JPS5552264A - Manufacturing of semiconductor device - Google Patents

Manufacturing of semiconductor device

Info

Publication number
JPS5552264A
JPS5552264A JP12490078A JP12490078A JPS5552264A JP S5552264 A JPS5552264 A JP S5552264A JP 12490078 A JP12490078 A JP 12490078A JP 12490078 A JP12490078 A JP 12490078A JP S5552264 A JPS5552264 A JP S5552264A
Authority
JP
Japan
Prior art keywords
film
oxidation
gate
protection film
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12490078A
Other languages
Japanese (ja)
Inventor
Toshiaki Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP12490078A priority Critical patent/JPS5552264A/en
Publication of JPS5552264A publication Critical patent/JPS5552264A/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To obtain MOSIC with reduced number of masking operations, by oxidizing the surface of a pattern made of Si or the like after the pattern is formed on a gate oxidation film through an oxidation protection film, and by removing except on a side wall and covering Si or the like, thereby lifting off at the side wall.
CONSTITUTION: A channel dope 11 is formed after an oxidation protection film 10 such as Si3N4 is formed on a field oxidation film 8 and a gate oxidation film 9. Next, a pattern consisting of Si or a metal silicide 12 and an oxidation protection film 13, is formed. After the surface of the pattern is oxidized and a SiO2 layer 14 is formed, ions are supplied to form a source-drain diffusion areas 15. Next, the oxidation protection film 13, the gate oxidation film except for the channel section, the Si or silicide layer 12, and the oxidation protection film 10 are removed in this order, thereby forming a wall made by SiO2, then a film 16 for wiring is covered which is formed into a gate wiring and a source-drain wiring by lifting off the SiO2 wall 14. Finally, an ion supplid layer 17 is formed to obtain a gate selfaligned MOSIC.
COPYRIGHT: (C)1980,JPO&Japio
JP12490078A 1978-10-11 1978-10-11 Manufacturing of semiconductor device Pending JPS5552264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12490078A JPS5552264A (en) 1978-10-11 1978-10-11 Manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12490078A JPS5552264A (en) 1978-10-11 1978-10-11 Manufacturing of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5552264A true JPS5552264A (en) 1980-04-16

Family

ID=14896878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12490078A Pending JPS5552264A (en) 1978-10-11 1978-10-11 Manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5552264A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904508A (en) * 1994-09-27 1999-05-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141578A (en) * 1976-05-20 1977-11-25 Matsushita Electric Ind Co Ltd Manufacture of mos-type semiconductor device
JPS5368071A (en) * 1976-11-30 1978-06-17 Cho Lsi Gijutsu Kenkyu Kumiai Method of producing semiconductor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141578A (en) * 1976-05-20 1977-11-25 Matsushita Electric Ind Co Ltd Manufacture of mos-type semiconductor device
JPS5368071A (en) * 1976-11-30 1978-06-17 Cho Lsi Gijutsu Kenkyu Kumiai Method of producing semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904508A (en) * 1994-09-27 1999-05-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same

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