JPS54154973A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS54154973A JPS54154973A JP6341278A JP6341278A JPS54154973A JP S54154973 A JPS54154973 A JP S54154973A JP 6341278 A JP6341278 A JP 6341278A JP 6341278 A JP6341278 A JP 6341278A JP S54154973 A JPS54154973 A JP S54154973A
- Authority
- JP
- Japan
- Prior art keywords
- junction
- pni
- copper disk
- buffer plate
- heat buffer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To secure junction between the copper disk and the heat buffer plate with no use of the expensive silver solder material but by using PNi between the copper disk and the buffer plate.
CONSTITUTION: When joining the copper disk with the heat buffer plate, the plating of PNi (P: 3W15wt%) is applied to either of them. Then, heat buffer plate 5 is pressed to copper disk 2 about 25gr/mm and then joined together through the furnace of 1000°C. The adhesive performance is increased and the gas is exhausted by the pressure to improve the wetting property and thus secure good junction. Thus, the PNi solder material which could not be used so far can be soldered with pressure, reducing down the material cost. Furthermore, the PNi junction material is used like the junction between flange 1 and the copper disk, and as a result the temperature becomes identical within the furnace to complete the process with just one junction.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6341278A JPS54154973A (en) | 1978-05-29 | 1978-05-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6341278A JPS54154973A (en) | 1978-05-29 | 1978-05-29 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54154973A true JPS54154973A (en) | 1979-12-06 |
Family
ID=13228541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6341278A Pending JPS54154973A (en) | 1978-05-29 | 1978-05-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54154973A (en) |
-
1978
- 1978-05-29 JP JP6341278A patent/JPS54154973A/en active Pending
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