RU94023956A - Solder for soldering products and method of soldering - Google Patents

Solder for soldering products and method of soldering

Info

Publication number
RU94023956A
RU94023956A RU94023956/08A RU94023956A RU94023956A RU 94023956 A RU94023956 A RU 94023956A RU 94023956/08 A RU94023956/08 A RU 94023956/08A RU 94023956 A RU94023956 A RU 94023956A RU 94023956 A RU94023956 A RU 94023956A
Authority
RU
Russia
Prior art keywords
soldering
solder
copper
products
wire
Prior art date
Application number
RU94023956/08A
Other languages
Russian (ru)
Other versions
RU2104850C1 (en
Inventor
В.Н. Семенов
В.А. Поспешилов
Е.А. Белов
Геза Сентдьерди
Дьердь Кеебе
Original Assignee
Научно-производственное объединение энергетического машиностроения им.акад.В.П.Глушко
Filing date
Publication date
Application filed by Научно-производственное объединение энергетического машиностроения им.акад.В.П.Глушко filed Critical Научно-производственное объединение энергетического машиностроения им.акад.В.П.Глушко
Priority to RU94023956A priority Critical patent/RU2104850C1/en
Priority claimed from RU94023956A external-priority patent/RU2104850C1/en
Priority to PCT/RU1994/000271 priority patent/WO1996000137A1/en
Publication of RU94023956A publication Critical patent/RU94023956A/en
Application granted granted Critical
Publication of RU2104850C1 publication Critical patent/RU2104850C1/en

Links

Claims (1)

Изобретение касается пайки изделий преимущественно массового производства с использованием припоя из меди в виде медной проволоки. Данное изобретение предусматривает использование припоя в виде проволоки (колец) диаметром 0,5 - 1,5 мм, покрытой слоем марганца толщиной 5 - 10 мкм, что составляет 0,5 - 1,0% от содержания меди. Пайку осуществляют в печи в среде аргона при температуре 1050-1090oC. Технический результат - отсутствие дефектов в паяных соединениях, упрощение процесса изготовления припоя, повышение его технологичности и безотходности.The invention relates to soldering products mainly mass production using copper solder in the form of copper wire. This invention involves the use of solder in the form of wire (rings) with a diameter of 0.5 - 1.5 mm, covered with a layer of manganese with a thickness of 5 - 10 microns, which is 0.5 - 1.0% of the copper content. Soldering is carried out in a furnace in an argon environment at a temperature of 1050-1090 o C. The technical result is the absence of defects in the solder joints, simplifying the process of making solder, increasing its manufacturability and wastelessness.
RU94023956A 1994-06-24 1994-06-24 Solder for soldering of articles and method of their soldering RU2104850C1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
RU94023956A RU2104850C1 (en) 1994-06-24 1994-06-24 Solder for soldering of articles and method of their soldering
PCT/RU1994/000271 WO1996000137A1 (en) 1994-06-24 1994-12-08 Solder for soldering articles and a method of soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU94023956A RU2104850C1 (en) 1994-06-24 1994-06-24 Solder for soldering of articles and method of their soldering

Publications (2)

Publication Number Publication Date
RU94023956A true RU94023956A (en) 1996-02-20
RU2104850C1 RU2104850C1 (en) 1998-02-20

Family

ID=20157715

Family Applications (1)

Application Number Title Priority Date Filing Date
RU94023956A RU2104850C1 (en) 1994-06-24 1994-06-24 Solder for soldering of articles and method of their soldering

Country Status (2)

Country Link
RU (1) RU2104850C1 (en)
WO (1) WO1996000137A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110281136A1 (en) * 2010-05-14 2011-11-17 Jenq-Gong Duh Copper-manganese bonding structure for electronic packages
KR20140054183A (en) * 2011-08-05 2014-05-08 워스텍, 인코포레이티드 Light emitting diode with nanostructured layer and methods of making and using

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3561099A (en) * 1968-03-27 1971-02-09 Western Gold & Platinum Co Process of making a composite brazing alloy of titanium, copper and nickel
SU500943A1 (en) * 1973-05-21 1976-01-30 Предприятие П/Я А-7697 Solder for soldering products
DE2829284A1 (en) * 1978-07-04 1980-01-17 Wagner Fa Ferd GOLD ALLOY WIRE FOR JEWELERY CHAINS
EP0038584B1 (en) * 1980-04-21 1984-08-15 BBC Aktiengesellschaft Brown, Boveri & Cie. Multi-layered-solder and method of producing such solder
US4448853A (en) * 1981-04-15 1984-05-15 Bbc Brown, Boveri & Company, Limited Layered active brazing material and method for producing it
DE3345219C1 (en) * 1983-12-14 1985-03-21 Daimler-Benz Ag, 7000 Stuttgart Soldering foil for the tension-free connection of ceramic bodies with metal

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