JPS5480074A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5480074A
JPS5480074A JP14788177A JP14788177A JPS5480074A JP S5480074 A JPS5480074 A JP S5480074A JP 14788177 A JP14788177 A JP 14788177A JP 14788177 A JP14788177 A JP 14788177A JP S5480074 A JPS5480074 A JP S5480074A
Authority
JP
Japan
Prior art keywords
substrate
plate
spiral
spring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14788177A
Other languages
Japanese (ja)
Inventor
Koichi Kamahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14788177A priority Critical patent/JPS5480074A/en
Publication of JPS5480074A publication Critical patent/JPS5480074A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To lessen the stress applied to the substrate by proviing the spiral notch to the reinforcing support plate.
CONSTITUTION: When spiral notch 6 is given to Mo plate 5, a spiral spring is formed theoretically. Accordingly, Mo plate 5 soldered at the lower surface of substrate 1 absorbs the heat expansion with the spring when substrate 1 is expanded with heat, thus avoiding deterioration of the adverse dielectric strength characteristics.
COPYRIGHT: (C)1979,JPO&Japio
JP14788177A 1977-12-08 1977-12-08 Semiconductor device Pending JPS5480074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14788177A JPS5480074A (en) 1977-12-08 1977-12-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14788177A JPS5480074A (en) 1977-12-08 1977-12-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5480074A true JPS5480074A (en) 1979-06-26

Family

ID=15440318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14788177A Pending JPS5480074A (en) 1977-12-08 1977-12-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5480074A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954231A (en) * 1982-09-22 1984-03-29 Toshiba Corp Compression bonding type semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954231A (en) * 1982-09-22 1984-03-29 Toshiba Corp Compression bonding type semiconductor device

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