JPS556816A - Semiconductor pressure converter - Google Patents

Semiconductor pressure converter

Info

Publication number
JPS556816A
JPS556816A JP7845178A JP7845178A JPS556816A JP S556816 A JPS556816 A JP S556816A JP 7845178 A JP7845178 A JP 7845178A JP 7845178 A JP7845178 A JP 7845178A JP S556816 A JPS556816 A JP S556816A
Authority
JP
Japan
Prior art keywords
pressure
receiving base
pressure receiving
metal frame
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7845178A
Other languages
Japanese (ja)
Other versions
JPS6153875B2 (en
Inventor
Masayuki Matsui
Atsushi Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Priority to JP7845178A priority Critical patent/JPS556816A/en
Publication of JPS556816A publication Critical patent/JPS556816A/en
Publication of JPS6153875B2 publication Critical patent/JPS6153875B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

PURPOSE: To eliminate the airtight leakage at the bonded section and remove the deformation due to pressure and temperature by bonding between the pressure receiving base and the metal frame of a silicone diaphragm pressure converter with solder.
CONSTITUTION: A pressure-sensitive silicone element 1 is bonded on a pressure receiving base 2 made of crystal glass similar in the coefficient of thermal expansion to silicone with a low melting point glass. To bond the pressure receiving base 2 and the metal frame 4, a plated layer 3 of the pressure receiving base 2 is laid on a soldered layer 12 formed on a projection provided around a pressure introducing hole 19 of the metal frame 4 and heated up to 200 to 250°C. The bonded section thus obtained is almost free from residual strain even when returned to the room temperature after the soldering. It can be kept airtight because of chemical and gas proofing.
COPYRIGHT: (C)1980,JPO&Japio
JP7845178A 1978-06-28 1978-06-28 Semiconductor pressure converter Granted JPS556816A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7845178A JPS556816A (en) 1978-06-28 1978-06-28 Semiconductor pressure converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7845178A JPS556816A (en) 1978-06-28 1978-06-28 Semiconductor pressure converter

Publications (2)

Publication Number Publication Date
JPS556816A true JPS556816A (en) 1980-01-18
JPS6153875B2 JPS6153875B2 (en) 1986-11-19

Family

ID=13662393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7845178A Granted JPS556816A (en) 1978-06-28 1978-06-28 Semiconductor pressure converter

Country Status (1)

Country Link
JP (1) JPS556816A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000241274A (en) * 1999-02-23 2000-09-08 Matsushita Electric Works Ltd Semiconductor pressure sensor, manufacture thereof and parts thereof
JP2001272287A (en) * 2000-03-27 2001-10-05 Tadahiro Kato Strain-detecting sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000241274A (en) * 1999-02-23 2000-09-08 Matsushita Electric Works Ltd Semiconductor pressure sensor, manufacture thereof and parts thereof
JP2001272287A (en) * 2000-03-27 2001-10-05 Tadahiro Kato Strain-detecting sensor

Also Published As

Publication number Publication date
JPS6153875B2 (en) 1986-11-19

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