JPS63136552A - Lead pin and manufacture thereof - Google Patents
Lead pin and manufacture thereofInfo
- Publication number
- JPS63136552A JPS63136552A JP28233686A JP28233686A JPS63136552A JP S63136552 A JPS63136552 A JP S63136552A JP 28233686 A JP28233686 A JP 28233686A JP 28233686 A JP28233686 A JP 28233686A JP S63136552 A JPS63136552 A JP S63136552A
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- silver solder
- pin body
- silver
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910000679 solder Inorganic materials 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000008018 melting Effects 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000005304 joining Methods 0.000 abstract description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000001257 hydrogen Substances 0.000 abstract description 2
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 239000011819 refractory material Substances 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ＩＣセラミックパッケージの外部端子などに
用いるリードビン右よびその製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead bin used as an external terminal of an IC ceramic package and a method of manufacturing the same.
（従来の技術）
従来において、ＩＣセラミックパッケージの外部端子と
して用いるリードピンとしては、このリードピンをパッ
ケージの電極にろう接するための銀ろうが予めリードピ
ン本体の一端に接合されたものが知られている。このよ
うな銀ろうが接合されたリードピンの製造は次のように
して行われている。第６図に示すように、リードピン本
体１１０頭部上面１１ａに銀ろう片１３を載せた状態で
、これらを耐火性の治具１５にセットした後、これらを
銀ろうの融点以上の温度に加熱して銀ろう片１３を溶融
させる。この後に、溶融した銀ろうを凝固させて、第７
図に示すようにリードピン本体１１の上面１１ａに銀ろ
う部１７を形成し、これによって、リードピン１９を得
る。(Prior Art) Conventionally, as a lead pin used as an external terminal of an IC ceramic package, one in which a silver solder for soldering the lead pin to an electrode of the package is bonded in advance to one end of the lead pin body is known. Lead pins bonded with silver solder are manufactured as follows. As shown in FIG. 6, with the silver solder piece 13 placed on the top surface 11a of the head of the lead pin body 110, these pieces are set in a fireproof jig 15, and then heated to a temperature higher than the melting point of the silver solder. to melt the silver solder piece 13. After this, the molten silver solder is solidified and the seventh
As shown in the figure, a silver solder portion 17 is formed on the upper surface 11a of the lead pin body 11, thereby obtaining a lead pin 19.
（発明が解決しようとする問題点）
しかしながら、上述のように銀ろうを溶融させる工程を
経て製造されたり−ドビンにおいては、次のような問題
がある。(Problems to be Solved by the Invention) However, there are the following problems with dobins manufactured through the process of melting silver solder as described above.
（１〕 銀ろう片をその融点以上に加熱して溶融させ
た場合において、溶融状態の銀ろうは第７図に示すよう
に、その表面張力によって椀形状にリードピン本体の頭
部上面１１ａに広がり、しかも高さが一定になることが
理想である。しかし、実際には、温度管理を厳密に行う
等して工程管理に細心の注意を払っても、溶融した銀ろ
うの一部は振動その他の要因でリードピン本体の頭部上
面１１ａから溢れてしまう。例えば、第８図に示すよう
に、溶融した銀ろう１７ａがリードピン本体の頭部外周
面１１ｂに流れ、あるいは第９図に示すように、リード
ピン本体の頭部下側１１ｃの部分に廻り込んでしまう。(1) When a piece of silver solder is heated above its melting point and melted, the molten silver solder spreads into a bowl shape on the top surface 11a of the head of the lead pin body due to its surface tension, as shown in Figure 7. Ideally, the height would be constant.However, in reality, even if careful attention is paid to process control such as strict temperature control, some of the molten silver solder may be affected by vibrations or other For example, as shown in FIG. 8, molten silver solder 17a flows onto the outer peripheral surface 11b of the head of the lead pin body, or as shown in FIG. , it goes around the lower head portion 11c of the lead pin body.
この結果、リードビン実装時の本ろう付けの際に必要と
されるに足る量の銀ろう部を形成することが困難であり
、また、充分な銀ろう部を形成するために消費される銀
ろうが不必要に多量となってしまう上、ろう部の高さも
ばらつき、結果的には、リードピンの全長がばらつくこ
とになり、実装時に不都合である。As a result, it is difficult to form a sufficient amount of silver solder for the main brazing when mounting the lead bin, and the silver solder is consumed to form a sufficient amount of silver solder. This results in an unnecessarily large amount of lead pins, and the height of the solder portion also varies, resulting in variation in the overall length of the lead pin, which is inconvenient during mounting.
