JPS5446467A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5446467A JPS5446467A JP11212277A JP11212277A JPS5446467A JP S5446467 A JPS5446467 A JP S5446467A JP 11212277 A JP11212277 A JP 11212277A JP 11212277 A JP11212277 A JP 11212277A JP S5446467 A JPS5446467 A JP S5446467A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- compound
- lower electrode
- thermal expansivity
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
- Thyristors (AREA)
Abstract
PURPOSE: To reduce the cose by eliminating the need of expensive W, No, etc., by brazing of forming either or both the upper electrode and lower electrode to be provided to a flat semiconductor device by using a compound of Cu-C fiber nearly equal in thermal expansivity to Si.
CONSTITUTION: The Si substrate provided with the element region is sandwiched between upper elecrrode 1A and lower electrode 2A and then brazed first, they are inserted into cylindrical insulation seal 8 through positioning guide rings 10, and seal 8 and electrodes 1A and 2A are fixed by flange 9. At this time, both electrodes 1A and 2A, or either one is formed of a compound of Cu-C fiber. Selecting a compounding ratio between Cu and C at this time enables its thermal expansivity to approximate to that of Si, and stress upon the Si substrate becomes small. In addition, its cost decreases, lightweight device is realized, and the fabrication is simplified
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11212277A JPS5841770B2 (en) | 1977-09-20 | 1977-09-20 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11212277A JPS5841770B2 (en) | 1977-09-20 | 1977-09-20 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5446467A true JPS5446467A (en) | 1979-04-12 |
JPS5841770B2 JPS5841770B2 (en) | 1983-09-14 |
Family
ID=14578730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11212277A Expired JPS5841770B2 (en) | 1977-09-20 | 1977-09-20 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5841770B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62152464U (en) * | 1986-03-19 | 1987-09-28 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60213681A (en) * | 1984-04-06 | 1985-10-25 | 三菱電機株式会社 | Hydraulic elevator device |
-
1977
- 1977-09-20 JP JP11212277A patent/JPS5841770B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62152464U (en) * | 1986-03-19 | 1987-09-28 |
Also Published As
Publication number | Publication date |
---|---|
JPS5841770B2 (en) | 1983-09-14 |
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