JPS63157456A - Lead pin and manufacture thereof - Google Patents
Lead pin and manufacture thereofInfo
- Publication number
- JPS63157456A JPS63157456A JP30609086A JP30609086A JPS63157456A JP S63157456 A JPS63157456 A JP S63157456A JP 30609086 A JP30609086 A JP 30609086A JP 30609086 A JP30609086 A JP 30609086A JP S63157456 A JPS63157456 A JP S63157456A
- Authority
- JP
- Japan
- Prior art keywords
- silver solder
- lead pin
- diffusion
- silver
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 75
- 238000009792 diffusion process Methods 0.000 claims abstract description 20
- 230000008018 melting Effects 0.000 claims abstract description 20
- 238000002844 melting Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 238000005219 brazing Methods 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 239000011247 coating layer Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000971 Silver steel Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ＩＣセラミックパッケージの外部端子などに
用いるリードピンおよびその製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead pin used as an external terminal of an IC ceramic package, and a method for manufacturing the lead pin.
（従来の技術）
従来において、ＩＣセラミックパッケージの外部端子と
して用いるリードピンとしては、このリードピンをパッ
ケージの電極にろう接するための銀ろうが予めリードピ
ン本体の一端に接合されたものが知られている。このよ
うな銀ろうが接合されたり−ドピンの製造は次のように
して行われている。第６図に示すように、リードピン本
体１１の頭部上面１１ａに銀ろう片１３を載せた状態で
、これらを耐火性の治具１５にセットした後、これらを
銀ろうの融点以上の温度に加熱して銀ろう片１３を溶融
させる。この後に、溶融した銀ろうを凝固させて、第７
図に示すようにリードピン本体１１の上面１１ａに銀ろ
う部１７を形成し、これによって、リードピン１９を得
る。(Prior Art) Conventionally, as a lead pin used as an external terminal of an IC ceramic package, one in which a silver solder for soldering the lead pin to an electrode of the package is bonded in advance to one end of the lead pin body is known. The manufacture of such silver solder-bonded or doped pins is carried out as follows. As shown in FIG. 6, with the silver solder piece 13 placed on the top surface 11a of the head of the lead pin body 11, these pieces are set in a fireproof jig 15, and then heated to a temperature higher than the melting point of the silver solder. The silver solder piece 13 is melted by heating. After this, the molten silver solder is solidified and the seventh
As shown in the figure, a silver solder portion 17 is formed on the upper surface 11a of the lead pin body 11, thereby obtaining a lead pin 19.
（発明が解決しようとする問題点）
しかしながら、上述のように銀ろうを溶融させる工程を
経て製造されたリードピンにおいては、次のような問題
がある。(Problems to be Solved by the Invention) However, the lead pin manufactured through the process of melting silver solder as described above has the following problems.
（１）銀ろう片をその融点以上に加熱して溶融させた場
合において、溶融状態の銀ろうは第７図に示すように、
その表面張力によって椀形状にリードピン本体の頭部上
面１１ａに広がり、しかも高さが一定になることが理想
である。しかし、実際には、温度管理を厳密に行う等し
て工程管理に細心の注意を払っても、溶融した銀ろうの
一部は振動その他の要因でリードピン本体の頭部上面１
１ａから溢れてしまう。例えば、第８図に示すように、
溶融した銀ろう１７ａがリードピン本体の頭部外周面１
１ｂに流れ、あるいは第９図に示すように、リードピン
本体の頭部下側１１ｃの部分に廻り込んでしまう。この
結果、リードピン実装時の本ろう付けの際に必要とされ
るに足る量の銀ろう部を形成することが困難であり、ま
た、充分な銀ろう部を形成するために消費される銀ろう
が不必要に多量となってしまう上、ろう部の高さもばら
つき、結果的には、リードピンの全長がばらつくことに
なり、実装時に不都合である。(1) When a piece of silver solder is heated above its melting point and melted, the molten silver solder will be as shown in Figure 7.
