JPS5515258A - Heat treatment apparatus for semiconductor substrate - Google Patents

Heat treatment apparatus for semiconductor substrate

Info

Publication number
JPS5515258A
JPS5515258A JP8875478A JP8875478A JPS5515258A JP S5515258 A JPS5515258 A JP S5515258A JP 8875478 A JP8875478 A JP 8875478A JP 8875478 A JP8875478 A JP 8875478A JP S5515258 A JPS5515258 A JP S5515258A
Authority
JP
Japan
Prior art keywords
substrate
casing
supporter
heat treatment
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8875478A
Other languages
English (en)
Inventor
Toshio Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8875478A priority Critical patent/JPS5515258A/ja
Publication of JPS5515258A publication Critical patent/JPS5515258A/ja
Pending legal-status Critical Current

Links

JP8875478A 1978-07-19 1978-07-19 Heat treatment apparatus for semiconductor substrate Pending JPS5515258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8875478A JPS5515258A (en) 1978-07-19 1978-07-19 Heat treatment apparatus for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8875478A JPS5515258A (en) 1978-07-19 1978-07-19 Heat treatment apparatus for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5515258A true JPS5515258A (en) 1980-02-02

Family

ID=13951676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8875478A Pending JPS5515258A (en) 1978-07-19 1978-07-19 Heat treatment apparatus for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5515258A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170102802A (ko) 2016-03-02 2017-09-12 오므론 가부시키가이샤 압력 센서 칩 및 압력 센서

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50114179A (ja) * 1974-02-15 1975-09-06
JPS5362982A (en) * 1976-11-17 1978-06-05 Toshiba Corp Plasma cvd apparatus
JPS5375767A (en) * 1976-12-16 1978-07-05 Nec Corp Oxidizing method for semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50114179A (ja) * 1974-02-15 1975-09-06
JPS5362982A (en) * 1976-11-17 1978-06-05 Toshiba Corp Plasma cvd apparatus
JPS5375767A (en) * 1976-12-16 1978-07-05 Nec Corp Oxidizing method for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170102802A (ko) 2016-03-02 2017-09-12 오므론 가부시키가이샤 압력 센서 칩 및 압력 센서

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