（２） 上述のように、溶融した銀ろうがリードピン
本体の頭部の下側に廻り込んでそこで凝固した場合には
（第９図参照）、その付着した銀ろうの分だけリードピ
ン本体の径が太くなってしまう。このような頭部下側へ
の銀ろう付着の検出は困難であり、かかるリードピンを
そのまま用いた場合には、ろう付組み立ての際に、リー
ドビンを固定する固定用治具にリードビンを治めること
が出来ないという不具合が生ずる。かかる弊害は、ろう
付組み立て作業を自動化する場合の大きな障害となる。(2) As mentioned above, if the molten silver solder gets under the head of the lead pin body and solidifies there (see Figure 9), the diameter of the lead pin body will be reduced by the amount of the adhered silver solder. becomes thicker. It is difficult to detect such adhesion of silver solder to the lower side of the head, and if such lead pins are used as they are, the lead bin cannot be fixed to the fixing jig that fixes the lead bin during brazing assembly. The problem arises that it cannot be done. Such adverse effects become a major obstacle when automating brazing assembly work.
またこのように不必要な部分に付着した銀ろうは、実装
時に当該部分に応力が作用した場合に、その部分の組織
の結晶粒界に浸透してそこに亀裂を発生させる、いわゆ
る応力割れを惹起しリードピンの破折に至ることがあり
、実装パッケージに重大な欠陥を与えるおそれがある。In addition, silver solder attached to unnecessary areas can penetrate into the grain boundaries of the structure of that area and cause cracks, so-called stress cracking, when stress is applied to the area during mounting. This may lead to breakage of the lead pins, which may cause serious defects to the mounted package.
（３） 銀ろうは、従来のように一旦融点以上に加熱
して溶融、凝固を行うと、再度加熱した場合に於ける流
動性が低下する傾向があり、特にセラミックパッケージ
の外部端子に多用される銀−銅二元系のろうにおいて顕
著である。即ち、従来品では、本ろう付けの際に、銀ろ
う本来の優れた「ぬれ」性やつきまわりが阻害されてい
る。(3) Once silver solder is heated above its melting point to melt and solidify as in the past, its fluidity tends to decrease when it is heated again, so it is often used especially for external terminals of ceramic packages. This is noticeable in silver-copper binary waxes. That is, with conventional products, the excellent "wetting" properties and throwing power inherent to silver solder are inhibited during main brazing.
本発明の目的は、上記の各問題点を解消した銀ろう付の
リードリードピンおよびその製造方法を提供することに
ある。An object of the present invention is to provide a silver soldered lead pin and a method for manufacturing the same, which solves the above-mentioned problems.
（問題点を解決するための手段）
上記の目的を達成するために、本発明のリードビンにお
いては、リードピン本体の一方の端面に対して、銀ろう
部材を完全には溶融することなく、しかも供給時の原形
をほぼそのまま留めて接合するようにしている。かかる
接合状態を形成するための好適な方法として、本発明に
よる拡散接合法がある。(Means for Solving the Problems) In order to achieve the above object, in the lead bin of the present invention, the silver solder material is not completely melted and is supplied to one end surface of the lead pin body. I try to keep the original shape almost as it is and join it together. A suitable method for forming such a bonded state is the diffusion bonding method according to the present invention.
（作 用）
本発明のリードピンにおいては、銀ろう部材をリードピ
ン本体に接合する際には、銀ろう部材は実質的には溶融
せず、したがって原形をほぼそのままに留めており、従
来法のように溶融することはないので、リードピン本体
の頂部上面から流れ落ちることはなく、銀ろう部材の全
てが、本ろう付ケ（パッケージングの取における電極と
の接合）のために利用される二とになる。(Function) In the lead pin of the present invention, when the silver solder member is joined to the lead pin main body, the silver solder member is not substantially melted and therefore retains its original shape almost as it is, unlike the conventional method. Since it does not melt, it does not flow down from the top surface of the lead pin body, and all of the silver solder material is used for the main brazing part (joining with the electrode in the packaging). Become.
また、銀ろうが溶融、凝固を経ることなくリードピン本
体に接合されることになるので、銀ろうは本来の流動特
性をそのまま保持しており、本ろう付は時においては、
加熱温度が所定の値を超えると同時に流動が起こり、ろ
う付けがろう本来の特性を損なうことなく確実に行われ
る。In addition, since the silver solder is bonded to the lead pin body without going through melting and solidification, the silver solder retains its original flow characteristics, and in some cases, real brazing
Flow occurs as soon as the heating temperature exceeds a predetermined value, ensuring that brazing is performed without impairing the inherent properties of the solder.
