JPS59154017A - Furnace paddle for semiconductor wafer - Google Patents

Abstract

PURPOSE:To eliminate temperature difference between the positions of semiconductor wafers at the time of taking in and out of the semiconductor wafers to and from a heating furnace by a method wherein grooves by which semiconductor wafers are put on a heating paddle directly are provided and a slit is provided so as to separate the grooves. CONSTITUTION:A paddle 11 itself is formed so as to have circular arc shape and to the bottom of the paddle 11 grooves 6 in which semiconductor wafers 7 are put are provided perpendicular to the longitudinal direction and so as to have a circular arc shape of the bottom. A slit 12 is provided to the bottom along the longitudinal direction so as to separate these grooves 6 into two portions. A boat is not necessary for the paddle 11 composed like this and the heat capacity is reduced because the slit 12 is provided. Because the bottom of the grooves 6 has circular arc shape, heat conduction from the paddle 11 to the semiconductor wafers 7 is sufficient and due to the radiation from the furnace the temperature rise of the semiconductor wafer 7 at the bottom II is about the same as that at the top I and the temperature difference between the semiconductor wafers 7 is eliminated. While the temperature is descended, the temperature difference between the positions of the semiconductor wafers 7 is small.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a paddle for a heating furnace for semiconductor wafers used in the manufacturing process of semiconductor devices.

[Prior art]

Conventionally, when heat-treating a semiconductor wafer, the semiconductor wafer 1 was taken in and out of a heating furnace such as a furnace core tube using a paddle and a boat as shown in FIG.

As shown in Figures 1 (4) and (B), the paddle (1) is a handle (2).

Plate part (3), roller (4), and Figure 1 (C)
, As shown in (D), the boat (5) has a plurality of grooves (6
) is provided.

Conventionally, grooves and
The boat (5) carrying the semiconductor wafer (7) is set in the tray (3) of the paddle (1) in (6), and while it is set in this way, it is taken out and put into a heating furnace such as a furnace core tube (not shown). Was.

However, in the conventional paddle using such a boat, when it is inserted into the reactor core tube and when it is taken out, the paddle as shown in Fig. 1 (F
The top (I) and bottom (I) of the semiconductor wafer (7) shown in
I) had the disadvantage of generating a temperature difference.

That is, at the vertex (1), when it is put into the furnace, it is immediately heated to a high temperature due to radiation, and when it is taken out from the furnace, it is easily returned to a low temperature due to heat radiation. On the other hand, the bottom part (II) becomes hot due to the large heat capacity paddle (1) and boat (5) when it is put in, and is difficult to return to its original state when taken out.

Particular problems arise when the semiconductor wafer is placed in a furnace, and the introduction of impurities during deposition during diffusion, the diffusion depth during drive, the film thickness during oxidation, and the film thickness at C1V and D depend on the temperature of the semiconductor wafer. Because of this, temperature differences across a semiconductor wafer will cause sheet resistance, diffusion depth, and film thickness to vary significantly from location to location. Further, if the temperature changes significantly, crystal defects may occur due to thermal stress.

[Summary of the invention]

The present invention was made in view of these conventional drawbacks.
In order to prevent temperature differences depending on the location of the semiconductor wafer when loading and unloading the semiconductor wafer into the heating furnace, a groove is provided for placing the semiconductor wafer directly on the heating furnace paddle, and a slit is provided to separate the groove. By doing so, it is possible to reduce the heat capacity and the temperature difference within the semiconductor wafer due to thermal radiation.

[Embodiments of the invention]

Next, one embodiment of the present invention will be described using FIG. 2. FIGS. 2(A) and 2(B) show the paddle of the present invention, in which a semiconductor wafer (a groove (6) for applying force) is formed in the bottom of the paddle 0.11 itself formed in an arc shape in the longitudinal direction. The groove (6) is provided at right angles so that the bottom surface has an arc shape.
A slit (17J) is provided at the bottom along the length direction so as to separate the paddle. It is a dd cross-sectional view showing a state in which a force is placed on a semiconductor wafer (Ql).

Since the paddle (lll) with the above configuration does not have the conventional boat (5) shown in Fig. 1, the heat capacity decreases accordingly, and the paddle itself also has a best slit (1z) compared to the conventional paddle +11. Since the bottom of the groove (6) is arc-shaped, the heat conduction from the paddle αD to the semiconductor wafer (7) is better than in the past. 1z is provided, the temperature rise at the semiconductor wafer ((■) at the bottom of the force (in Figure 2)) due to radiation from the furnace is approximately the same as at the top (I), and the semiconductor wafer ( The paddle αυ of the present invention does not cause a temperature difference in force.Also, the large heat capacity when the temperature drops is the cause of the natural force that causes a temperature difference in the semiconductor wafer (7), but the paddle αυ of the present invention
According to the above, even when the temperature drops, the temperature difference depending on the location of the semiconductor wafer (7) becomes small.

Further, in consideration of heat conduction strength and heat capacity, silicon carbide is used as the material for the paddle (11).

, FIG. 3 shows a paddle circle according to another embodiment of the present invention, in which two slits α4 are used to further improve strength and heat capacity.

It is also possible to improve the operability by providing rollers (4) at both ends as shown in FIG.

〔Effect of the invention〕

As explained above, according to the present invention, the paddle is provided with a groove for placing the semiconductor wafer directly on it, and a slit is provided at the bottom, so that the heat capacity can be reduced and heat conduction and heat radiation can be increased, allowing for easy loading and unloading into and out of the furnace. This has the effect of reducing temperature differences depending on the location of the semiconductor wafer during processing, and making it possible to manufacture semiconductor devices with stable quality.

[Brief explanation of the drawing]

Fig. 1(3) is a plan view of a conventional paddle, Fig. 1(B) is a side view of the paddle, Fig. 1(C) is a plan view of the board,
Figure (9) is a side view of the board, Figure 1 (■) is a perspective view of the board with a semiconductor wafer mounted on the paddle, and Figure 1 (G) is f-f of Figure 1 (G)). 2(A) is a plan view of the paddle, FIG. 2(B) is a side view of the paddle, and FIG.
is a perspective view of the paddle, FIG. 2) is a cross-sectional view taken along line dd showing the state in which a semiconductor wafer is placed in FIG. 2(C), and FIGS. 3 and 4 show other embodiments of the present invention. FIG. 3 is a plan view of the paddle. +21...handle, (4)...roller, (6)...
...Groove, (force...semiconductor wafer, oI)...paddle, az/ψ...slit. Agent Shin Kuzuno −

Claims (2)

[Claims] (1) In order to heat-treat semiconductor wafers in a heating furnace, a paddle for loading and unloading a semiconductor wafer is provided with a groove on which the semiconductor wafer is placed so that the bottom surface is arcuate at right angles to the length direction, and this groove is separated. A paddle for a heating furnace for semiconductor wafers, characterized in that a slit is provided in the length direction of the paddle, and at least one set of rollers for holding the paddle is provided. (2) The paddle for a semiconductor wafer heating furnace according to claim 1, wherein the paddle is made of silicon carbide.