JPS63157458A - Lead pin - Google Patents
Lead pinInfo
- Publication number
- JPS63157458A JPS63157458A JP30609286A JP30609286A JPS63157458A JP S63157458 A JPS63157458 A JP S63157458A JP 30609286 A JP30609286 A JP 30609286A JP 30609286 A JP30609286 A JP 30609286A JP S63157458 A JPS63157458 A JP S63157458A
- Authority
- JP
- Japan
- Prior art keywords
- silver solder
- lead pin
- lead
- silver
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 81
- 238000009792 diffusion process Methods 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 14
- 229910052718 tin Inorganic materials 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004886 process control Methods 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 238000005219 brazing Methods 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000971 Silver steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野）
本発明は、ＩＣセラミックパッケージの外部端子などに
用いるリードピンに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to lead pins used as external terminals of IC ceramic packages.
〈従来の技術）
従来において、ＩＣセラミックパッケージの外部端子と
して用いるリードピンとしては、このリードピンをパッ
ケージの電極にろう接するための銀ろうが予めリードピ
ン本体の一端に接合されたものが知られている。このよ
うな銀ろうが接合されたり−ドピンの製造は次のように
して行われている。第４図に示すように、リードピン本
体１１の頭部上面１１ａに銀ろう片１３を載せた状態で
、これらを耐火性の治具１５にセットした後、これらを
銀ろうの融点以上の温度に加熱して銀ろう片１３を溶融
させる。この後に、溶融した銀ろうを凝固させて、第５
図に示すようにリードピン本体１１の上面１１ａに銀ろ
う部１７を形成し、これによって、リードピン１９を得
る。(Prior Art) Conventionally, lead pins used as external terminals of IC ceramic packages are known in which silver solder is bonded in advance to one end of the lead pin body for soldering the lead pins to electrodes of the package. The manufacture of such silver solder-bonded or doped pins is carried out as follows. As shown in FIG. 4, with the silver solder piece 13 placed on the top surface 11a of the head of the lead pin body 11, these pieces are set in a fireproof jig 15, and then heated to a temperature higher than the melting point of the silver solder. The silver solder piece 13 is melted by heating. After this, the molten silver solder is solidified and the fifth
As shown in the figure, a silver solder portion 17 is formed on the upper surface 11a of the lead pin body 11, thereby obtaining a lead pin 19.
（発明が解決しようとする問題点）
しかしながら、上述のように銀ろうを溶融させる工程を
経て製造されたリードビンにおいては、次のような問題
がある。(Problems to be Solved by the Invention) However, the lead bin manufactured through the process of melting silver solder as described above has the following problems.
（１）銀ろう片をその融点以上に加熱して溶融させた場
合において、溶融状態の銀ろうは第６図に示すように、
その表面張力によって椀形状にリードビン本体の頭部上
面１１ａに広がり、しかも高さが一定になることが理想
である。しかし、実際には、温度管理を厳密に行う等し
て工程管理に細心の注意を払っても、溶融した銀ろうの
一部は振動その他の要因でリードピン本体の頭部上面１
１ａから溢れてしまう。例えば、第６図に示すように、
溶融した銀ろう１７ａがり一ドビン本体の頭部外周面１
１ｂに流れ、あるいは第７図に示すように、リードピン
本体の頭部下側１１ｃの部分に廻り込んでしまう。この
結果、リードビン実装時の本ろう付けの際に必要とされ
るに足る量の銀ろう部を形成することが困難であり、ま
た、充分な銀ろう部を形成するために消費される銀ろ、
うが不必要に多量となってしまう上、ろう部の高さもば
らつき、結果的には、リードビンの全長がばらつくこと
になり、実装時に不都合である。(1) When a piece of silver solder is heated above its melting point and melted, the molten silver solder will be as shown in Figure 6.
