JPS5515285A - Forming method for indium-antimony thin film - Google Patents

Forming method for indium-antimony thin film

Info

Publication number
JPS5515285A
JPS5515285A JP8906378A JP8906378A JPS5515285A JP S5515285 A JPS5515285 A JP S5515285A JP 8906378 A JP8906378 A JP 8906378A JP 8906378 A JP8906378 A JP 8906378A JP S5515285 A JPS5515285 A JP S5515285A
Authority
JP
Japan
Prior art keywords
film
thin film
vaccum
heat treatment
vaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8906378A
Other languages
Japanese (ja)
Inventor
Masaji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8906378A priority Critical patent/JPS5515285A/en
Publication of JPS5515285A publication Critical patent/JPS5515285A/en
Pending legal-status Critical Current

Links

Landscapes

  • Hall/Mr Elements (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE: To permit an application to a magnetic electric conversion element of a thin film having a nature different from that of a single crystal bulk, by bonding an impurity atom or its ion on a substrate for thin film formation, thereafter placing a InSb thin film thereon and by causing the thin film to recrystlize by a heat treatment.
CONSTITUTION: A very slight amount of a Sn layer 2 is mounted by a vaccum vaporation or a spatter method on a thin film forming substrate 1 and a InSb thin film 3 is formed by the vaccum vaporation method thereon. Successively, In order to prevent an oxidization in the heat treatment and an evenness in the thickness at the recrystlization time, the film 2 is covered with a SiO2 film 4, it is heated in the Ar gas atmosphere over 55°C, to obtain the recystalization of the film 3. Whereby the IsSb thin film including Sn can be obtained, a hole element is pattern etched in an appropriate shape, an opening is given to the film 4 and a Ni-Cu electrode film 5 adjacent to the film 3 is extended on the film 4 and bonded thereto. Thereafter, an electorde 6 is soldered to the above film. This hole element has an excellent electron transfer rate, magnetic sensibility and input/output resistance.
COPYRIGHT: (C)1980,JPO&Japio
JP8906378A 1978-07-20 1978-07-20 Forming method for indium-antimony thin film Pending JPS5515285A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8906378A JPS5515285A (en) 1978-07-20 1978-07-20 Forming method for indium-antimony thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8906378A JPS5515285A (en) 1978-07-20 1978-07-20 Forming method for indium-antimony thin film

Publications (1)

Publication Number Publication Date
JPS5515285A true JPS5515285A (en) 1980-02-02

Family

ID=13960388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8906378A Pending JPS5515285A (en) 1978-07-20 1978-07-20 Forming method for indium-antimony thin film

Country Status (1)

Country Link
JP (1) JPS5515285A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137218U (en) * 1983-03-07 1984-09-13 昭和電工建材株式会社 Transfer equipment for uncured molded products

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59137218U (en) * 1983-03-07 1984-09-13 昭和電工建材株式会社 Transfer equipment for uncured molded products
JPS638671Y2 (en) * 1983-03-07 1988-03-15

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