Ideally, the surface tension causes the lead pin to spread into a bowl shape over the top surface 11a of the head of the lead pin body, and to maintain a constant height. However, in reality, even if careful attention is paid to process control such as strict temperature control, some of the molten silver solder may be deposited on the upper surface of the head of the lead pin body due to vibration or other factors.
It overflows from 1a. For example, as shown in Figure 8,
The molten silver solder 17a is applied to the outer peripheral surface 1 of the head of the lead pin body.
1b, or, as shown in FIG. 9, may go around the lower head portion 11c of the lead pin body. As a result, it is difficult to form a sufficient amount of silver solder for the main brazing when mounting lead pins, and the silver solder is consumed to form a sufficient amount of silver solder. This results in an unnecessarily large amount of lead pins, and the height of the solder portion also varies, resulting in variation in the overall length of the lead pin, which is inconvenient during mounting.
（２） 上述のように、溶融した銀ろうがリードピン
本体の頭部の下側に廻り込んでそこで凝固した場合には
く第９図参照）、その付着した銀ろうの分だけリードピ
ン本体の径が太くなってしまう。このような頭部下側へ
の銀ろう付着の検出は困難であり、かかるリードピンを
そのまま用いた場合には、ろう付組み立ての際に、リー
ドピンを固定する固定用治具にリードピンを治めること
が出来ないという不具合が生ずる。かかる弊害は、ろう
付組み立て作業を自動化する場合の大きな障害となる。(2) As mentioned above, if the molten silver solder gets under the head of the lead pin body and solidifies there (see Figure 9), the diameter of the lead pin body will be reduced by the amount of the adhered silver solder. becomes thicker. It is difficult to detect such silver solder adhesion to the lower side of the head, and if such lead pins are used as is, it is difficult to fix the lead pins in the fixing jig that fixes them during brazing assembly. The problem arises that it is not possible. Such adverse effects become a major obstacle when automating brazing assembly work.
またこのように不必要な部分に付着した銀ろうは、実装
時に当該部分に応力が作用した場合に、その部分の組織
の結晶粒界に浸透してそこに亀裂を発生させる、いわゆ
る応力割れを惹起しリードピンの破折に至ることがあり
、実装パフケージに重大な欠陥を与えるおそれがある。In addition, silver solder attached to unnecessary areas can penetrate into the grain boundaries of the structure of that area and cause cracks, so-called stress cracking, when stress is applied to the area during mounting. This may lead to breakage of the lead pins, which may cause serious defects to the mounting puff cage.
（３） 銀ろうは、従来のように一旦融点以上に加熱
して溶融、凝固を行うと、再度加熱した場合に於ける流
動性が低下する傾向があり、特にセラミックパッケージ
の外Ｂ端子に多用されるｍ−銅二元系のろうにおいて顕
著である。即ち、従来品では、本ろう付けの際に、銀ろ
う本来の優れたこぬれ」性やつきまわりが阻害されて°
、）る。(3) Once silver solder is heated above its melting point to melt and solidify as in the past, its fluidity tends to decrease when it is heated again, so it is often used especially for the outer B terminals of ceramic packages. This is remarkable in m-copper binary waxes. In other words, with conventional products, the excellent wettability and throwing power inherent to silver solder are inhibited during actual brazing.
,)ru.
本発明の目的は、上記の各問題点を解消した銀ろう付の
り一ドリードビンおよびその！ＩＪ造方決方法供するこ
とにある。The object of the present invention is to provide a silver-brazed adhesive bin that solves each of the above-mentioned problems. The purpose is to provide a method for making IJ.
