JPS5538023A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5538023A
JPS5538023A JP11066678A JP11066678A JPS5538023A JP S5538023 A JPS5538023 A JP S5538023A JP 11066678 A JP11066678 A JP 11066678A JP 11066678 A JP11066678 A JP 11066678A JP S5538023 A JPS5538023 A JP S5538023A
Authority
JP
Japan
Prior art keywords
base plate
thickness
bonding agent
layer
combination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11066678A
Other languages
Japanese (ja)
Inventor
Nozomi Harada
Okio Yoshida
Hiroo Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11066678A priority Critical patent/JPS5538023A/en
Publication of JPS5538023A publication Critical patent/JPS5538023A/en
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE: To eliminate carrier occurring from deep inside of a region and also to exterminate excessive carrier causing blooming, by providing rear side of a thin semiconductor base plate with a layer having many re-combination centers for the carrier.
CONSTITUTION: After a semiconductor base plate 11 of normal thickness, on which an insulation layer 12 and an electrode 13 are formed, and a polishing base plate 14 are bonded together by a bonding agent 15, such as a low-temperature wax, the base plate 11 is polished by prescribed thickness of approximately 10μm to an X-X' line, and at the same time, a crushing layer 16 having many re-combination centers, is formed. After bonding an auxiliary base plate 17 to this crushing layer 16 by a bonding agent 18, the polishing base plate 14 and the bonding agent 15 are eliminated to produce a solid image-projecting device or a dynamic RAM, etc. Forming process of the region 16 of large re-combination may be conducted by injection of ion after reducing thickness of the base plate 11. It is also possible to improve sensitivity in such a manner as to control the base plate thickness affecting the characteristics by forming an impurity concentration peak in the base plate or to provide an impurity concentration distribution which diminishes monotonously from rear side of the base plate.
COPYRIGHT: (C)1980,JPO&Japio
JP11066678A 1978-09-11 1978-09-11 Semiconductor device Pending JPS5538023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11066678A JPS5538023A (en) 1978-09-11 1978-09-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11066678A JPS5538023A (en) 1978-09-11 1978-09-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5538023A true JPS5538023A (en) 1980-03-17

Family

ID=14541379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11066678A Pending JPS5538023A (en) 1978-09-11 1978-09-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5538023A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665577A (en) * 1979-11-01 1981-06-03 Nec Corp Solidstate image sensor
JPS6468448A (en) * 1987-09-08 1989-03-14 Allegheny Int Inc Ferrite stainless steel and its production

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51128221A (en) * 1975-05-01 1976-11-09 Sony Corp Solid state image pickup device
JPS5373031A (en) * 1976-12-13 1978-06-29 Hitachi Ltd Solid pickup device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51128221A (en) * 1975-05-01 1976-11-09 Sony Corp Solid state image pickup device
JPS5373031A (en) * 1976-12-13 1978-06-29 Hitachi Ltd Solid pickup device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665577A (en) * 1979-11-01 1981-06-03 Nec Corp Solidstate image sensor
JPS6468448A (en) * 1987-09-08 1989-03-14 Allegheny Int Inc Ferrite stainless steel and its production

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