JPS5258464A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5258464A
JPS5258464A JP13492875A JP13492875A JPS5258464A JP S5258464 A JPS5258464 A JP S5258464A JP 13492875 A JP13492875 A JP 13492875A JP 13492875 A JP13492875 A JP 13492875A JP S5258464 A JPS5258464 A JP S5258464A
Authority
JP
Japan
Prior art keywords
semiconductor device
layer
soldering
pores
laminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13492875A
Other languages
Japanese (ja)
Inventor
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP13492875A priority Critical patent/JPS5258464A/en
Publication of JPS5258464A publication Critical patent/JPS5258464A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Abstract

PURPOSE: The metal layer on a semiconductor substrate is formed by laminating a platinum group element layer on a nickel layer, whereby the production of pores by soldering is prevented, mechanical securing strength is increased and electric and thermal resistance are reduced.
COPYRIGHT: (C)1977,JPO&Japio
JP13492875A 1975-11-10 1975-11-10 Semiconductor device Pending JPS5258464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13492875A JPS5258464A (en) 1975-11-10 1975-11-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13492875A JPS5258464A (en) 1975-11-10 1975-11-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5258464A true JPS5258464A (en) 1977-05-13

Family

ID=15139814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13492875A Pending JPS5258464A (en) 1975-11-10 1975-11-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5258464A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954889A (en) * 1972-08-25 1974-05-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954889A (en) * 1972-08-25 1974-05-28

Similar Documents

Publication Publication Date Title
JPS5258464A (en) Semiconductor device
JPS51132973A (en) Semiconductor device
JPS523383A (en) Manufacturing method of semiconductor device electrode
JPS5219297A (en) Method of manufacturing a metal film resistor
JPS5272571A (en) Production of semiconductor device
JPS5348671A (en) Electrode structure of semiconductor element
JPS5318962A (en) Semiconductor package
JPS535571A (en) Circuit block and its manufacture
JPS5368165A (en) Production of semiconductor device
JPS5231670A (en) Assembling method of semiconductor integrated circuit element
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5275272A (en) Production of semiconductor device
JPS5456766A (en) Semiconductor device
JPS5582680A (en) Manufacture of thermal head
JPS5419690A (en) Electrode of semiconductor devices
JPS5544138A (en) Mechanical seal
JPS5257788A (en) Semiconductor device
JPS54149486A (en) Pressure-sensitive element
JPS52139368A (en) Semiconductor device
JPS5353971A (en) Production of semiconductor device
JPS5348484A (en) Production of semiconductor device
JPS5324287A (en) Production of semiconductor element
JPS5297679A (en) Semiconductor rectifying element
JPS5362481A (en) Production of semiconductor device
JPS5352058A (en) Formation of p-type layer