この点を、銀−銅二元系ろうを例にして説明する。この
二元系ろうの組織は、銀に富んだα相、銅に冨んだβ相
および（α＋β）相で構成されており、製品に至るまで
の組成加工と焼鈍の繰り返しによってほぼ均一な組織を
示す。このため、加熱すると、銀と銅の成分比によって
決定される融点で融解が始まり、その流動点に達すると
同時に急速に流動が始まる。しかしながら、従来の銀ろ
うクラッドリードピンの場合のように、一旦溶融凝固を
経た後のろう組織は、銀に富んだα相、銅に富んだβ相
および（α＋β）相とが明確に分かれたマクロ的混合体
となってしまう。そのため、融解は、共晶組成相から始
まり、次に高融点をもった相へと徐々に溶は進むので、
上記の未溶融のろうに比べて、時間的に遅く流動を開始
するとともにそれが極めて緩慢に進行する。この結果、
ろうとしての流動性、ぬれ性が悪く、ろう付は欠陥の発
生確率が高ぐなってしまう。これに対して、本発明の方
法によってリードピン本体に取り付けたろうは、均質な
組織のままであるので、流動性およびぬれ性が好適な状
態に保持されている。This point will be explained using a silver-copper binary wax as an example. The structure of this binary solder is composed of a silver-rich α phase, a copper-rich β phase, and an (α+β) phase, and it has a nearly uniform structure through repeated compositional processing and annealing until it is finished. shows. Therefore, when heated, it begins to melt at a melting point determined by the component ratio of silver and copper, and as soon as that pour point is reached, it begins to flow rapidly. However, as in the case of conventional silver solder clad lead pins, once melted and solidified, the solder structure is a macroscopic structure with clearly separated silver-rich α phase, copper-rich β phase, and (α+β) phase. It ends up being a mixed bag. Therefore, melting starts from the eutectic composition phase and then gradually progresses to the phase with a high melting point.
Compared to the above-mentioned unmolten wax, the flow starts later in time and progresses very slowly. As a result,
The fluidity and wettability of brazing are poor, and the probability of defects occurring during brazing is high. On the other hand, since the solder attached to the lead pin body by the method of the present invention remains in a homogeneous structure, its fluidity and wettability are maintained in a suitable state.
（発明の効果）
このように、本発明のリードピンによれば、銀ろう部材
は実質的に溶融凝固を経ることなくリードピン本体に接
合されるので、従来の欠点である、溶融した銀ろうがリ
ードピン本体の頂部上面から流れ、不必要な部分に付着
してしまうという弊害を回避することが可能になり、リ
ードピン全体のばらつきも少なく、実装時の自動化が歩
留りよく行われ、銀ろうを節約できる等の利点が得られ
る。(Effects of the Invention) As described above, according to the lead pin of the present invention, the silver solder member is joined to the lead pin body without substantially undergoing melting and solidification. It is possible to avoid the negative effects of flowing from the top surface of the main body and adhering to unnecessary parts, there is less variation in the overall lead pin, automation during mounting can be performed with high yield, and silver solder can be saved. Benefits can be obtained.
また、銀ろう部材の組織は実質的にその取り付は前の均
一な状態のままであり、銀ろうの流動性、ぬれ性を良好
な状態に保持したままで本ろう付けを行うことができ、
以て、好適なろう付けを達成することができる。In addition, the structure of the silver solder component remains substantially the same as before, and the main brazing can be performed while maintaining the fluidity and wettability of the silver solder in good condition. ,
Thus, suitable brazing can be achieved.
（実施例）
以下に、第１図ないし第５図を参照して、本発明の詳細
な説明する。(Example) The present invention will be described in detail below with reference to FIGS. 1 to 5.
第１図は本発明の方法によって製造したリードピンの一
例を示す図である。図に示すように、このリードピン１
は、リードピン本体３と銀ろう部材５からなり、リード
ピン本体３の頂部上面３１ｂに銀ろう部材５が拡散接合
された構造となっている。FIG. 1 is a diagram showing an example of a lead pin manufactured by the method of the present invention. As shown in the figure, this lead pin 1
is composed of a lead pin body 3 and a silver solder member 5, and has a structure in which the silver solder member 5 is diffusion bonded to the top upper surface 31b of the lead pin body 3.
