JPS561328A - Semiconductor pressure converter - Google Patents

Semiconductor pressure converter

Info

Publication number
JPS561328A
JPS561328A JP7678879A JP7678879A JPS561328A JP S561328 A JPS561328 A JP S561328A JP 7678879 A JP7678879 A JP 7678879A JP 7678879 A JP7678879 A JP 7678879A JP S561328 A JPS561328 A JP S561328A
Authority
JP
Japan
Prior art keywords
printed board
gauge block
thick film
gauge
amplifying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7678879A
Other languages
Japanese (ja)
Inventor
Minoru Takahashi
Tomotsugu Inui
Hitoshi Minorikawa
Kaoru Uchiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7678879A priority Critical patent/JPS561328A/en
Publication of JPS561328A publication Critical patent/JPS561328A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

PURPOSE: To improve the operation efficiency of a semiconductor pressure converter by installing a medium for connecting a gauge block and an amplifying thick film printed board to each other, and using a lead frame as the electrical junction of the gauge block and the printed board.
CONSTITUTION: A semiconductor distorsion gauge 1 is joined with a die 2, attached to a pipe 3 by using silicon adhesive, and secured to a distributing thick film printed board 5 by adhesion. The printed circuit 5 is provided with a long-legged lead 6 to form a gauge block 12. Since the printed board 5 is located separately above an amplifying thick film printed board 7, and heat transmission from an approximately 230°C solder basin in reflow soldering is limited to the lead frame 6, worsening due to the heat of adhesives can be prevented. The constitution permits the gauge block 12 and the printed board 7 to be soldered by reflow at the same time, so that the operation efficiency can be greatly improved.
COPYRIGHT: (C)1981,JPO&Japio
JP7678879A 1979-06-20 1979-06-20 Semiconductor pressure converter Pending JPS561328A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7678879A JPS561328A (en) 1979-06-20 1979-06-20 Semiconductor pressure converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7678879A JPS561328A (en) 1979-06-20 1979-06-20 Semiconductor pressure converter

Publications (1)

Publication Number Publication Date
JPS561328A true JPS561328A (en) 1981-01-09

Family

ID=13615347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7678879A Pending JPS561328A (en) 1979-06-20 1979-06-20 Semiconductor pressure converter

Country Status (1)

Country Link
JP (1) JPS561328A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763787A (en) * 1996-09-05 1998-06-09 Rosemont Inc. Carrier assembly for fluid sensor
GB2470141B (en) * 2008-02-01 2012-03-14 Custom Sensors & Technologies Inc Integrated cavity in PCB pressure sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763787A (en) * 1996-09-05 1998-06-09 Rosemont Inc. Carrier assembly for fluid sensor
GB2470141B (en) * 2008-02-01 2012-03-14 Custom Sensors & Technologies Inc Integrated cavity in PCB pressure sensor

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