JPS56166255A - Epoxy resin composition for pressure molding - Google Patents
Epoxy resin composition for pressure moldingInfo
- Publication number
- JPS56166255A JPS56166255A JP6955680A JP6955680A JPS56166255A JP S56166255 A JPS56166255 A JP S56166255A JP 6955680 A JP6955680 A JP 6955680A JP 6955680 A JP6955680 A JP 6955680A JP S56166255 A JPS56166255 A JP S56166255A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- particle diameter
- liquid epoxy
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 238000000465 moulding Methods 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 13
- 239000000945 filler Substances 0.000 abstract 6
- 239000002245 particle Substances 0.000 abstract 4
- 239000000377 silicon dioxide Substances 0.000 abstract 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000004576 sand Substances 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000002440 hydroxy compounds Chemical class 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955680A JPS56166255A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition for pressure molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955680A JPS56166255A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition for pressure molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56166255A true JPS56166255A (en) | 1981-12-21 |
| JPS6144109B2 JPS6144109B2 (enrdf_load_stackoverflow) | 1986-10-01 |
Family
ID=13406126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6955680A Granted JPS56166255A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition for pressure molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56166255A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626655A (ja) * | 1992-07-07 | 1994-02-04 | Matsushita Electric Ind Co Ltd | 高周波加熱装置 |
| JP5206323B2 (ja) * | 2008-10-31 | 2013-06-12 | パナソニック株式会社 | モールドモータ |
-
1980
- 1980-05-27 JP JP6955680A patent/JPS56166255A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6144109B2 (enrdf_load_stackoverflow) | 1986-10-01 |
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