JPS56147446A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS56147446A
JPS56147446A JP5085780A JP5085780A JPS56147446A JP S56147446 A JPS56147446 A JP S56147446A JP 5085780 A JP5085780 A JP 5085780A JP 5085780 A JP5085780 A JP 5085780A JP S56147446 A JPS56147446 A JP S56147446A
Authority
JP
Japan
Prior art keywords
layer
active region
carriers
substrate
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5085780A
Other languages
English (en)
Other versions
JPS6346980B2 (ja
Inventor
Mototaka Kamoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5085780A priority Critical patent/JPS56147446A/ja
Publication of JPS56147446A publication Critical patent/JPS56147446A/ja
Publication of JPS6346980B2 publication Critical patent/JPS6346980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
JP5085780A 1980-04-17 1980-04-17 Semiconductor integrated circuit device Granted JPS56147446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5085780A JPS56147446A (en) 1980-04-17 1980-04-17 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5085780A JPS56147446A (en) 1980-04-17 1980-04-17 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS56147446A true JPS56147446A (en) 1981-11-16
JPS6346980B2 JPS6346980B2 (ja) 1988-09-20

Family

ID=12870386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5085780A Granted JPS56147446A (en) 1980-04-17 1980-04-17 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS56147446A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212162A (ja) * 1982-06-03 1983-12-09 Matsushita Electronics Corp 半導体装置およびその製造方法
JPS5954271A (ja) * 1982-09-21 1984-03-29 Agency Of Ind Science & Technol 半導体集積回路装置
JP2008096860A (ja) * 2006-10-16 2008-04-24 Kyocera Mita Corp 画像形成装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2543709A1 (en) 2010-03-03 2013-01-09 Nitto Denko Corporation Electrically conductive adhesive tape

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129591A (en) * 1977-04-18 1978-11-11 Fujitsu Ltd Production of semiconductor device
JPS5431272A (en) * 1977-08-12 1979-03-08 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129591A (en) * 1977-04-18 1978-11-11 Fujitsu Ltd Production of semiconductor device
JPS5431272A (en) * 1977-08-12 1979-03-08 Nec Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212162A (ja) * 1982-06-03 1983-12-09 Matsushita Electronics Corp 半導体装置およびその製造方法
JPS5954271A (ja) * 1982-09-21 1984-03-29 Agency Of Ind Science & Technol 半導体集積回路装置
JP2008096860A (ja) * 2006-10-16 2008-04-24 Kyocera Mita Corp 画像形成装置

Also Published As

Publication number Publication date
JPS6346980B2 (ja) 1988-09-20

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