JPS57171235A - Semiconductor pressure converter - Google Patents

Semiconductor pressure converter

Info

Publication number
JPS57171235A
JPS57171235A JP5672581A JP5672581A JPS57171235A JP S57171235 A JPS57171235 A JP S57171235A JP 5672581 A JP5672581 A JP 5672581A JP 5672581 A JP5672581 A JP 5672581A JP S57171235 A JPS57171235 A JP S57171235A
Authority
JP
Japan
Prior art keywords
semiconductor pressure
base
pressure converter
pellet
massproduce
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5672581A
Other languages
Japanese (ja)
Inventor
Shunji Shiromizu
Shozo Sato
Ryuzo Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5672581A priority Critical patent/JPS57171235A/en
Publication of JPS57171235A publication Critical patent/JPS57171235A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/147Details about the mounting of the sensor to support or covering means

Abstract

PURPOSE:To obtain a semiconductor pressure converter easy to massproduce with a limited zero point variation by the temperature by setting the ratio of thickness between a base and the peripheral section of a pressure sensitive pellet making up a semiconductor pressure converter by bonding within a specified range. CONSTITUTION:A base 23 made of Si material is securely bonded on a pressure-sensitive pellet 21 equipped with a diffused strain resistance gauge 22 on a diaphragm surface with a solder glass. The base is securely bonded on a package 24 made of ceramic or the like to form a semiconductor pressure detector. When the thickness (d) of the base 23 is set 1.5-4 times as large as that (a) of the peripheral section of the pellet 21, the zero point variation by the temperature can be minimized even when the thermal expansion coefficient of the package is larger than that of the silicone of the pellet. This provides a semiconductor pressure converter easy to massproduce with a better temperature characteristics.
JP5672581A 1981-04-15 1981-04-15 Semiconductor pressure converter Pending JPS57171235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5672581A JPS57171235A (en) 1981-04-15 1981-04-15 Semiconductor pressure converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5672581A JPS57171235A (en) 1981-04-15 1981-04-15 Semiconductor pressure converter

Publications (1)

Publication Number Publication Date
JPS57171235A true JPS57171235A (en) 1982-10-21

Family

ID=13035464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5672581A Pending JPS57171235A (en) 1981-04-15 1981-04-15 Semiconductor pressure converter

Country Status (1)

Country Link
JP (1) JPS57171235A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427635U (en) * 1987-08-11 1989-02-17
JP2021502553A (en) * 2017-11-08 2021-01-28 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag Pressure sensor system with protection against frozen media

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50108975A (en) * 1974-02-01 1975-08-27
JPS50147293A (en) * 1974-05-15 1975-11-26
JPS5219091A (en) * 1975-08-02 1977-01-14 Nippon Denso Co Ltd Semiconductor pressure-electricity converter
JPS5734372A (en) * 1980-08-09 1982-02-24 Nippon Denso Co Ltd Semiconductor pressure transducer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50108975A (en) * 1974-02-01 1975-08-27
JPS50147293A (en) * 1974-05-15 1975-11-26
JPS5219091A (en) * 1975-08-02 1977-01-14 Nippon Denso Co Ltd Semiconductor pressure-electricity converter
JPS5734372A (en) * 1980-08-09 1982-02-24 Nippon Denso Co Ltd Semiconductor pressure transducer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427635U (en) * 1987-08-11 1989-02-17
JP2021502553A (en) * 2017-11-08 2021-01-28 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag Pressure sensor system with protection against frozen media
US11561146B2 (en) 2017-11-08 2023-01-24 Tdk Electronics Ag Pressure sensor system having protection against freezing medium

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