a wafer support boat.

[0004]

Means for Solving the Problems As means for technically solving the above problems, the present invention comprises a support rod for supporting a wafer and end members for holding both ends of the support rod. In the wafer support boat, a groove is formed in a longitudinal direction of the support rod, and a supporting portion for supporting a wafer is formed to cross the groove.

[0005]

[Operation] By forming a groove in the longitudinal direction of the support rod, the surface area is widened to make the degree of familiarity with temperature changes closer to the wafer, and there is no temperature difference between the contact portion between the wafer and the support. Prevent thermal shock of wafer during heat treatment.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a wafer support boat, which has a support rod 2 and disk-shaped upper and lower members 3 and 4 for holding both ends of the support rod 2. A holding portion 5 is provided.

The support rod 2 has a plurality of grooves 2a extending in the longitudinal direction on its inner surface side. As shown in FIG. 2, a support portion 2b for supporting the wafer across the grooves 2a is provided. They are juxtaposed at regular intervals.

The wafer support boat according to the present invention is constructed as described above, and the support portion 2 of the support rod 2 is formed in the same manner as in the prior art.
b, a plurality of wafers 6 are placed and stored in a parallel state,
The hanging unit 5 is hung and suspended in a processing tube (not shown) of a heat treatment apparatus to perform a predetermined heat treatment, and after the heat treatment, is taken out of the processing tube in a suspended state.

In such a wafer heat treatment, the support rod 2 is provided with a plurality of grooves 2a along the longitudinal direction, as described above, so that the thickness of the comb-like teeth 2c of the support 2b is increased. Becomes thinner (preferably the same as the thickness of the wafer), and the degree of adaptation (time) to the temperature in the furnace becomes substantially the same as that of the wafer. Shock can be prevented.

The wafer support boat is not limited to a suspended type as in the embodiment, but is not limited to a type supported by a lower portion or a horizontal type, although not shown in the drawings. It is possible to apply.

[0011]

[Effects of the Invention] As described above, according to the present invention,
In a wafer support boat used for heat treatment of a semiconductor wafer, a groove was formed in the longitudinal direction of the support rod, and a support portion for supporting the wafer was formed so as to cross the groove, so that a contact portion between the wafer and the support portion was formed. The thermal shock of the wafer can be prevented by minimizing the temperature difference. In particular, when the present invention is applied to a wafer support boat for storing a wafer having a large diameter, the effect is remarkable.

[Brief description of the drawings]

FIG. 1 is an external view of a wafer support boat showing one embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a portion A in FIG.

[Explanation of symbols]

1. Wafer support boat 2. Support rod 2a
Groove 2b Support 2c Comb-shaped tooth 3 Upper end member 4 Lower end member 5 Hanging part 6 Wafer

Claims (1)

(57) [Scope of request for utility model registration] 1. A wafer support boat comprising a support rod for supporting a wafer and end members for holding both ends of the support rod, a groove is formed in a longitudinal direction of the support rod, and the groove crosses the groove. A wafer supporting boat is provided with a supporting portion for supporting a wafer as described above.