Ideally, the surface tension spreads the top surface 11a of the head of the lead bin into a bowl shape, and the height remains constant. However, in reality, even if careful attention is paid to process control such as strict temperature control, some of the molten silver solder may be deposited on the upper surface of the head of the lead pin body due to vibration or other factors.
It overflows from 1a. For example, as shown in Figure 6,
Melted silver solder 17a - outer peripheral surface 1 of the head of the dobbin body
1b, or, as shown in FIG. 7, enter the lower head portion 11c of the lead pin body. As a result, it is difficult to form a sufficient amount of silver solder for the main brazing when mounting the lead bin, and the silver solder is consumed to form a sufficient amount of silver solder. ,
This results in an unnecessarily large amount of lead bins, and the height of the solder portion also varies, resulting in variation in the overall length of the lead bin, which is inconvenient during mounting.
（２）上述のように、溶融した銀ろうがリードピン本体
の頭部の下側に廻り込んでそこで凝固した場合には（第
７図参照）、その付着した銀ろうの分だけリードピン本
体の径が太くなってしまう。このような頭部下側への銀
ろう付着の検出は困難であり、かかるリードビンをその
まま用いた場合には、ろう付組み立ての際に、リードビ
ンを固定する固定用治具にリードビンを治めることが出
来ないという不具合が生ずる。かかる弊害は、ろう付組
み立て作業を自動化する場合の大きな障害となる。(2) As mentioned above, if the molten silver solder gets under the head of the lead pin body and solidifies there (see Figure 7), the diameter of the lead pin body will be equal to the amount of the attached silver solder. becomes thicker. It is difficult to detect such silver solder adhesion to the lower side of the head, and if such a lead bin is used as is, it will be difficult to secure the lead bin to the fixing jig that fixes it during brazing assembly. The problem arises that it is not possible. Such adverse effects become a major obstacle when automating brazing assembly work.
またこのように不必要な部分に付着した銀ろうは、実装
時に当該部分に応力が作用した場合に、その部分の組織
の結晶粒界に浸透してそこに亀裂を発生させる、いわゆ
る応力割れを惹起しリードビンの破折に至ることがあり
、実装パッケージに重大な欠陥を与えるおそれがある。In addition, silver solder attached to unnecessary areas can penetrate into the grain boundaries of the structure of that area and cause cracks, so-called stress cracking, when stress is applied to the area during mounting. This may lead to breakage of the lead bin, which may cause serious defects to the package.
（３）銀ろうは、従来のように一旦融点以上に加熱して
溶融、凝固を行うと、再度加熱した場合に於ける流動性
が低下する傾向があり、特にセラミックパッケージの外
部端子に多用される銀−銅二元系のろうにおいて顕著で
ある。即ち、従来品では、本ろう付けの際に、銀ろう本
来の優れた「ぬれ」性やつきまわりが阻害されている。(3) Once silver solder is heated above its melting point to melt and solidify as in the past, its fluidity tends to decrease when it is heated again, so it is often used especially for external terminals of ceramic packages. This is noticeable in silver-copper binary waxes. That is, with conventional products, the excellent "wetting" properties and throwing power inherent to silver solder are inhibited during main brazing.
そこで、このような従来技術の問題点を解決すために、
拡散接合法等を用いて、銀ろ、う部材を溶融することな
くリードピン本体に接合することが考えられる。Therefore, in order to solve the problems of the conventional technology,
It is conceivable to use a diffusion bonding method or the like to bond the silver filler member to the lead pin body without melting it.
