JPS5480074A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5480074A JPS5480074A JP14788177A JP14788177A JPS5480074A JP S5480074 A JPS5480074 A JP S5480074A JP 14788177 A JP14788177 A JP 14788177A JP 14788177 A JP14788177 A JP 14788177A JP S5480074 A JPS5480074 A JP S5480074A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plate
- spiral
- spring
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To lessen the stress applied to the substrate by proviing the spiral notch to the reinforcing support plate.
CONSTITUTION: When spiral notch 6 is given to Mo plate 5, a spiral spring is formed theoretically. Accordingly, Mo plate 5 soldered at the lower surface of substrate 1 absorbs the heat expansion with the spring when substrate 1 is expanded with heat, thus avoiding deterioration of the adverse dielectric strength characteristics.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14788177A JPS5480074A (en) | 1977-12-08 | 1977-12-08 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14788177A JPS5480074A (en) | 1977-12-08 | 1977-12-08 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5480074A true JPS5480074A (en) | 1979-06-26 |
Family
ID=15440318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14788177A Pending JPS5480074A (en) | 1977-12-08 | 1977-12-08 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5480074A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954231A (en) * | 1982-09-22 | 1984-03-29 | Toshiba Corp | Compression bonding type semiconductor device |
-
1977
- 1977-12-08 JP JP14788177A patent/JPS5480074A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954231A (en) * | 1982-09-22 | 1984-03-29 | Toshiba Corp | Compression bonding type semiconductor device |
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