JPS59211254A - ボンデイングワイヤ - Google Patents

ボンデイングワイヤ

Info

Publication number
JPS59211254A
JPS59211254A JP58086153A JP8615383A JPS59211254A JP S59211254 A JPS59211254 A JP S59211254A JP 58086153 A JP58086153 A JP 58086153A JP 8615383 A JP8615383 A JP 8615383A JP S59211254 A JPS59211254 A JP S59211254A
Authority
JP
Japan
Prior art keywords
bonding wire
resin
improved
wire
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58086153A
Other languages
English (en)
Inventor
Katsunobu Yoshimura
吉村　克信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58086153A priority Critical patent/JPS59211254A/ja
Publication of JPS59211254A publication Critical patent/JPS59211254A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45013—Cross-sectional shape being non uniform along the connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/4556—Disposition, e.g. coating on a part of the core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明はボンディングワイヤに関する。
最近の半導体集積回路は、原価低減の為に、セラミック
封止品からプラスチック封止品へと、かわりつつある。
ところがプラスチック封止品は、根本的に耐湿性の問題
を有している。プラスチック封止品が、耐湿性に弱い理
由は、リードフレームにそって樹脂のまきまから水分が
進入し、最終的に、ボンディングワイヤをつたわって、
ペレットまで到達する為だと考えられる。これを防止す
る為には封止の際の樹脂の密着を良くして樹脂のすきま
からの水分の進入を少なくする必要がある。
それには２つの方法が考えられる。１つは、リードフレ
ームに工夫を加える方法と、ボンディングワイヤに工夫
を加える方法である。リードフレ−ムに工夫を加える方
法としては、リードフレームの樹脂に封止される部分に
穴をあける、くさびを入れるなどの技術がすでに提案さ
れているが、工程が複雑になる等の欠点がある。
本発明はかかる従来の欠点を解決することを目的とする
。
本発明の特徴は、半導体装置用ポンディングワイヤにお
いて、くびれが入っているか、も、シ＜は突起が出てい
るボンディングワイヤにある。
以下、実施例を説明する。
従来のボンディングワイヤは第１図のような円筒形をし
てｖするが、本発明のボンディングワイヤは、第２図の
ように、くびれが入っている構造のものと第３図のよう
に、突起が出ているものである。
本発明のボンデ、ｆングワイヤを用いれば樹脂とボンデ
ィングワイヤとの接触面積がふえる為、折着性が良くな
るとともに水分がワイヤを伝わって進入する際の障壁に
もなる為、耐湿性向上に対して大きな効果があると思わ
れる。
【図面の簡単な説明】
第１図は従来のボンディングワイヤ、第２図は本発明実
施例のくびれの入ったボンディングワイヤ、第３図は本
発明実施例の突起の入ったボンディングワイヤである。 茅　ｌ　圀 尊　Ｚ　図 茅　３　図

Claims (1)

    【特許請求の範囲】
  1. 半導体素子上の電極と外部電極との間に接続されるボン
    ディングワイヤにおいて、該ボンディングワイヤの直径
    が部分的に変化してよシ太い部分もしくはよシ細い部分
    が設けられてし）ることを特徴とするボンディングワイ
    ヤ。
JP58086153A 1983-05-17 1983-05-17 ボンデイングワイヤ Pending JPS59211254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58086153A JPS59211254A (ja) 1983-05-17 1983-05-17 ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58086153A JPS59211254A (ja) 1983-05-17 1983-05-17 ボンデイングワイヤ

Publications (1)

Publication Number Publication Date
JPS59211254A true JPS59211254A (ja) 1984-11-30

Family

ID=13878789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58086153A Pending JPS59211254A (ja) 1983-05-17 1983-05-17 ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS59211254A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03151648A (ja) * 1989-11-08 1991-06-27 Toshiba Corp ボンディングワイヤ及びこれを有する半導体装置
JPH09162221A (ja) * 1995-12-13 1997-06-20 Nec Corp 樹脂封止型半導体装置及びワイヤボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03151648A (ja) * 1989-11-08 1991-06-27 Toshiba Corp ボンディングワイヤ及びこれを有する半導体装置
JPH09162221A (ja) * 1995-12-13 1997-06-20 Nec Corp 樹脂封止型半導体装置及びワイヤボンディング装置

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