このような方法によって銀ろう部材を取り付けるに当た
っては、銀ろう部材が溶融しないように、銀ろうの融点
よりもなるべく低い温度状態のもので拡散接合をおこな
うことが望ましい。また、この方法においては、銀ろう
部材が溶融されることなくリードピン本体に接合される
ことになるので、拡散接合工程に先立って銀ろう部材を
リードピン本体に載せた時の銀ろう部材の高さを一定に
なるようにしないと、リードビンの全長にばらつきが生
じてしまう。さらに、リードピン本体に銀ろう部材を載
せた後から拡散接合までの間においては、銀ろう部材は
単に載っているだけの不安定な状態にあるので、振動等
が加わると、リードピン本体から落下するおそれがある
。When attaching a silver solder member by such a method, it is desirable to perform diffusion bonding at a temperature as low as possible than the melting point of the silver solder so that the silver solder member does not melt. In addition, in this method, the silver solder material is bonded to the lead pin body without being melted, so the height of the silver solder material when placed on the lead pin body prior to the diffusion bonding process is If it is not kept constant, the overall length of the lead bin will vary. Furthermore, after the silver solder material is placed on the lead pin body until diffusion bonding, the silver solder material is in an unstable state where it is simply placed on the lead pin body, so if vibration etc. are applied, it may fall off the lead pin body. There is a risk.
本発明の目的は、上記の各問題点を解消した銀ろう付の
リードビンを提供することにある。An object of the present invention is to provide a silver soldered lead bin that solves the above-mentioned problems.
（問題点を解決するための手段）
上記の目的を達成するために、本発明のリードビンは、
リードピン本体における銀ろう部材の接合面の少なくと
も一部分が湾曲面あるいは凹部とされ、この湾曲面ある
いは凹部に、拡散接合を容易にするための接合助材とし
ての金属を介してほぼ球体形状の銀ろう部材が拡散接合
された構成を有している。(Means for solving the problems) In order to achieve the above object, the lead bin of the present invention has the following features:
At least a portion of the bonding surface of the silver solder member in the lead pin body is a curved surface or a recess, and approximately spherical silver solder is applied to this curved surface or recess through a metal as a bonding aid to facilitate diffusion bonding. It has a structure in which members are diffusion bonded.
（作用）
本発明のリードビンの製造においては、銀ろう部材を落
下あるいは振込によってリードピン本体：こ載せると、
球形の銀ろう部材はリードピン本体に形成した湾曲面ま
たは凹部に案内されて、位置エネルギーの最も低い位置
に安定した状態で止まる。従って、この湾曲面または凹
部の中心が銀ろう部材接合面の中心に位置するように形
成しておけば、常にその中心位置に銀ろう部材が安定し
た状態で設置されることになる。また、銀ろう部材は球
形をしているので、リードビン本体への載せ方にかかわ
りなく、その高さが常に一定になる。(Function) In manufacturing the lead bin of the present invention, when the silver solder member is placed on the lead pin body by dropping or transferring,
The spherical silver solder member is guided by the curved surface or recess formed in the lead pin body, and stably stops at the position of the lowest potential energy. Therefore, if the center of this curved surface or recess is formed to be located at the center of the silver solder member joint surface, the silver solder member will always be stably installed at the center position. Furthermore, since the silver solder member has a spherical shape, its height is always constant regardless of how it is placed on the lead bin body.
次に、このようにリードピン本体に載せた銀ろう部材は
拡散速度の速い金属を介して湾曲面に拡散接合される。Next, the silver solder member placed on the lead pin body in this manner is diffusion bonded to the curved surface via a metal with a high diffusion rate.
従って、銀ろう部材は銀ろうの融点よりも逃かに低い雰
囲気温度の下で拡散接合が行われる。この結果、銀ろう
部材は実質的に熔融せず原形をそのまま留めており、従
来法のように溶融した銀ろうがリードビン本体の頂部上
面から銀ろうが流れ落ちることはない。また、このよう
に溶融、凝固を経ることなくリードビン本体に接合され
た銀ろうは本来の流動特性をそのまま保持しており、本
ろう付け時（パフケージングの際における電極との接合
時）においては、加熱温度が所定の値を超えると同時に
流動が起こり、ろう付；すがろう本来の特性を損なうこ
となく確実に行われる。Therefore, diffusion bonding of silver solder members is performed at an ambient temperature significantly lower than the melting point of the silver solder. As a result, the silver solder member does not substantially melt and retains its original shape, and the molten silver solder does not flow down from the top surface of the lead bin body as in the conventional method. In addition, the silver solder that is bonded to the lead bin body without undergoing melting and solidification retains its original flow characteristics, and during the actual brazing (when bonding to the electrode during puff caging). , flow occurs as soon as the heating temperature exceeds a predetermined value, and brazing is reliably performed without impairing the original properties of the brazing wax.