（問題点を解決するだめの手段）
上記の目的を達成するために、本発明のリードピンにお
いては、リードピン本体の一方の端面に対して、銀ろう
部材を完全には溶融すること一旦＜、しかも供給時の原
形をほぼ七のまま留めて接合するようにしている。すな
わち、本発明においごは、例えば融点が２３１．９℃と
低く、拡散して銀と低融点金属を形成する錫等の金属を
接合助材として介してリードピン本体と銀ろう部材とを
拡散接合することによって、かかる接合状態を形成する
ようにしている。(Means for Solving the Problems) In order to achieve the above object, the lead pin of the present invention requires that the silver solder member be completely melted on one end surface of the lead pin body, and We try to keep the original shape as it was when we supplied it and join it together. That is, in the present invention, the lead pin body and the silver solder member are diffusion bonded using a metal such as tin, which has a low melting point of 231.9° C. and which diffuses to form a low melting point metal with silver, as a bonding aid. By doing so, such a bonded state is formed.
（作用）
本発明のリードピンにおいては、拡散速度の速い金属を
介して、リードピン本体に銀ろう部材が拡散接合される
ので、銀ろうの融点よりも遥かに低い雰囲気温度の下で
拡散接合が行われる。従って、これらの両部材を接合す
る際に、銀ろう部材は実質的には溶融せず、原形をほぼ
そのままに留めており、従来法のように溶融した銀ろう
がり一ドピン本体の頂部上面から流れ落ちることはない
上、不必要部分への銀ろうの溶融に基づく廻り込み現象
が皆無となるので、従来リードピン脚部等で起こった銀
ろうによる応力割れを回避できる。(Function) In the lead pin of the present invention, the silver solder member is diffusion bonded to the lead pin body via a metal with a high diffusion rate, so diffusion bonding is performed at an ambient temperature far lower than the melting point of the silver solder. be exposed. Therefore, when joining these two parts together, the silver solder material does not melt and retains its original shape, and as in the conventional method, the molten silver solder is removed from the top surface of the dowel body. Not only will it not flow down, but there will be no wrap-around phenomenon due to silver solder melting into unnecessary areas, so stress cracks caused by silver solder that conventionally occur at lead pin legs can be avoided.
また、このようにしてリードピン本体に接合された銀ろ
う部材は、溶融、凝固を経ていないので、銀ろうは本来
の流動特性をそのまま保持しており、本ろう付は時（パ
ッケージングの際における電極との接合時）においては
、加熱温度が所定の値を超えると同時に流動が起こり、
ろう付けがろう本来の特性を損なうことなく確実に行わ
れる。In addition, since the silver solder member bonded to the lead pin body in this way has not undergone melting or solidification, the silver solder retains its original flow characteristics, and the actual brazing is performed over time (during packaging). When bonding with an electrode), flow occurs as soon as the heating temperature exceeds a predetermined value.
Brazing can be performed reliably without damaging the original properties of the wax.
この点を、銀−銅二元系ろうを例にして説明する。この
二元系ろうの組織は、銀に冨んだα相、銅に富んだβ相
および（αキβ）相で構成されており、製品に至るまで
の組成加工と焼鈍の繰り返しによってほぼ均一な組織を
示す。このため、加熱すると、銀と銅の成分比によって
決定される融点で融解が始まり、その流動点に達すると
同時に急速に流動が始まる。しかしながらζ従来の銀ろ
うクラッドリードピンの場合のように、一旦溶融凝固を
経た後のろう組織は、銀に富んだα相、銅に富んだβ相
および（α＋β）相とが明確に分かれたマクロ的混合体
となってしまう。そのため、融解は、共晶組成相から始
まり、次に高融点をもった相へと徐々に溶は進むので、
上記の未溶融のろうに比べて、時間的に遅く流動を開始
するとともにそれが極めて緩慢に進行する。この結果、
ろうとしての流動性、ぬれ性が悪く、ろう付は欠陥の発
生１ｉｌｌ率が高くなってしまう。これに対して、本発
明の方法によってリードピン本体に取り付けたろうは、
均質な組織のままであるので、流動性およびぬれ性が好
適な状態に保持されている。This point will be explained using a silver-copper binary wax as an example. The structure of this binary solder is composed of a silver-rich α phase, a copper-rich β phase, and an (α + β) phase, and is almost uniform through repeated compositional processing and annealing until the product is manufactured. It shows the organization. Therefore, when heated, it begins to melt at a melting point determined by the component ratio of silver and copper, and as soon as that pour point is reached, it begins to flow rapidly. However, as in the case of conventional silver solder clad lead pins, the solder structure after melting and solidification is a macroscopic structure with clearly separated silver-rich α phase, copper-rich β phase, and (α+β) phase. It ends up being a mixed bag. Therefore, melting starts from the eutectic composition phase and then gradually progresses to the phase with a high melting point.