第２図に示すように、上記のリードピン本体３は、円盤
状の頭１ｍ３１と、この下面３１ａに同軸状に形成され
た円柱状の脚部３３とからなっている。各部分の寸法例
を挙げると、上記の頭部は、その直径が０．７５ｍｍ５
厚さが０．２ ｍｍであり、上記脚部は、その直径が０
．４４正、脚長が４．５ ａｏｎである。かかる形状の
リードピン本体は、コバールから形成されている。As shown in FIG. 2, the lead pin main body 3 includes a disk-shaped head 1m31 and a cylindrical leg 33 coaxially formed on the lower surface 31a. To give an example of the dimensions of each part, the above head has a diameter of 0.75mm5
The thickness is 0.2 mm, and the leg has a diameter of 0.2 mm.
．． 44 positive, leg length is 4.5 aon. The lead pin main body having such a shape is made of Kovar.
第３図に示すように、上記の銀ろう部材５は、正方形断
面の線材５１から切断して得たものであり、はぼ立方体
をしている。この銀ろう部材は、上記のリードピン本体
の頂部上面内に納まる大きさとなって、おり、上記の寸
法を有するリードピン本体に対しては、この銀ろう部材
の一辺の寸法を０、４６ ＋ｎ＋ｎとすればよい。また
、この銀ろう部材は８５銀−銅合金からなっている。As shown in FIG. 3, the silver brazing member 5 is obtained by cutting a wire rod 51 having a square cross section, and has a substantially cubic shape. This silver solder member has a size that fits within the top surface of the lead pin body, and for a lead pin body having the above dimensions, the dimension of one side of this silver solder member should be 0, 46 + n + n. Bye. Further, this silver solder member is made of 85 silver-copper alloy.
次に、リードピン本体３と銀ろう部材５との接合工程を
説明する。まず、リードピン本体３と銀ろう部材５とを
、第４図に示すように、リードピン本体の頂部上面３１
ｂに銀ろう部材５が載った状態で、耐火性の治具７内に
セットする。この後、これらを、窒素と水素との混合比
を５：ｌに調整した雲囲気炉中に入れて、７６０℃で１
０分間加熱する。このようにして、銀ろう部材５の原形
をほぼそのままに留め、溶融することもなく、リードピ
ン本体頂部の上面３１ｂに拡散接合する。Next, the process of joining the lead pin body 3 and the silver solder member 5 will be explained. First, as shown in FIG.
With the silver soldering member 5 placed on b, set it in a fireproof jig 7. Thereafter, these were placed in a cloud-enclosed furnace in which the mixing ratio of nitrogen and hydrogen was adjusted to 5:l, and heated to 760°C for 1 hour.
Heat for 0 minutes. In this way, the original shape of the silver soldering member 5 is kept almost as it is, and it is diffusion bonded to the upper surface 31b of the top of the lead pin main body without melting.
ここで、上記の方法によって形成したリードピンと、溶
融することによって銀ろう部を形成した従来の銀ろう付
リードピンとの流動性を、フィレット高さを測定するこ
とによって比較した。すなわち、本発明のリードピンと
しては上記寸法のものを５本用い、従来例のものとして
は、本発明の銀ろうクラッドリードピンと同量（約１ミ
リグラム）の銀ろうを有するものを同じく５本用いて、
第５図に示すように、これらリードピンＡをニッケル板
Ｂにろう接した場合のフィレット高さＨを測定した。Here, the fluidity of the lead pin formed by the above method and a conventional silver brazed lead pin in which a silver solder portion was formed by melting were compared by measuring the fillet height. That is, five lead pins of the above dimensions were used as the lead pins of the present invention, and five lead pins having the same amount (approximately 1 milligram) of silver solder as the silver solder clad lead pins of the present invention were used as conventional examples. hand,
As shown in FIG. 5, the fillet height H when these lead pins A were brazed to the nickel plate B was measured.
この比較結果を次に掲げる表に示す。The results of this comparison are shown in the table below.
上記の表から明らかなように、従来のものにに比べて本
発明のものは、フィレット高さが２倍以上となっており
、銀ろうの流動性がより良好な状態に保持されている。As is clear from the above table, the fillet height of the present invention is more than double that of the conventional one, and the fluidity of the silver solder is maintained in a better state.
なお上述の例における各部分の寸法および組成の一例を
示すものであり、本発明をこれらに限定することを意図
するもではない。Note that this is an example of the dimensions and composition of each part in the above-mentioned example, and the present invention is not intended to be limited thereto.