この点を、銀−銅二元系ろうを例にして説明する。この
二元系ろうの組織は、銀に富んだα相、銅に富んだβ相
および（α＋β）相で構成されており、製品に至るまで
の組成加工と焼鈍の繰り返しによってほぼ均一な組織を
示す。このため、加熱すると、銀と銅の成分比によって
決定される融点で融解が始まり、その流動点に達すると
同時に急速に流動が始まる。しかしながら、従来の銀ろ
うクラフトリードピンの場合のように、一旦溶融凝固を
経た後のろう組織は、銀に富んだα相、鋼に富んだβ相
および（α＋β）相とが明確に分がれたマクロ的混合体
となってしまう。そのため、融解は、共晶組成相から始
まり、次に高融点をもった相へと徐々に溶は進むので、
上記の未溶融のろうに比べて、時間的に遅く流動を開始
するとともにそれが極めて緩慢に進行する。この結果、
ろうとしての流動性、ぬれ性が悪く、ろう付け欠陥の発
生確率が高くなってしまう。これに対して、本発明の方
法によってリードビン本体に取り付けたろうは、均質な
組織のままであるので、流動性およびぬれ性が好適な状
態に保持されている。This point will be explained using a silver-copper binary wax as an example. The structure of this binary solder is composed of a silver-rich α phase, a copper-rich β phase, and an (α+β) phase, and a nearly uniform structure is achieved through repeated compositional processing and annealing until the product is manufactured. show. Therefore, when heated, it begins to melt at a melting point determined by the component ratio of silver and copper, and as soon as that pour point is reached, it begins to flow rapidly. However, as in the case of conventional silver solder craft lead pins, once melted and solidified, the solder structure is clearly separated into a silver-rich α phase, a steel-rich β phase, and an (α+β) phase. This results in a macroscopic mixture. Therefore, melting starts from the eutectic composition phase and then gradually progresses to the phase with a high melting point.
Compared to the above-mentioned unmolten wax, the flow starts later in time and progresses very slowly. As a result,
It has poor fluidity and wettability as a solder, and increases the probability of occurrence of brazing defects. On the other hand, the solder attached to the lead bin body by the method of the present invention remains in a homogeneous structure, so that its fluidity and wettability are maintained in a suitable state.
〈発明の効果）
このように、本発明によれば、銀ろう部材はその融点よ
りも遥かに低い温度条件下で実質的に溶融凝固を経るこ
となくリードビン本体に接合されている。従って、従来
の欠点である、溶融いた銀ろうがリードビン本体の頂部
上面から流れ、不必要な部分に付着することに起因する
上述の各種弊害を回避することが可能になる。<Effects of the Invention> As described above, according to the present invention, the silver solder member is joined to the lead bin body at a temperature much lower than its melting point without substantially undergoing melting and solidification. Therefore, it is possible to avoid the above-mentioned various disadvantages caused by molten silver solder flowing from the top surface of the lead bin body and adhering to unnecessary parts, which is a conventional drawback.
また、リードピン端面に形成された湾曲面または凹部に
より、銀ろうが確実に端面に中心に位置するようになり
、従来のフラット端面タイプの場合に丸角おこりがちで
あった位置すれを解消できるという効果かえられる。し
かも接合されている銀ろう部材の高さが一定となったリ
ードピンを確実に得ることもでる。In addition, the curved surface or recess formed on the end face of the lead pin ensures that the silver solder is centered on the end face, eliminating misalignment that tends to occur with rounded corners with conventional flat end face types. The effect can be changed. Moreover, it is also possible to reliably obtain a lead pin in which the height of the silver solder member being joined is constant.
