JPS5538023A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5538023A JPS5538023A JP11066678A JP11066678A JPS5538023A JP S5538023 A JPS5538023 A JP S5538023A JP 11066678 A JP11066678 A JP 11066678A JP 11066678 A JP11066678 A JP 11066678A JP S5538023 A JPS5538023 A JP S5538023A
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- thickness
- bonding agent
- layer
- combination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
PURPOSE: To eliminate carrier occurring from deep inside of a region and also to exterminate excessive carrier causing blooming, by providing rear side of a thin semiconductor base plate with a layer having many re-combination centers for the carrier.
CONSTITUTION: After a semiconductor base plate 11 of normal thickness, on which an insulation layer 12 and an electrode 13 are formed, and a polishing base plate 14 are bonded together by a bonding agent 15, such as a low-temperature wax, the base plate 11 is polished by prescribed thickness of approximately 10μm to an X-X' line, and at the same time, a crushing layer 16 having many re-combination centers, is formed. After bonding an auxiliary base plate 17 to this crushing layer 16 by a bonding agent 18, the polishing base plate 14 and the bonding agent 15 are eliminated to produce a solid image-projecting device or a dynamic RAM, etc. Forming process of the region 16 of large re-combination may be conducted by injection of ion after reducing thickness of the base plate 11. It is also possible to improve sensitivity in such a manner as to control the base plate thickness affecting the characteristics by forming an impurity concentration peak in the base plate or to provide an impurity concentration distribution which diminishes monotonously from rear side of the base plate.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11066678A JPS5538023A (en) | 1978-09-11 | 1978-09-11 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11066678A JPS5538023A (en) | 1978-09-11 | 1978-09-11 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5538023A true JPS5538023A (en) | 1980-03-17 |
Family
ID=14541379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11066678A Pending JPS5538023A (en) | 1978-09-11 | 1978-09-11 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5538023A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5665577A (en) * | 1979-11-01 | 1981-06-03 | Nec Corp | Solidstate image sensor |
JPS6468448A (en) * | 1987-09-08 | 1989-03-14 | Allegheny Int Inc | Ferrite stainless steel and its production |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51128221A (en) * | 1975-05-01 | 1976-11-09 | Sony Corp | Solid state image pickup device |
JPS5373031A (en) * | 1976-12-13 | 1978-06-29 | Hitachi Ltd | Solid pickup device |
-
1978
- 1978-09-11 JP JP11066678A patent/JPS5538023A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51128221A (en) * | 1975-05-01 | 1976-11-09 | Sony Corp | Solid state image pickup device |
JPS5373031A (en) * | 1976-12-13 | 1978-06-29 | Hitachi Ltd | Solid pickup device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5665577A (en) * | 1979-11-01 | 1981-06-03 | Nec Corp | Solidstate image sensor |
JPS6468448A (en) * | 1987-09-08 | 1989-03-14 | Allegheny Int Inc | Ferrite stainless steel and its production |
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