JPS56130940A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56130940A JPS56130940A JP3364680A JP3364680A JPS56130940A JP S56130940 A JPS56130940 A JP S56130940A JP 3364680 A JP3364680 A JP 3364680A JP 3364680 A JP3364680 A JP 3364680A JP S56130940 A JPS56130940 A JP S56130940A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- forming region
- oxide
- field oxide
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W10/0121—
-
- H10W10/13—
Landscapes
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3364680A JPS56130940A (en) | 1980-03-17 | 1980-03-17 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3364680A JPS56130940A (en) | 1980-03-17 | 1980-03-17 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56130940A true JPS56130940A (en) | 1981-10-14 |
| JPS6310898B2 JPS6310898B2 (cg-RX-API-DMAC10.html) | 1988-03-10 |
Family
ID=12392201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3364680A Granted JPS56130940A (en) | 1980-03-17 | 1980-03-17 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56130940A (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127344A (ja) * | 1982-01-26 | 1983-07-29 | Seiko Epson Corp | 半導体装置の製造方法 |
| JPS58145145A (ja) * | 1982-02-22 | 1983-08-29 | Mitsubishi Electric Corp | 半導体装置の素子間分離絶縁膜の形成方法 |
| JPH02119137A (ja) * | 1988-10-27 | 1990-05-07 | Nec Corp | 半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5429573A (en) * | 1977-08-10 | 1979-03-05 | Hitachi Ltd | Fine machining method of semiconductor |
-
1980
- 1980-03-17 JP JP3364680A patent/JPS56130940A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5429573A (en) * | 1977-08-10 | 1979-03-05 | Hitachi Ltd | Fine machining method of semiconductor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127344A (ja) * | 1982-01-26 | 1983-07-29 | Seiko Epson Corp | 半導体装置の製造方法 |
| JPS58145145A (ja) * | 1982-02-22 | 1983-08-29 | Mitsubishi Electric Corp | 半導体装置の素子間分離絶縁膜の形成方法 |
| JPH02119137A (ja) * | 1988-10-27 | 1990-05-07 | Nec Corp | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6310898B2 (cg-RX-API-DMAC10.html) | 1988-03-10 |
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