JPS55126396A - Brazing material - Google Patents

Brazing material

Info

Publication number
JPS55126396A
JPS55126396A JP3459879A JP3459879A JPS55126396A JP S55126396 A JPS55126396 A JP S55126396A JP 3459879 A JP3459879 A JP 3459879A JP 3459879 A JP3459879 A JP 3459879A JP S55126396 A JPS55126396 A JP S55126396A
Authority
JP
Japan
Prior art keywords
solder
composite
temperature
raw material
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3459879A
Other languages
Japanese (ja)
Inventor
Yoshio Sekine
Hironobu Yamamoto
Takashi Nara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Priority to JP3459879A priority Critical patent/JPS55126396A/en
Publication of JPS55126396A publication Critical patent/JPS55126396A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires

Abstract

PURPOSE:To let the braze material of good brazing characteristic having joint strength close to that of ordinary sliver solder be obtained by heat-treating the composite raw material formed by hard solder and high-temperature solder and forming the dispersion layer of the both. CONSTITUTION:With the wire material composed of hard solder, such as silver solder, being made core material 1, this is dipped in the molten bath of high-temperature solder (e.g.,; Sn) to make the composite material formed with an overcoat 2. Next, this composite material is drawn to a desired outside diameter to provide a composite raw material 3. Thence, this raw material 3 is introduced into a heat- treating furnace which has been maintained at, e.g., 200 deg.C, and by continuously passing the material therethrough, the intended brazing material 4 is obtained. Namely, the application of the foregoing sufficient heat treatment causes an overall dispersion layer 5 to be formed through the dispersion of the hard solder of the core material component and high-temperature solder of the overcoat components over its entire area. The melting temperature of the resultant brazing material is 400-600 deg.C.
JP3459879A 1979-03-24 1979-03-24 Brazing material Pending JPS55126396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3459879A JPS55126396A (en) 1979-03-24 1979-03-24 Brazing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3459879A JPS55126396A (en) 1979-03-24 1979-03-24 Brazing material

Publications (1)

Publication Number Publication Date
JPS55126396A true JPS55126396A (en) 1980-09-30

Family

ID=12418771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3459879A Pending JPS55126396A (en) 1979-03-24 1979-03-24 Brazing material

Country Status (1)

Country Link
JP (1) JPS55126396A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197292A (en) * 1986-02-24 1987-08-31 Mitsubishi Metal Corp Solder material for assembling semiconductor device with less residual thermal strain
JPS63157458A (en) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd Lead pin
JPS63157457A (en) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd Lead pin
JPS63157456A (en) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd Lead pin and manufacture thereof
JP2019076939A (en) * 2017-10-26 2019-05-23 京セラ株式会社 Brazing material, junction structure, and semiconductor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51117148A (en) * 1975-04-07 1976-10-15 Nippon Handee Haaman Kk Silverrbrazing alloy without cadmium
JPS51128664A (en) * 1975-05-02 1976-11-09 Tanaka Precious Metal Ind Silverrbrazing alloy with low melting point

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51117148A (en) * 1975-04-07 1976-10-15 Nippon Handee Haaman Kk Silverrbrazing alloy without cadmium
JPS51128664A (en) * 1975-05-02 1976-11-09 Tanaka Precious Metal Ind Silverrbrazing alloy with low melting point

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197292A (en) * 1986-02-24 1987-08-31 Mitsubishi Metal Corp Solder material for assembling semiconductor device with less residual thermal strain
JPS63157458A (en) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd Lead pin
JPS63157457A (en) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd Lead pin
JPS63157456A (en) * 1986-12-22 1988-06-30 Tokuriki Honten Co Ltd Lead pin and manufacture thereof
JP2019076939A (en) * 2017-10-26 2019-05-23 京セラ株式会社 Brazing material, junction structure, and semiconductor package

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