JPS55132054A - Semiconductor device and method of fabricating same - Google Patents
Semiconductor device and method of fabricating sameInfo
- Publication number
- JPS55132054A JPS55132054A JP4112580A JP4112580A JPS55132054A JP S55132054 A JPS55132054 A JP S55132054A JP 4112580 A JP4112580 A JP 4112580A JP 4112580 A JP4112580 A JP 4112580A JP S55132054 A JPS55132054 A JP S55132054A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- fabricating same
- fabricating
- same
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/765—Making of isolation regions between components by field effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7831—Field effect transistors with field effect produced by an insulated gate with multiple gate structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7836—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a significant overlap between the lightly doped extension and the gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2484079A | 1979-03-28 | 1979-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55132054A true JPS55132054A (en) | 1980-10-14 |
JPH0332234B2 JPH0332234B2 (en) | 1991-05-10 |
Family
ID=21822678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4112580A Granted JPS55132054A (en) | 1979-03-28 | 1980-03-28 | Semiconductor device and method of fabricating same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS55132054A (en) |
CA (1) | CA1142271A (en) |
DE (1) | DE3011778A1 (en) |
FR (1) | FR2452789A1 (en) |
GB (1) | GB2045525A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984572A (en) * | 1982-11-08 | 1984-05-16 | Nec Corp | Semiconductor device |
JPS63104466A (en) * | 1986-10-22 | 1988-05-09 | Mitsubishi Electric Corp | Mos type dynamic random access memory (ram) |
JPH04326570A (en) * | 1991-04-26 | 1992-11-16 | Nec Corp | Mos integrated circuit |
JPH0669502A (en) * | 1992-08-20 | 1994-03-11 | Matsushita Electron Corp | High-tension mis transistor |
US7026214B2 (en) | 2000-12-14 | 2006-04-11 | Kabushiki Kaisha Toshiba | Offset-gate-type semiconductor device |
JP2007214398A (en) * | 2006-02-10 | 2007-08-23 | Nec Corp | Semiconductor integrated circuit |
JP2009212110A (en) * | 2008-02-29 | 2009-09-17 | Renesas Technology Corp | Transistor and its manufacturing method |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4429237A (en) * | 1981-03-20 | 1984-01-31 | International Business Machines Corp. | High voltage on chip FET driver |
JPS57204172A (en) * | 1981-06-08 | 1982-12-14 | Ibm | Field effect transistor |
DE3382294D1 (en) * | 1982-02-22 | 1991-07-04 | Toshiba Kawasaki Kk | Means for preventing the breakdown of an insulating layer in semiconductor devices. |
US5087591A (en) * | 1985-01-22 | 1992-02-11 | Texas Instruments Incorporated | Contact etch process |
US4734752A (en) * | 1985-09-27 | 1988-03-29 | Advanced Micro Devices, Inc. | Electrostatic discharge protection device for CMOS integrated circuit outputs |
EP0242540A1 (en) * | 1986-04-21 | 1987-10-28 | International Business Machines Corporation | Method and structure for reducing resistance in integrated circuits |
US5047820A (en) * | 1988-09-14 | 1991-09-10 | Micrel, Inc. | Semi self-aligned high voltage P channel FET |
US4885627A (en) * | 1988-10-18 | 1989-12-05 | International Business Machines Corporation | Method and structure for reducing resistance in integrated circuits |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50114182A (en) * | 1974-02-15 | 1975-09-06 |
-
1980
- 1980-03-07 CA CA000347291A patent/CA1142271A/en not_active Expired
- 1980-03-26 GB GB8010180A patent/GB2045525A/en not_active Withdrawn
- 1980-03-27 DE DE19803011778 patent/DE3011778A1/en not_active Withdrawn
- 1980-03-28 JP JP4112580A patent/JPS55132054A/en active Granted
- 1980-03-28 FR FR8007109A patent/FR2452789A1/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50114182A (en) * | 1974-02-15 | 1975-09-06 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984572A (en) * | 1982-11-08 | 1984-05-16 | Nec Corp | Semiconductor device |
JPS63104466A (en) * | 1986-10-22 | 1988-05-09 | Mitsubishi Electric Corp | Mos type dynamic random access memory (ram) |
JPH04326570A (en) * | 1991-04-26 | 1992-11-16 | Nec Corp | Mos integrated circuit |
JPH0669502A (en) * | 1992-08-20 | 1994-03-11 | Matsushita Electron Corp | High-tension mis transistor |
US7026214B2 (en) | 2000-12-14 | 2006-04-11 | Kabushiki Kaisha Toshiba | Offset-gate-type semiconductor device |
US7061060B2 (en) | 2000-12-14 | 2006-06-13 | Kabushiki Kaisha Toshiba | Offset-gate-type semiconductor device |
JP2007214398A (en) * | 2006-02-10 | 2007-08-23 | Nec Corp | Semiconductor integrated circuit |
JP2009212110A (en) * | 2008-02-29 | 2009-09-17 | Renesas Technology Corp | Transistor and its manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
DE3011778A1 (en) | 1980-10-09 |
JPH0332234B2 (en) | 1991-05-10 |
CA1142271A (en) | 1983-03-01 |
FR2452789A1 (en) | 1980-10-24 |
GB2045525A (en) | 1980-10-29 |
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