Compared to the above-mentioned unmolten wax, the flow starts later in time and progresses very slowly. As a result,
The fluidity and wettability of brazing are poor, and the 1ill rate of defects in brazing is high. On the other hand, the solder attached to the lead pin body by the method of the present invention
Since the structure remains homogeneous, fluidity and wettability are maintained in a suitable state.
（発明の効果）
このように、本発明のリードピンによれば、銀ろう部材
は、その融点よりも遥かに低い温度条件の下で実質的に
溶融凝固を経ることなくリードピン本体に接合される。(Effects of the Invention) As described above, according to the lead pin of the present invention, the silver solder member is joined to the lead pin body substantially without undergoing melting and solidification under a temperature condition far lower than the melting point of the silver solder member.
従って、従来の欠点である、溶融した銀ろうがリードピ
ン本体の頂部上面から流れ、不必要な部分に付着するこ
との起因する上述の各種の弊害を回避することが可能に
なり、リードピン全体のばらつきも少なく、実装時の自
動化が歩留りよく行われ、銀ろうを節約できる等の利点
が得られる。Therefore, it is possible to avoid the above-mentioned disadvantages caused by molten silver solder flowing from the top surface of the lead pin body and adhering to unnecessary parts, which is a drawback of the conventional method. There are advantages such as the automation during mounting can be carried out with high yield, and silver solder can be saved.
また、銀ろう部材の組織は実質的にその取り付は前の均
一な状態のままであり、銀ろうの流動性、ぬれ性を良好
な状態に保持したままで本ろう付けを行うことができ、
以て、好適なろう付けを達成することができる。In addition, the structure of the silver solder component remains substantially the same as before, and the main brazing can be performed while maintaining the fluidity and wettability of the silver solder in good condition. ,
Thus, suitable brazing can be achieved.
（実施例）
以下に、第１図ないし第５図を＠照して、本発明の詳細
な説明する。(Example) The present invention will be described in detail below with reference to FIGS. 1 to 5.
第１図は本発明の方法によって製造したり−ドピンの一
例を示す図である。図に示すように、このリードピン１
は、リードピン本体３と、全周面に錫被覆層６が形成さ
れた銀ろう部材５からなり、リードピン本体３の頂部上
面３１ｂに銀ろう部材５が拡散接合された構造となって
いる。FIG. 1 shows an example of a dopedine produced by the method of the present invention. As shown in the figure, this lead pin 1
consists of a lead pin main body 3 and a silver solder member 5 having a tin coating layer 6 formed on the entire circumferential surface, and has a structure in which the silver solder member 5 is diffusion bonded to the top upper surface 31b of the lead pin main body 3.
第２図”に示すように、上記のリードピン本体３は、円
盤状の頭部３１と、この下面３１ａに同軸状に形成され
た円柱状の脚部３３とからなっている。各部分の寸法例
を挙げると、上記の頭部は、その直径が０．７５ｍ、厚
さが０．２＋＋＋ｍであり、上記脚部は、その直径が０
．４４正、脚長が４．５ｍｍである。かかる形状のリー
ドピン本体は、コバールから形成されている。As shown in FIG. 2, the lead pin main body 3 consists of a disc-shaped head 31 and a cylindrical leg 33 coaxially formed on the lower surface 31a. Dimensions of each part For example, the head has a diameter of 0.75 m and a thickness of 0.2+++ m, and the legs have a diameter of 0.75 m and a thickness of 0.2 +++ m.
