JPS5623784A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5623784A JPS5623784A JP9974379A JP9974379A JPS5623784A JP S5623784 A JPS5623784 A JP S5623784A JP 9974379 A JP9974379 A JP 9974379A JP 9974379 A JP9974379 A JP 9974379A JP S5623784 A JPS5623784 A JP S5623784A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- valve
- semiconductor
- substrate
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 238000000137 annealing Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 230000006698 induction Effects 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Photovoltaic Devices (AREA)
Abstract
PURPOSE:To substantially incorporate a semiconductor and an electrode into one united body by a method wherein a transparent electrode is formed on the surface of the semiconductor and then they are annealed by irradiating a laser beam or a similar high-powered optical energy. CONSTITUTION:After having formed the transparent electrode on the surface of the semiconductor, the following processes are performed to have them united in one body. Substrates 11-11'' which have been constituted as above are moved from an inlet chamber 20 to an outlet chamber 21 in a treatment chamber 23 using a loader, and the temperature inside the chamber 23 is maintained at 300-700 deg.C using a high-frequency induction furnace and a low-temperature annealing furnace 25 provided in the chamber 23. At the same time, H2 is run out from a valve 15, He from a valve 16 and HCl from a valve 17 and they are discharged by a vacuum pump 19 through an intermediate of a needle valve 18. Thus, the substrate 11 is heated, the laser beam emitted from a laser device 12, provided outside the chamber 23, is irradiated to the substrate 11 through a medium of a mirror 13 and a low- temperature annealing is performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9974379A JPS5623784A (en) | 1979-08-05 | 1979-08-05 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9974379A JPS5623784A (en) | 1979-08-05 | 1979-08-05 | Manufacture of semiconductor device |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60124788A Division JPS6150329A (en) | 1985-06-07 | 1985-06-07 | Manufacture of semiconductor device |
JP3033679A Division JPH04211130A (en) | 1991-02-01 | 1991-02-01 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5623784A true JPS5623784A (en) | 1981-03-06 |
JPH0338756B2 JPH0338756B2 (en) | 1991-06-11 |
Family
ID=14255487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9974379A Granted JPS5623784A (en) | 1979-08-05 | 1979-08-05 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5623784A (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59144122A (en) * | 1983-02-08 | 1984-08-18 | Seiko Epson Corp | Optical annealing method |
JPS59154079A (en) * | 1983-02-22 | 1984-09-03 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion semiconductor device |
JPS59155974A (en) * | 1983-02-25 | 1984-09-05 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric converter |
JPS60224282A (en) * | 1984-04-20 | 1985-11-08 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS60227484A (en) * | 1984-04-26 | 1985-11-12 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion semiconductor device |
JPS6158276A (en) * | 1984-08-29 | 1986-03-25 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS61231771A (en) * | 1985-04-05 | 1986-10-16 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6246514A (en) * | 1985-08-24 | 1987-02-28 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6247116A (en) * | 1985-08-26 | 1987-02-28 | Semiconductor Energy Lab Co Ltd | Semiconductor device manufacturing equipment |
JPS6251210A (en) * | 1985-08-30 | 1987-03-05 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6252924A (en) * | 1985-09-01 | 1987-03-07 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6254422A (en) * | 1985-08-08 | 1987-03-10 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6254448A (en) * | 1985-08-02 | 1987-03-10 | Semiconductor Energy Lab Co Ltd | Measurement for semiconductor device |
JPS6269608A (en) * | 1985-09-24 | 1987-03-30 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPH0263817A (en) * | 1988-08-31 | 1990-03-05 | Naigai Kaaboninki Kk | Processing method of tack label paper |
JPH03212976A (en) * | 1990-01-18 | 1991-09-18 | Agency Of Ind Science & Technol | Treatment method of cis structure containing transparent conductive oxide film |
JPH03227575A (en) * | 1990-09-14 | 1991-10-08 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device |
-
1979
- 1979-08-05 JP JP9974379A patent/JPS5623784A/en active Granted
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59144122A (en) * | 1983-02-08 | 1984-08-18 | Seiko Epson Corp | Optical annealing method |
JPS59154079A (en) * | 1983-02-22 | 1984-09-03 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion semiconductor device |
JPH0570311B2 (en) * | 1983-02-22 | 1993-10-04 | Handotai Energy Kenkyusho | |
JPS59155974A (en) * | 1983-02-25 | 1984-09-05 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric converter |
JPS60224282A (en) * | 1984-04-20 | 1985-11-08 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS60227484A (en) * | 1984-04-26 | 1985-11-12 | Semiconductor Energy Lab Co Ltd | Manufacture of photoelectric conversion semiconductor device |
JPS6158276A (en) * | 1984-08-29 | 1986-03-25 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS61231771A (en) * | 1985-04-05 | 1986-10-16 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6254448A (en) * | 1985-08-02 | 1987-03-10 | Semiconductor Energy Lab Co Ltd | Measurement for semiconductor device |
JPS6254422A (en) * | 1985-08-08 | 1987-03-10 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6246514A (en) * | 1985-08-24 | 1987-02-28 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6247116A (en) * | 1985-08-26 | 1987-02-28 | Semiconductor Energy Lab Co Ltd | Semiconductor device manufacturing equipment |
JPS6251210A (en) * | 1985-08-30 | 1987-03-05 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6252924A (en) * | 1985-09-01 | 1987-03-07 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPS6269608A (en) * | 1985-09-24 | 1987-03-30 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor device |
JPH0263817A (en) * | 1988-08-31 | 1990-03-05 | Naigai Kaaboninki Kk | Processing method of tack label paper |
JPH03212976A (en) * | 1990-01-18 | 1991-09-18 | Agency Of Ind Science & Technol | Treatment method of cis structure containing transparent conductive oxide film |
JPH03227575A (en) * | 1990-09-14 | 1991-10-08 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device |
JPH0558271B2 (en) * | 1990-09-14 | 1993-08-26 | Handotai Energy Kenkyusho |
Also Published As
Publication number | Publication date |
---|---|
JPH0338756B2 (en) | 1991-06-11 |
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