JPS5352068A - Production of semicoductor unit - Google Patents
Production of semicoductor unitInfo
- Publication number
- JPS5352068A JPS5352068A JP12623376A JP12623376A JPS5352068A JP S5352068 A JPS5352068 A JP S5352068A JP 12623376 A JP12623376 A JP 12623376A JP 12623376 A JP12623376 A JP 12623376A JP S5352068 A JPS5352068 A JP S5352068A
- Authority
- JP
- Japan
- Prior art keywords
- semicoductor
- production
- unit
- glass
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: Holes are opened in a heat-proof insulating plate, and glass is filled up in these holes and is softened by heating. Then, a hand-drum-shaped metallic split is laid in glass to form a relaying point, and the lead wire of a semiconductor chip is taken out to the outside through this relaying point, so that a piece of the conductive path with a good thermal conductivity can be fitted.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12623376A JPS5352068A (en) | 1976-10-22 | 1976-10-22 | Production of semicoductor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12623376A JPS5352068A (en) | 1976-10-22 | 1976-10-22 | Production of semicoductor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5352068A true JPS5352068A (en) | 1978-05-12 |
Family
ID=14930068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12623376A Pending JPS5352068A (en) | 1976-10-22 | 1976-10-22 | Production of semicoductor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5352068A (en) |
-
1976
- 1976-10-22 JP JP12623376A patent/JPS5352068A/en active Pending
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