JPS5451490A - Semiconductor pressure converter - Google Patents

Semiconductor pressure converter

Info

Publication number
JPS5451490A
JPS5451490A JP11753977A JP11753977A JPS5451490A JP S5451490 A JPS5451490 A JP S5451490A JP 11753977 A JP11753977 A JP 11753977A JP 11753977 A JP11753977 A JP 11753977A JP S5451490 A JPS5451490 A JP S5451490A
Authority
JP
Japan
Prior art keywords
substrate
bonding layer
pressure
bonding
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11753977A
Other languages
Japanese (ja)
Inventor
Shunji Shiromizu
Susumu Kimijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11753977A priority Critical patent/JPS5451490A/en
Publication of JPS5451490A publication Critical patent/JPS5451490A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

PURPOSE: To reduce the error due to hydro static pressure, by avoiding the swelling of the bonding layer at the side circumference of the substrate through the reduced bonding area of the fixed base than the external size of the pressure converting substrate.
CONSTITUTION: The diaphragm 2 thin in thickenss is formed at the center of the N type Si singlecrystal substrate 1, and it is covered with the insulation layer 4. Next, opening is placed at the diaphragm 2 and the P type resistive layres 31 and 32 are formed by diffusion and after coating the Al electrode wiring layar 5 on it, the leads 6 are bonded. The thick part at the circumference of the pressure conversion substrate 17 thus constituted is heated and fixed via the bonding layer 18 consisting of galss powder on the fixed base 19 of Si. At this time, the bonding edge surface is made smaller than the external diameter of the pressure converting substrate 17. Thus, no bonding layer 18 is swelled up on the side surface of the substrate 17, and the stress based on the difference of thermal expandion rate between the bonding layer 18 and the substrate 17 is operated from external circumferenc to the substrate 17, and the error due to hydrostatic pressure is made very small
COPYRIGHT: (C)1979,JPO&Japio
JP11753977A 1977-09-30 1977-09-30 Semiconductor pressure converter Pending JPS5451490A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11753977A JPS5451490A (en) 1977-09-30 1977-09-30 Semiconductor pressure converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11753977A JPS5451490A (en) 1977-09-30 1977-09-30 Semiconductor pressure converter

Publications (1)

Publication Number Publication Date
JPS5451490A true JPS5451490A (en) 1979-04-23

Family

ID=14714289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11753977A Pending JPS5451490A (en) 1977-09-30 1977-09-30 Semiconductor pressure converter

Country Status (1)

Country Link
JP (1) JPS5451490A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856476A (en) * 1981-09-30 1983-04-04 Toshiba Corp Semiconductor pressure converter
JPS58106955U (en) * 1982-01-18 1983-07-21 株式会社東芝 Semiconductor pressure transducer
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
JPH0740U (en) * 1993-03-19 1995-01-06 瑞枝 佐藤 Cat shower hat
US6084257A (en) * 1995-05-24 2000-07-04 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures
US6316796B1 (en) 1995-05-24 2001-11-13 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856476A (en) * 1981-09-30 1983-04-04 Toshiba Corp Semiconductor pressure converter
JPS58106955U (en) * 1982-01-18 1983-07-21 株式会社東芝 Semiconductor pressure transducer
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
JPH0740U (en) * 1993-03-19 1995-01-06 瑞枝 佐藤 Cat shower hat
US6084257A (en) * 1995-05-24 2000-07-04 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures
US6316796B1 (en) 1995-05-24 2001-11-13 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures

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