JPS55132054A - Semiconductor device and method of fabricating same - Google Patents

Semiconductor device and method of fabricating same

Info

Publication number
JPS55132054A
JPS55132054A JP4112580A JP4112580A JPS55132054A JP S55132054 A JPS55132054 A JP S55132054A JP 4112580 A JP4112580 A JP 4112580A JP 4112580 A JP4112580 A JP 4112580A JP S55132054 A JPS55132054 A JP S55132054A
Authority
JP
Japan
Prior art keywords
semiconductor device
fabricating same
fabricating
same
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4112580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332234B2 (enrdf_load_stackoverflow
Inventor
Ii Hendorikuson Toomasu
Jii Koerushiyu Ronarudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of JPS55132054A publication Critical patent/JPS55132054A/ja
Publication of JPH0332234B2 publication Critical patent/JPH0332234B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/112Field plates comprising multiple field plate segments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/765Making of isolation regions between components by field effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/605Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having significant overlap between the lightly-doped extensions and the gate electrode
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/611Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Element Separation (AREA)
JP4112580A 1979-03-28 1980-03-28 Semiconductor device and method of fabricating same Granted JPS55132054A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2484079A 1979-03-28 1979-03-28

Publications (2)

Publication Number Publication Date
JPS55132054A true JPS55132054A (en) 1980-10-14
JPH0332234B2 JPH0332234B2 (enrdf_load_stackoverflow) 1991-05-10

Family

ID=21822678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4112580A Granted JPS55132054A (en) 1979-03-28 1980-03-28 Semiconductor device and method of fabricating same

Country Status (5)

Country Link
JP (1) JPS55132054A (enrdf_load_stackoverflow)
CA (1) CA1142271A (enrdf_load_stackoverflow)
DE (1) DE3011778A1 (enrdf_load_stackoverflow)
FR (1) FR2452789A1 (enrdf_load_stackoverflow)
GB (1) GB2045525A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984572A (ja) * 1982-11-08 1984-05-16 Nec Corp 半導体装置
JPS63104466A (ja) * 1986-10-22 1988-05-09 Mitsubishi Electric Corp Mos型ダイナミツクram
JPH04326570A (ja) * 1991-04-26 1992-11-16 Nec Corp Mos集積回路
JPH0669502A (ja) * 1992-08-20 1994-03-11 Matsushita Electron Corp Mis型高耐圧トランジスタ
US7026214B2 (en) 2000-12-14 2006-04-11 Kabushiki Kaisha Toshiba Offset-gate-type semiconductor device
JP2007214398A (ja) * 2006-02-10 2007-08-23 Nec Corp 半導体集積回路
JP2009212110A (ja) * 2008-02-29 2009-09-17 Renesas Technology Corp トランジスタおよびその製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429237A (en) * 1981-03-20 1984-01-31 International Business Machines Corp. High voltage on chip FET driver
JPS57204172A (en) * 1981-06-08 1982-12-14 Ibm Field effect transistor
EP0087155B1 (en) * 1982-02-22 1991-05-29 Kabushiki Kaisha Toshiba Means for preventing the breakdown of an insulation layer in semiconductor devices
US5087591A (en) * 1985-01-22 1992-02-11 Texas Instruments Incorporated Contact etch process
US4734752A (en) * 1985-09-27 1988-03-29 Advanced Micro Devices, Inc. Electrostatic discharge protection device for CMOS integrated circuit outputs
EP0242540A1 (en) * 1986-04-21 1987-10-28 International Business Machines Corporation Method and structure for reducing resistance in integrated circuits
US5047820A (en) * 1988-09-14 1991-09-10 Micrel, Inc. Semi self-aligned high voltage P channel FET
US4885627A (en) * 1988-10-18 1989-12-05 International Business Machines Corporation Method and structure for reducing resistance in integrated circuits

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50114182A (enrdf_load_stackoverflow) * 1974-02-15 1975-09-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50114182A (enrdf_load_stackoverflow) * 1974-02-15 1975-09-06

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984572A (ja) * 1982-11-08 1984-05-16 Nec Corp 半導体装置
JPS63104466A (ja) * 1986-10-22 1988-05-09 Mitsubishi Electric Corp Mos型ダイナミツクram
JPH04326570A (ja) * 1991-04-26 1992-11-16 Nec Corp Mos集積回路
JPH0669502A (ja) * 1992-08-20 1994-03-11 Matsushita Electron Corp Mis型高耐圧トランジスタ
US7026214B2 (en) 2000-12-14 2006-04-11 Kabushiki Kaisha Toshiba Offset-gate-type semiconductor device
US7061060B2 (en) 2000-12-14 2006-06-13 Kabushiki Kaisha Toshiba Offset-gate-type semiconductor device
JP2007214398A (ja) * 2006-02-10 2007-08-23 Nec Corp 半導体集積回路
JP2009212110A (ja) * 2008-02-29 2009-09-17 Renesas Technology Corp トランジスタおよびその製造方法

Also Published As

Publication number Publication date
CA1142271A (en) 1983-03-01
DE3011778A1 (de) 1980-10-09
JPH0332234B2 (enrdf_load_stackoverflow) 1991-05-10
GB2045525A (en) 1980-10-29
FR2452789A1 (fr) 1980-10-24

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