JPS5546533A - Method of producing insulating film of silicon oxide - Google Patents
Method of producing insulating film of silicon oxideInfo
- Publication number
- JPS5546533A JPS5546533A JP11953578A JP11953578A JPS5546533A JP S5546533 A JPS5546533 A JP S5546533A JP 11953578 A JP11953578 A JP 11953578A JP 11953578 A JP11953578 A JP 11953578A JP S5546533 A JPS5546533 A JP S5546533A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- wiring layer
- layer
- silicon oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Local Oxidation Of Silicon (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To produce an insulating film which has no overhang construction and steep step construction, by preparing materials including silane and an oxygen source at a prescribed temperature of a substrate and performing chemical evaporation.
CONSTITUTION: A filed oxide film 12 is produced on a silicon substrate 11. An opening 12a is made through the film 12 by selective etching. Polycrystalline silicon or a high-melting-point metal or a silicide thereof is coated and patterned so that a first electrode wiring layer 13 is provided. An impurity is diffused through the opening 12a so that a diffused layer 15 is produced. The substrate 11 is maintained at a temperaure 0f 600°C or more and materials including silane and an oxygen source are processed so that an insulating silicon oxide film 14 is deposited over the layer 13 by chemical evaporation. As a result, the gradient of the film 14 on the step part between the film 14 and the substrate 11 and the step part between the film 14 and the wiring layer 13 is made easy. Thus, an aluminium wiring layer 16 provided on the film 14 is prevented from being ruptured at the step parts of the film 14 and being short-circuited to the wiring layer 13.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11953578A JPS5546533A (en) | 1978-09-28 | 1978-09-28 | Method of producing insulating film of silicon oxide |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11953578A JPS5546533A (en) | 1978-09-28 | 1978-09-28 | Method of producing insulating film of silicon oxide |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5546533A true JPS5546533A (en) | 1980-04-01 |
Family
ID=14763681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11953578A Pending JPS5546533A (en) | 1978-09-28 | 1978-09-28 | Method of producing insulating film of silicon oxide |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5546533A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59147434A (en) * | 1983-02-10 | 1984-08-23 | Mitsui Toatsu Chem Inc | Formation of silicon oxide film |
JPS6386549A (en) * | 1986-09-30 | 1988-04-16 | Toshiba Corp | Manufacture of semiconductor device |
-
1978
- 1978-09-28 JP JP11953578A patent/JPS5546533A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59147434A (en) * | 1983-02-10 | 1984-08-23 | Mitsui Toatsu Chem Inc | Formation of silicon oxide film |
JPS6386549A (en) * | 1986-09-30 | 1988-04-16 | Toshiba Corp | Manufacture of semiconductor device |
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