また、銀ろうの接合には、本実施例において述べたよう
な真空あるいは３囲気中での銀ろう融点未満の加熱以外
に、スポット溶接、超音波溶接等を用いることが可能で
あり、これらの接合方法によっても、銀ろう供給時の原
形をほぼ維持しかつ銀ろうの組織も供給時とほぼ同様に
維持したままの接合を達成でき、上記実施例と同様な効
果と機能を発揮することができる。In addition, for joining silver solder, it is possible to use spot welding, ultrasonic welding, etc. in addition to heating below the melting point of silver solder in a vacuum or three atmospheres as described in this example. Depending on the joining method, it is possible to achieve a joining in which the original shape at the time of silver solder supply is maintained and the structure of the silver solder is maintained almost the same as at the time of supply, and the same effects and functions as in the above embodiment can be achieved. can.
第１図は本発明の一実施例のリードピンを示す斜視図、
第２図は第１図のリードピン本体を示す側面図、第３図
は第１図の銀ろうを示す斜視図、第４図は銀ろう部材の
接合工程を説明する断面図、第５図は流動性の比較試験
におけるフィレット高さを示す説明図、第６図は従来の
銀ろう接合方法を示す断面図、第７図は溶融した銀ろう
の理想的な状態を示す側面図、第８図および第９図はり
−ドビン本体の頂部上面から流れた銀ろうの状態を示す
側面図である。
１ ・リードピン
３ リードピン本体
５− 銀ろう部材
７− 治具
３１−・ リードピン本体の頂部
３１ａ・ 頂部下面
３ ｌ ｂ・・ 頂部上面
３３ 脚部
第２図FIG. 1 is a perspective view showing a lead pin according to an embodiment of the present invention;
Fig. 2 is a side view showing the lead pin body of Fig. 1, Fig. 3 is a perspective view showing the silver solder shown in Fig. 1, Fig. 4 is a sectional view illustrating the joining process of the silver solder member, and Fig. 5 is a side view showing the lead pin body of Fig. 1. An explanatory diagram showing the fillet height in a fluidity comparison test, Fig. 6 is a cross-sectional view showing the conventional silver solder joining method, Fig. 7 is a side view showing the ideal state of molten silver solder, and Fig. 8 and FIG. 9 is a side view showing the state of silver solder flowing from the top surface of the beam-dobbin body. 1 - Lead pin 3 Lead pin body 5 - Silver brazing member 7 - Jig 31 - Top part 31a of lead pin main body - Top lower surface 3 l b... Top upper surface 33 Leg part 2
Claims (2)
るリードピンであって、リードピン本体と、このリード
ピン本体の一方の端面に取り付けた銀ろう部材とからな
り、前記銀ろう部材がリードピン本体に拡散接合されて
いることを特徴とするリードピン。(1) Lead pins used for external terminals of IC ceramic packages, etc., consisting of a lead pin body and a silver solder member attached to one end face of the lead pin body, with the silver solder member being diffusion bonded to the lead pin body. A lead pin characterized by:
るリードピンの製造方法であって、前記リードピンはリ
ードピン本体と銀ろう部材とからなり、前記リードピン
本体および銀ろう部材を、真空中あるいは非酸化性雰囲
気中において、銀ろうの融点未満の温度に加熱し、これ
ら両材を拡散接合するようにしたことを特徴とするリー
ドピンの製造方法。(2) A method for manufacturing a lead pin used as an external terminal of an IC ceramic package, wherein the lead pin is composed of a lead pin body and a silver solder member, and the lead pin body and the silver solder member are placed in a vacuum or a non-oxidizing atmosphere. A method for manufacturing a lead pin, characterized in that the two materials are diffusion bonded by heating to a temperature below the melting point of the silver solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61282336A JPH0821665B2 (en) | 1986-11-27 | 1986-11-27 | Lead pin and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61282336A JPH0821665B2 (en) | 1986-11-27 | 1986-11-27 | Lead pin and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63136552A true JPS63136552A (en) | 1988-06-08 |
| JPH0821665B2 JPH0821665B2 (en) | 1996-03-04 |
Family
ID=17651088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61282336A Expired - Lifetime JPH0821665B2 (en) | 1986-11-27 | 1986-11-27 | Lead pin and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821665B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
| JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
-
1986
- 1986-11-27 JP JP61282336A patent/JPH0821665B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
| JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0821665B2 (en) | 1996-03-04 |
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