JPS5348456A - Dicing method of semiconductor substrate - Google Patents

Dicing method of semiconductor substrate

Info

Publication number
JPS5348456A
JPS5348456A JP12353676A JP12353676A JPS5348456A JP S5348456 A JPS5348456 A JP S5348456A JP 12353676 A JP12353676 A JP 12353676A JP 12353676 A JP12353676 A JP 12353676A JP S5348456 A JPS5348456 A JP S5348456A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
dicing method
glass plate
grooves
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12353676A
Other languages
Japanese (ja)
Inventor
Akira Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12353676A priority Critical patent/JPS5348456A/en
Publication of JPS5348456A publication Critical patent/JPS5348456A/en
Pending legal-status Critical Current

Links

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  • Dicing (AREA)

Abstract

PURPOSE: Pellet failure at the time of dicing a semiconductor substrate to pellets is obtained by providing ciding grooves to the semiconductor substrate and affixing the substrate and a glass plate in such a way that the grooves oppose to the glass plate.
COPYRIGHT: (C)1978,JPO&Japio
JP12353676A 1976-10-14 1976-10-14 Dicing method of semiconductor substrate Pending JPS5348456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12353676A JPS5348456A (en) 1976-10-14 1976-10-14 Dicing method of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12353676A JPS5348456A (en) 1976-10-14 1976-10-14 Dicing method of semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5348456A true JPS5348456A (en) 1978-05-01

Family

ID=14863023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12353676A Pending JPS5348456A (en) 1976-10-14 1976-10-14 Dicing method of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5348456A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538024A (en) * 1978-09-11 1980-03-17 Toshiba Corp Manufacturing of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538024A (en) * 1978-09-11 1980-03-17 Toshiba Corp Manufacturing of semiconductor device
JPS6130740B2 (en) * 1978-09-11 1986-07-15 Tokyo Shibaura Electric Co

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