JPS556868A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS556868A
JPS556868A JP7953578A JP7953578A JPS556868A JP S556868 A JPS556868 A JP S556868A JP 7953578 A JP7953578 A JP 7953578A JP 7953578 A JP7953578 A JP 7953578A JP S556868 A JPS556868 A JP S556868A
Authority
JP
Japan
Prior art keywords
electrodes
group
belonging
outside
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7953578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6115587B2 (en, 2012
Inventor
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7953578A priority Critical patent/JPS556868A/ja
Publication of JPS556868A publication Critical patent/JPS556868A/ja
Publication of JPS6115587B2 publication Critical patent/JPS6115587B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7953578A 1978-06-29 1978-06-29 Semiconductor device Granted JPS556868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7953578A JPS556868A (en) 1978-06-29 1978-06-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7953578A JPS556868A (en) 1978-06-29 1978-06-29 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS556868A true JPS556868A (en) 1980-01-18
JPS6115587B2 JPS6115587B2 (en, 2012) 1986-04-24

Family

ID=13692680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7953578A Granted JPS556868A (en) 1978-06-29 1978-06-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS556868A (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor
JPS5773957A (en) * 1980-10-27 1982-05-08 Nec Corp Internal connection structure for multi-terminal package
JPH0195539A (ja) * 1987-10-07 1989-04-13 Toshiba Corp 半導体装置及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6521019B2 (ja) 2017-10-03 2019-05-29 マツダ株式会社 多段自動変速機付車両の制御装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor
JPS5773957A (en) * 1980-10-27 1982-05-08 Nec Corp Internal connection structure for multi-terminal package
JPH0195539A (ja) * 1987-10-07 1989-04-13 Toshiba Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS6115587B2 (en, 2012) 1986-04-24

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