JPS5538024A - Manufacturing of semiconductor device - Google Patents

Manufacturing of semiconductor device

Info

Publication number
JPS5538024A
JPS5538024A JP11066978A JP11066978A JPS5538024A JP S5538024 A JPS5538024 A JP S5538024A JP 11066978 A JP11066978 A JP 11066978A JP 11066978 A JP11066978 A JP 11066978A JP S5538024 A JPS5538024 A JP S5538024A
Authority
JP
Japan
Prior art keywords
base plate
polishing
bonding agent
electrode
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11066978A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130740B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Okio Yoshida
Hiroo Takemura
Nozomi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11066978A priority Critical patent/JPS5538024A/ja
Publication of JPS5538024A publication Critical patent/JPS5538024A/ja
Publication of JPS6130740B2 publication Critical patent/JPS6130740B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP11066978A 1978-09-11 1978-09-11 Manufacturing of semiconductor device Granted JPS5538024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11066978A JPS5538024A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11066978A JPS5538024A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5538024A true JPS5538024A (en) 1980-03-17
JPS6130740B2 JPS6130740B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-15

Family

ID=14541452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11066978A Granted JPS5538024A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5538024A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025568A (ja) * 1988-02-11 1990-01-10 Eev Ltd イメージ装置の製作方法
EP1925382A1 (en) 2006-11-22 2008-05-28 NSK Ltd. Fastening system for steering apparatus and manufacturing method for the same
JP2009302278A (ja) * 2008-06-13 2009-12-24 Disco Abrasive Syst Ltd 光デバイスウエーハの分割方法
JP2010050324A (ja) * 2008-08-22 2010-03-04 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
JP2012049249A (ja) * 2010-08-25 2012-03-08 Toshiba Corp 半導体装置の製造方法
JP2013165286A (ja) * 2005-04-27 2013-08-22 Disco Abrasive Syst Ltd ウェーハの加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348456A (en) * 1976-10-14 1978-05-01 Fujitsu Ltd Dicing method of semiconductor substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348456A (en) * 1976-10-14 1978-05-01 Fujitsu Ltd Dicing method of semiconductor substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025568A (ja) * 1988-02-11 1990-01-10 Eev Ltd イメージ装置の製作方法
JP2013165286A (ja) * 2005-04-27 2013-08-22 Disco Abrasive Syst Ltd ウェーハの加工方法
EP1925382A1 (en) 2006-11-22 2008-05-28 NSK Ltd. Fastening system for steering apparatus and manufacturing method for the same
JP2009302278A (ja) * 2008-06-13 2009-12-24 Disco Abrasive Syst Ltd 光デバイスウエーハの分割方法
JP2010050324A (ja) * 2008-08-22 2010-03-04 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
JP2012049249A (ja) * 2010-08-25 2012-03-08 Toshiba Corp 半導体装置の製造方法
US8778778B2 (en) 2010-08-25 2014-07-15 Kabushiki Kaisha Toshiba Manufacturing method of semiconductor device, semiconductor substrate, and camera module

Also Published As

Publication number Publication date
JPS6130740B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-15

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