さらに、銀ろう部材の組織は実質的にその取り付け前の
均一な状態のままであり、銀ろうの流動性、ぬれ性を良
好な状態に保持したままで本ろう付けを行うことができ
、以て、好適なろう付けを達成することができる。Furthermore, the structure of the silver solder member remains substantially in the uniform state before installation, and main brazing can be performed while maintaining the fluidity and wettability of the silver solder in good condition. Thus, suitable brazing can be achieved.
（実施例）
以下に、第１図ないし第３図を参照して、本発明の詳細
な説明する。(Example) The present invention will be described in detail below with reference to FIGS. 1 to 3.
第１１ｆｆｌは本発明にしたがって製造したリードピン
の一例を示す図である。図に示すように、このリードピ
ン１は、リードビン本体３と、全周面に錫被覆層６が３
μ形成された銀ろう部材５からなり、リードビン本体３
の頂部上面３１ｂに球形の銀ろう部材５が拡散接合され
た構造となっている。11th ffl is a diagram showing an example of a lead pin manufactured according to the present invention. As shown in the figure, this lead pin 1 has a lead bin body 3 and a tin coating layer 6 on the entire circumference.
The lead bin body 3 is made of a silver solder member 5 formed with μ.
It has a structure in which a spherical silver solder member 5 is diffusion-bonded to the top upper surface 31b.
第２図に示すように、上記のリードビン本体３は、円盤
状の頭部３１と、この下面３１ａに同軸状に形成された
円柱状の１８部３３とからなっている。頭Ｒ３１の上面
３１ｂには、この上面と同心円状の湾曲面３１ｃが形成
されている。この湾曲面の曲率半径は銀ろう部材よりも
大きな値に設定されている。各部分の寸法例を挙げると
、上記の頭部は、その直径が ０．７５ｍｍ、厚さが０
．２−であり、上記脚部は、その直径が０．４４ｍｍ、
脚長が４．５ｍｍである。かかる形状のり−ドビン本体
は、コバールから形成されている。As shown in FIG. 2, the lead bin main body 3 includes a disk-shaped head 31 and a cylindrical 18-section 33 coaxially formed on the lower surface 31a. A curved surface 31c concentric with the upper surface is formed on the upper surface 31b of the head R31. The radius of curvature of this curved surface is set to a larger value than that of the silver solder member. To give an example of the dimensions of each part, the above head has a diameter of 0.75 mm and a thickness of 0.
．． 2-, and the leg has a diameter of 0.44 mm,
The leg length is 4.5 mm. The shaped dobbin body is formed from Kovar.
上記の銀ろう部材５はほぼ球形をしており、外周面に錫
めっきが施されている。錫めっきを施すためには、従来
から知られている電気めっき法なぢを用いればよい。こ
の銀ろう部材は、上記のリードビン本体の頂部上面内に
納まる大きさとなっており、上記の寸法を有するリード
ピン本体に対しては、この銀ろう部材の直径を０．５７
０１１１１とすればよい。また、この銀ろう部材は８５
銀−鋼合金からなっている。The silver brazing member 5 has a substantially spherical shape, and its outer peripheral surface is tin-plated. In order to apply tin plating, a conventionally known electroplating method may be used. This silver solder member is sized to fit within the top surface of the lead pin body, and for a lead pin body having the above dimensions, the diameter of this silver solder member is 0.57 mm.
It may be set to 01111. Also, this silver solder member is 85
Made of silver-steel alloy.
