JPS5688342A - Stem - Google Patents

Stem

Info

Publication number
JPS5688342A
JPS5688342A JP16557279A JP16557279A JPS5688342A JP S5688342 A JPS5688342 A JP S5688342A JP 16557279 A JP16557279 A JP 16557279A JP 16557279 A JP16557279 A JP 16557279A JP S5688342 A JPS5688342 A JP S5688342A
Authority
JP
Japan
Prior art keywords
flange
lead wires
bsg
directional
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16557279A
Other languages
Japanese (ja)
Inventor
Usuke Enomoto
Kazuo Hatori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16557279A priority Critical patent/JPS5688342A/en
Publication of JPS5688342A publication Critical patent/JPS5688342A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To obtain the stem using smaller amount of Co by forming a flange and lead wires of Fe and Ni and diffusing the Co on the surface, thereby forming a directional spinel type oxide layer. CONSTITUTION:The lead wires 1 and the flange 3 are formed of 42 alloy (Co-Ni-Fe alloy) more inexpensive than a kovar. The flange 3 has holes 10 possessing larger diameter than the diameter of the lead wire 1 at the base 9. The flange and the lead wires are plated to form Co films having a thickness of 0.5-1mum, are rinsed with acid to remove the impurity on the surfaces thereof, and are then heated to oxidize them. Thus, the Co film is transformed into directional spinel type oxide film of Fe2CoO4. This layer has much preferably adherence with glass. The lead wires are inserted into the holes 10, 12 of the BSG tablet 11 and the flange 3 respectively, are heated to melt the BSG, and are thus sealed. According to this configuration, no exfoliation occurs on the boundary of the glass due to the heating at the time of mounting a semiconductor element thereon. Since the amount of used Co being expensive is less, its cost can be reduced.
JP16557279A 1979-12-21 1979-12-21 Stem Pending JPS5688342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16557279A JPS5688342A (en) 1979-12-21 1979-12-21 Stem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16557279A JPS5688342A (en) 1979-12-21 1979-12-21 Stem

Publications (1)

Publication Number Publication Date
JPS5688342A true JPS5688342A (en) 1981-07-17

Family

ID=15814903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16557279A Pending JPS5688342A (en) 1979-12-21 1979-12-21 Stem

Country Status (1)

Country Link
JP (1) JPS5688342A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6213879B1 (en) 1997-05-14 2001-04-10 Sega Enterprises, Ltd. Data transmission system and game system with game peripherals using same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6213879B1 (en) 1997-05-14 2001-04-10 Sega Enterprises, Ltd. Data transmission system and game system with game peripherals using same
US6324603B1 (en) 1997-05-16 2001-11-27 Kabushiki Kaisha Sega Enterprises Data transmission system and game system using the same
US6338105B1 (en) 1997-05-16 2002-01-08 Kabushiki Kaisha Enterprises Data transmission method and game system constructed by using the method

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