JPS5456365A - Glass sealed type semiconductor device - Google Patents

Glass sealed type semiconductor device

Info

Publication number
JPS5456365A
JPS5456365A JP12237677A JP12237677A JPS5456365A JP S5456365 A JPS5456365 A JP S5456365A JP 12237677 A JP12237677 A JP 12237677A JP 12237677 A JP12237677 A JP 12237677A JP S5456365 A JPS5456365 A JP S5456365A
Authority
JP
Japan
Prior art keywords
lead wires
studs
copper layer
thick copper
cores
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12237677A
Other languages
Japanese (ja)
Inventor
Hajime Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12237677A priority Critical patent/JPS5456365A/en
Publication of JPS5456365A publication Critical patent/JPS5456365A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce bends of lead wires, make bonding of studs and lead wires sure, reduce thermal resistance and make possible the use under high voltage by so constructing the lead wires that iron wire base cores are covered with a sufficiently thick copper layer.
CONSTITUTION: In the glass sealed semiconductor device comprising sealing a semiconductor element 1 by a glass tube 3 in the state of being held between two studs 2 and leading out lead wires 4 from the respectice studs 2, the lead wires 4 are so constructed that their iron wire base cores 5 are covered with a sufficiently thick copper layer 6. And the ratio of the iron wire base core 5 and the thick copper layer 6 to cover in the construction of said lead wires 4 is made 1:2. A wire of iron base of low heat conductivity is employed for the cores 5 of the lead wires 4 so that welding heat by resistacne welding is made liable to be evolved and the bonding between the studs 2 and lead wires 4 is made sure
COPYRIGHT: (C)1979,JPO&Japio
JP12237677A 1977-10-14 1977-10-14 Glass sealed type semiconductor device Pending JPS5456365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12237677A JPS5456365A (en) 1977-10-14 1977-10-14 Glass sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12237677A JPS5456365A (en) 1977-10-14 1977-10-14 Glass sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5456365A true JPS5456365A (en) 1979-05-07

Family

ID=14834297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12237677A Pending JPS5456365A (en) 1977-10-14 1977-10-14 Glass sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5456365A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596665A (en) * 1979-01-19 1980-07-23 Totoku Electric Co Ltd Lead component for semiconductor element
JPS5821361A (en) * 1981-07-29 1983-02-08 Nec Home Electronics Ltd Diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596665A (en) * 1979-01-19 1980-07-23 Totoku Electric Co Ltd Lead component for semiconductor element
JPS5821361A (en) * 1981-07-29 1983-02-08 Nec Home Electronics Ltd Diode

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