次に、リードピン本体３と銀ろう部材５との接合工程を
説明する。まず、銀ろう部材５を落下あるいは振込によ
ってリードピン本体３の上面３１ｂに載せる。ここに、
上面３１には湾曲面３１ｃが形成されているので、銀ろ
う部材５は湾曲面に案内されて転がり、最も深い中心位
置に自然に止まる。次に、第３図に示すように、これら
を耐火性の治具７内にセットする。この後、これらを、
窒素と水素との混合比を５＝１に調整した雰囲気炉中に
入れて、６６０℃で６分間加熱する。このようにして、
銀ろう部材５の原形をほぼそのままに留め、溶融するこ
ともなく、リードビン本体頂部の上面に形成した湾曲面
３１ｃに拡散接合する。Next, the process of joining the lead pin body 3 and the silver solder member 5 will be explained. First, the silver solder member 5 is placed on the upper surface 31b of the lead pin body 3 by dropping or transferring. Here,
Since a curved surface 31c is formed on the upper surface 31, the silver solder member 5 is guided by the curved surface and rolls, and naturally stops at the deepest center position. Next, as shown in FIG. 3, these are set in a fireproof jig 7. After this, these
It is placed in an atmosphere furnace in which the mixing ratio of nitrogen and hydrogen is adjusted to 5=1, and heated at 660° C. for 6 minutes. In this way,
The original shape of the silver soldering member 5 is kept almost as it is, and it is diffusion bonded to the curved surface 31c formed on the top surface of the lead bin main body without melting.
このようにして製造されたリードビンにおいては、銀ろ
う部材が取り付けられていない欠陥品の発生率が極めて
小さく、また接合された銀ろう部材の高さもばらつきが
極めて少なかった。また、銀ろうよりも低温で拡散し易
い錫被覆層６の存在によって拡散接合工程における初拡
散が著しく促進され、銀ろう部材を直接に拡散接合する
場合に比べてより低い温度で、しかも緩い工程管理条件
下で好適な拡散接合が達成できた。In the lead bins manufactured in this way, the incidence of defective products to which no silver solder members were attached was extremely low, and the heights of the joined silver solder members also had very little variation. In addition, the initial diffusion in the diffusion bonding process is significantly promoted by the presence of the tin coating layer 6, which is easier to diffuse at a lower temperature than silver solder, and the process is lower and more gradual than when directly diffusion bonding silver solder parts. Suitable diffusion bonding was achieved under controlled conditions.
なお、錫量外の接合助材用の金属としては、低融点（５
００℃以下）金属あるいは銀ろうの成分、特にＡｇと低
融点合金を形成し、低温で拡散するＳｉ、Ｇｅ、Ｓｎ、
ＰｂのｒＶｂ族や、Ｉｎ、Ｇａ等のｍｂ族、Ｚｎ、Ｃｄ
、Ｈｇのｍｂ族等の元素およびそれらの合金が用いられ
る。ここに挙げた元素の中には、銀ろうの成分として用
いられる元素や蒸気圧の高い元素もあり、ＩＣの種類に
よっては好ましくない場合もある。例えば、Ｂｅ、Ｍｇ
、Ｃａ、Ｂａ、Ｒａの［ａ族は好ましくない場合がある
。In addition, metals with a low melting point (5
00℃ or less) metals or components of silver solder, especially Si, Ge, Sn, which forms low melting point alloys with Ag and diffuses at low temperatures.
rVb group of Pb, mb group such as In, Ga, Zn, Cd
, Hg, mb group elements, and alloys thereof. Among the elements listed here, there are elements used as components of silver solder and elements with high vapor pressure, which may be undesirable depending on the type of IC. For example, Be, Mg
, Ca, Ba, and Ra may not be preferred.
なお上述の例における各部分の寸法および組成は、それ
らの−例を示すものであり、特に、湾曲面の形状につい
ては理想的には銀ろうの形状に相応した曲面をもとこと
が望ましいが、実用上は銀ろうが安定して位置すること
のできる凹部を備えていればよく、所謂ポンチ穴のよう
な形状でも何ら差し支えなく、本発明をこれらに限定す
ることを意図するもではない。Note that the dimensions and composition of each part in the above example are just examples, and in particular, it is ideally desirable to have a curved surface that corresponds to the shape of the silver solder. In practice, it is sufficient that the recess is provided with a recess in which the silver solder can be stably positioned, and a so-called punch hole-like shape is also acceptable, and the present invention is not intended to be limited to this.
