JPH04304652A - Boat for heat treating device - Google Patents

Boat for heat treating device

Info

Publication number
JPH04304652A
JPH04304652A JP6836091A JP6836091A JPH04304652A JP H04304652 A JPH04304652 A JP H04304652A JP 6836091 A JP6836091 A JP 6836091A JP 6836091 A JP6836091 A JP 6836091A JP H04304652 A JPH04304652 A JP H04304652A
Authority
JP
Japan
Prior art keywords
wafer
boat
4d
physical properties
those
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6836091A
Inventor
Hiroshi Otsubo
Yoji Tsuchiyama
Original Assignee
Hitachi Ltd
Hitachi Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tokyo Electron Co Ltd filed Critical Hitachi Ltd
Priority to JP6836091A priority Critical patent/JPH04304652A/en
Publication of JPH04304652A publication Critical patent/JPH04304652A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To facilitate maintenance upon occurrence of a dislocation of a thermal stress at the time of treating a large-diameter wafer at a high temperature, damage or deformation of a wafer holder and to further prevent a local application of a load to the vicinity of the holder by employing a member in contact with the wafer, having the same physical properties as those of the wafer.
CONSTITUTION: A boat body in which a top plate 1 and a bottom plate 2 made of quartz or SiC are integrated by connecting round rods 3a, 3b, 3c of the same material by welding, of a boat used for a vertical bottom-open type heat treating device, is obtained, groove rods 4a, 4b, 4c, 4d having grooves 5a formed at a predetermined interval in a longitudinal direction and the same physical properties as those of a wafer are detachably mounted between the plates 1 and 2, and the wafer is supported to the grooves 5a of the rods 4a-4d.
COPYRIGHT: (C)1992,JPO&Japio
JP6836091A 1991-04-01 1991-04-01 Boat for heat treating device Pending JPH04304652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6836091A JPH04304652A (en) 1991-04-01 1991-04-01 Boat for heat treating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6836091A JPH04304652A (en) 1991-04-01 1991-04-01 Boat for heat treating device

Publications (1)

Publication Number Publication Date
JPH04304652A true JPH04304652A (en) 1992-10-28

Family

ID=13371553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6836091A Pending JPH04304652A (en) 1991-04-01 1991-04-01 Boat for heat treating device

Country Status (1)

Country Link
JP (1) JPH04304652A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5370142A (en) * 1992-11-10 1994-12-06 Tokyo Electron Limited Substrate washing device
WO1996028843A1 (en) * 1995-03-13 1996-09-19 Tokyo Electron Limited Heat-treating apparatus
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
JP2003521109A (en) * 1999-10-05 2003-07-08 ジーコ・プロドゥクツィオーンス−ウント・ハンデルスゲゼルシャフト・エム・ベー・ハー For semiconductor wafer holding device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5370142A (en) * 1992-11-10 1994-12-06 Tokyo Electron Limited Substrate washing device
WO1996028843A1 (en) * 1995-03-13 1996-09-19 Tokyo Electron Limited Heat-treating apparatus
US6031205A (en) * 1995-03-13 2000-02-29 Tokyo Electron Limited Thermal treatment apparatus with thermal protection members intercepting thermal radiation at or above a predetermined angle
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6276378B1 (en) 1997-08-18 2001-08-21 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
JP2003521109A (en) * 1999-10-05 2003-07-08 ジーコ・プロドゥクツィオーンス−ウント・ハンデルスゲゼルシャフト・エム・ベー・ハー For semiconductor wafer holding device

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