JPS5593271A - Method of fabricating integrated semiconductor device - Google Patents

Method of fabricating integrated semiconductor device

Info

Publication number
JPS5593271A
JPS5593271A JP83180A JP83180A JPS5593271A JP S5593271 A JPS5593271 A JP S5593271A JP 83180 A JP83180 A JP 83180A JP 83180 A JP83180 A JP 83180A JP S5593271 A JPS5593271 A JP S5593271A
Authority
JP
Japan
Prior art keywords
semiconductor device
integrated semiconductor
fabricating integrated
fabricating
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP83180A
Other languages
Japanese (ja)
Inventor
Raru Batora Taaseimu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Microsystems Holding Corp
Original Assignee
American Microsystems Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Microsystems Holding Corp filed Critical American Microsystems Holding Corp
Publication of JPS5593271A publication Critical patent/JPS5593271A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568Lateral single gate silicon transistors
    • H01L29/66575Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP83180A 1979-01-08 1980-01-08 Method of fabricating integrated semiconductor device Pending JPS5593271A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US184079A 1979-01-08 1979-01-08

Publications (1)

Publication Number Publication Date
JPS5593271A true JPS5593271A (en) 1980-07-15

Family

ID=21698078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP83180A Pending JPS5593271A (en) 1979-01-08 1980-01-08 Method of fabricating integrated semiconductor device

Country Status (7)

Country Link
JP (1) JPS5593271A (en)
CA (1) CA1131796A (en)
DE (1) DE3000121A1 (en)
FR (1) FR2446011A1 (en)
GB (1) GB2040564A (en)
IT (1) IT8019078A0 (en)
NL (1) NL7908534A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63207171A (en) * 1987-02-24 1988-08-26 Nippon Telegr & Teleph Corp <Ntt> Semiconductor memory and manufacture thereof

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506437A (en) * 1978-05-26 1985-03-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4455737A (en) * 1978-05-26 1984-06-26 Rockwell International Corporation Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines
US4409722A (en) * 1980-08-29 1983-10-18 International Business Machines Corporation Borderless diffusion contact process and structure
US4341009A (en) * 1980-12-05 1982-07-27 International Business Machines Corporation Method for making an electrical contact to a silicon substrate through a relatively thin layer of silicon dioxide on the surface of the substrate
JPS57113289A (en) * 1980-12-30 1982-07-14 Fujitsu Ltd Semiconductor device and its manufacture
US4517729A (en) * 1981-07-27 1985-05-21 American Microsystems, Incorporated Method for fabricating MOS device with self-aligned contacts
US4686000A (en) * 1985-04-02 1987-08-11 Heath Barbara A Self-aligned contact process
US5159353A (en) * 1991-07-02 1992-10-27 Hewlett-Packard Company Thermal inkjet printhead structure and method for making the same
KR100377833B1 (en) * 2001-06-19 2003-03-29 삼성전자주식회사 Semiconductor device with borderless contact structure and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63207171A (en) * 1987-02-24 1988-08-26 Nippon Telegr & Teleph Corp <Ntt> Semiconductor memory and manufacture thereof

Also Published As

Publication number Publication date
FR2446011A1 (en) 1980-08-01
NL7908534A (en) 1980-07-10
FR2446011B3 (en) 1981-11-06
DE3000121A1 (en) 1980-07-17
IT8019078A0 (en) 1980-01-08
GB2040564A (en) 1980-08-28
CA1131796A (en) 1982-09-14

Similar Documents

Publication Publication Date Title
JPS5615529A (en) Semiconductor device and method of fabricating same
JPS55160473A (en) Semiconductor device and method of fabricating same
JPS5591176A (en) Method of fabricating semiconductor device
JPS5521198A (en) Method of manufacturing semiconductor device
JPS5778136A (en) Method of fabricating semiconductor device
JPS5650563A (en) Method of manufacturing semiconductor device
DE3068823D1 (en) A method of fabricating a semiconductor integrated circuit device
DE3069594D1 (en) Semiconductor device and method of manufacturing the same
JPS55141753A (en) Method of fabricating semiconductor device
JPS54144880A (en) Method of fabricating semiconductor device
JPS56107581A (en) Method of manufacturing semiconductor device
JPS5772383A (en) Method of fabricating semiconductor device
JPS564268A (en) Method of forming semiconductor device
JPS5558520A (en) Method of manufacturing semiconductor device
JPS5553416A (en) Improvement of method of manufacturing semiconductor device
JPS5696868A (en) Method of manufacturing semiconductor device
JPS55132054A (en) Semiconductor device and method of fabricating same
JPS5588338A (en) Method of fabricating semiconductor device
JPS55143082A (en) Method of fabricating electroluminescent semiconductor device
JPS5591158A (en) Method of fabricating semiconductor device
JPS5596653A (en) Semiconductor device and method of fabricating same
JPS5693366A (en) Method of manufacturing semiconductor device
JPS5593271A (en) Method of fabricating integrated semiconductor device
JPS5588321A (en) Method of fabricating semiconductor device
JPS5575218A (en) Method of fabricating semiconductor device