第１図は本発明の一実施例のリードビンを示す斜視図、
第２図は第１図のリードピン本体を示す側面図、第３図
は銀ろう部材の接合工程を説明する断面図、第４図は従
来の銀ろう接合方法を示す断面図、第５図は溶融した銀
ろうの理想的な状態を示す側面図、第６図および第７図
はり−ドビン本体の頂部上面から流れた銀ろうの状態を
示す側面図である。
１・ リードビン
３・ リードピン本体
５ 銀ろう部材
６ 錫被覆層
７− 治具
３１− リードピン本体の頂部
３１２ 頂部下面
３１ｂ ・頂部上面
３１Ｃ湾曲面
３３−・ 脚部
第２図
第４図FIG. 1 is a perspective view showing a lead bin according to an embodiment of the present invention;
Fig. 2 is a side view showing the lead pin body of Fig. 1, Fig. 3 is a sectional view illustrating the joining process of silver soldering members, Fig. 4 is a sectional view showing the conventional silver soldering method, and Fig. 5 is a sectional view showing the conventional silver soldering method. FIGS. 6 and 7 are side views showing the ideal state of molten silver solder, and side views showing the state of silver solder flowing from the upper surface of the top of the beam-dobbin body. 1. Lead bin 3. Lead pin body 5. Silver brazing member 6. Tin coating layer 7. - Jig 31. - Top part 312 of lead pin main body.
Claims (1)
ードピンであって、リードピン本体と、このリードピン
本体の一方の端面に取り付けたほぼ球体形状をした銀ろ
う部材とからなり、前記リードピン本体の銀ろう取り付
け面の少なくとも一部分には、湾曲面または凹部を有す
る面が形成されており、当該湾曲面に対して、前記銀ろ
う部材が銀ろうの融点より低い温度で拡散し、接合助材
として機能する金属を介して拡散接合されていることを
特徴とするリードピン。A lead pin used for an external terminal of an IC ceramic package, etc., and consists of a lead pin body and a silver solder member having a substantially spherical shape attached to one end surface of the lead pin body, and at least the silver solder attachment surface of the lead pin body. A curved surface or a surface having a concave portion is formed in one part, and the silver solder member diffuses into the curved surface at a temperature lower than the melting point of the silver solder, and spreads through the metal that functions as a joining aid. A lead pin characterized by being diffusion bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30609286A JPS63157458A (en) | 1986-12-22 | 1986-12-22 | Lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30609286A JPS63157458A (en) | 1986-12-22 | 1986-12-22 | Lead pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157458A true JPS63157458A (en) | 1988-06-30 |
Family
ID=17952932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30609286A Pending JPS63157458A (en) | 1986-12-22 | 1986-12-22 | Lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157458A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8287550B2 (en) | 2000-06-26 | 2012-10-16 | Stryker Spine | Bone screw retaining system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126396A (en) * | 1979-03-24 | 1980-09-30 | Tokuriki Honten Co Ltd | Brazing material |
| JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
| JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
-
1986
- 1986-12-22 JP JP30609286A patent/JPS63157458A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126396A (en) * | 1979-03-24 | 1980-09-30 | Tokuriki Honten Co Ltd | Brazing material |
| JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
| JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8287550B2 (en) | 2000-06-26 | 2012-10-16 | Stryker Spine | Bone screw retaining system |
| US8734496B2 (en) | 2000-06-26 | 2014-05-27 | Stryker Spine | Bone screw retaining system |
| US9186189B2 (en) | 2000-06-26 | 2015-11-17 | Stryker Spine | Bone screw retaining system |
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