JPS5478971A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS5478971A JPS5478971A JP14669077A JP14669077A JPS5478971A JP S5478971 A JPS5478971 A JP S5478971A JP 14669077 A JP14669077 A JP 14669077A JP 14669077 A JP14669077 A JP 14669077A JP S5478971 A JPS5478971 A JP S5478971A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- grooves
- metal plate
- solder material
- support metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To reduce the bending of semiconductor element and to increase the yield rate and reliability, by forming a number of grooves on the surface in contact with the semiconductor substrate of the support metal plate supporting the semiconductor substrate and fixing them with the solder material.
CONSTITUTION: On the surface in contact with the semiconductor substrate 1 with the support metal plate 4, a number of grooves 5 of square shape are concentricly formed. The solder material 2 is entered to the grooves and the semiconductor substrate 1 and the support metal plate 4 are soldered. With this construction, with the bimetal operation due to the difference of the thermal expansion rate slightly between the substrate 1 and the metal plate 4, even if bending is taken place, the stress to the substrate 1 is absorbed with the distortion of the part of the circumference of the grooves 5 of the metal plate 4 and further, it is absorbed in the layer of the solder material 2. Since the stress is dispersed to the semiconductor substrate 1, support metal 4 and the layer of solder material 2, the force acting as the distortion to the crystal lattice of the semiconductor substrate is extremely slight. The grooves can be formed in link, lattice, sectionally triangle and wave shape.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14669077A JPS5478971A (en) | 1977-12-06 | 1977-12-06 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14669077A JPS5478971A (en) | 1977-12-06 | 1977-12-06 | Semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5478971A true JPS5478971A (en) | 1979-06-23 |
Family
ID=15413360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14669077A Pending JPS5478971A (en) | 1977-12-06 | 1977-12-06 | Semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5478971A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100126419A1 (en) * | 2008-11-27 | 2010-05-27 | Samsung Led Co., Ltd. | Susceptor for cvd apparatus and cvd apparatus including the same |
JP2015144228A (en) * | 2013-12-24 | 2015-08-06 | アイシン精機株式会社 | semiconductor device |
-
1977
- 1977-12-06 JP JP14669077A patent/JPS5478971A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100126419A1 (en) * | 2008-11-27 | 2010-05-27 | Samsung Led Co., Ltd. | Susceptor for cvd apparatus and cvd apparatus including the same |
JP2015144228A (en) * | 2013-12-24 | 2015-08-06 | アイシン精機株式会社 | semiconductor device |
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