JPS55157243A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55157243A JPS55157243A JP6545279A JP6545279A JPS55157243A JP S55157243 A JPS55157243 A JP S55157243A JP 6545279 A JP6545279 A JP 6545279A JP 6545279 A JP6545279 A JP 6545279A JP S55157243 A JPS55157243 A JP S55157243A
- Authority
- JP
- Japan
- Prior art keywords
- throttle
- cap
- ultraviolet ray
- glass
- confronting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 239000005388 borosilicate glass Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000005394 sealing glass Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6545279A JPS55157243A (en) | 1979-05-25 | 1979-05-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6545279A JPS55157243A (en) | 1979-05-25 | 1979-05-25 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55157243A true JPS55157243A (en) | 1980-12-06 |
JPS6210028B2 JPS6210028B2 (ja) | 1987-03-04 |
Family
ID=13287540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6545279A Granted JPS55157243A (en) | 1979-05-25 | 1979-05-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55157243A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7402458B2 (en) * | 2002-05-10 | 2008-07-22 | Texas Instruments Incorporated | Stress relieved flat frame for DMD window |
-
1979
- 1979-05-25 JP JP6545279A patent/JPS55157243A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7402458B2 (en) * | 2002-05-10 | 2008-07-22 | Texas Instruments Incorporated | Stress relieved flat frame for DMD window |
Also Published As
Publication number | Publication date |
---|---|
JPS6210028B2 (ja) | 1987-03-04 |
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