JPS6115587B2 - - Google Patents
Info
- Publication number
- JPS6115587B2 JPS6115587B2 JP53079535A JP7953578A JPS6115587B2 JP S6115587 B2 JPS6115587 B2 JP S6115587B2 JP 53079535 A JP53079535 A JP 53079535A JP 7953578 A JP7953578 A JP 7953578A JP S6115587 B2 JPS6115587 B2 JP S6115587B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- external
- group
- external lead
- electrode group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 11
- 238000000605 extraction Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7953578A JPS556868A (en) | 1978-06-29 | 1978-06-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7953578A JPS556868A (en) | 1978-06-29 | 1978-06-29 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS556868A JPS556868A (en) | 1980-01-18 |
| JPS6115587B2 true JPS6115587B2 (en, 2012) | 1986-04-24 |
Family
ID=13692680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7953578A Granted JPS556868A (en) | 1978-06-29 | 1978-06-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS556868A (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019069843A1 (ja) | 2017-10-03 | 2019-04-11 | マツダ株式会社 | 多段自動変速機付車両の制御装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524479A (en) * | 1978-08-09 | 1980-02-21 | Nec Corp | Semiconductor |
| JPS5773957A (en) * | 1980-10-27 | 1982-05-08 | Nec Corp | Internal connection structure for multi-terminal package |
| JPH0638417B2 (ja) * | 1987-10-07 | 1994-05-18 | 株式会社東芝 | 半導体装置 |
-
1978
- 1978-06-29 JP JP7953578A patent/JPS556868A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019069843A1 (ja) | 2017-10-03 | 2019-04-11 | マツダ株式会社 | 多段自動変速機付車両の制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS556868A (en) | 1980-01-18 |
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