．． 44 positive, leg length is 4.5 mm. The lead pin main body having such a shape is made of Kovar.
第３図に示すように、上記の銀ろう部材５は、正方形断
面の線材５１から切断して得た立方体の銀ろう部材片の
外周面に賜めっきを３μ施したものである。賜めっきを
施すためには、従来から知られている電気めっき法等の
方法を用いればよい。As shown in FIG. 3, the silver brazing member 5 is a cubic silver brazing member piece obtained by cutting a wire rod 51 having a square cross section, and the outer peripheral surface thereof is plated to a thickness of 3μ. In order to apply plating, a conventionally known method such as electroplating may be used.
この銀ろう部材は、上記のリードビン本体の頂部上面内
に納まる大きさとなっており、上記の寸法を有するリー
ドピン本体に対しては、この銀ろう部材の一辺の寸法を
０．４６ｍｍとすればよい。また、この銀ろう部材は８
５銀−鋼合金からなっている。This silver solder member is sized to fit within the upper surface of the top of the lead bin body, and for a lead pin body having the above dimensions, the dimension of one side of this silver solder member may be 0.46 mm. . Also, this silver solder member is 8
5 silver-steel alloy.
次に、リードピン本体３と銀ろう部材５との接合工程を
説明する。まず、リードピン本体の頂部上面３１ｂに銀
ろう部材５が載った状態となす。Next, the process of joining the lead pin body 3 and the silver solder member 5 will be explained. First, the silver solder member 5 is placed on the top upper surface 31b of the lead pin body.
次に、かかる状態のリードピン本体３と銀ろう部材５と
を、第４図に示すように、耐火性の治具７内にセットす
る。この後、これらを、窒素と水素との混合比を５：１
に調整した雰囲気炉中に入れて、６６０℃で６分間加熱
する。このようにして、銀ろう部材５の原形をほぼその
ままに留め、溶融することもな（、リードビン本体頂部
の上面３１ｂに拡散接合する。Next, the lead pin main body 3 and the silver solder member 5 in this state are set in a fireproof jig 7, as shown in FIG. After this, these were mixed at a mixing ratio of nitrogen and hydrogen of 5:1.
The sample was placed in a furnace with an atmosphere adjusted to 660° C. for 6 minutes. In this way, the original shape of the silver soldering member 5 is kept almost as it is, and it is not melted (it is diffusion bonded to the upper surface 31b of the top of the lead bin main body).
このように銀ろうよりも拡散し易い錫被覆層６を介して
、銀ろう部材５をリードピン本体３に拡散接合するこに
よって、拡散接合工程における初拡散が著しく促進され
、銀ろう部材を直接に拡散接合する場合に比べて、より
低い温度でしかも緩い工程管理条件の下で好適な拡散接
合が達成できた。In this way, by diffusion bonding the silver solder member 5 to the lead pin body 3 via the tin coating layer 6, which is easier to diffuse than silver solder, the initial diffusion in the diffusion bonding process is significantly promoted, and the silver solder member can be directly bonded. Suitable diffusion bonding was achieved at a lower temperature and under looser process control conditions than in the case of diffusion bonding.
ここで、錫量外の接合助材となる金属としては、低融点
（５００℃以下）金属、或いは銀ろうの成分、特に銀と
低融点合金を形成し、低温で拡散する、Ｓｉ、Ｇｅ、Ｓ
ｎ、Ｐｂ、の■族や、Ｉｎ。Here, metals that serve as bonding aids other than the amount of tin include low melting point metals (below 500°C) or components of silver solder, especially Si, Ge, which forms a low melting point alloy with silver and diffuses at low temperatures. S
■ group of n, Pb, and In.
Ｇａ等のＩ［［ｂ族、Ｚｎ、Ｃ’ｄ、Ｈｇのｎｂ族等の
元素、およびそれらの合金が用いられる。ここに挙げた
元素の中には銀ろうの成分として用いられる元素や蒸気
圧の高い元素もあり、ＩＣの種類によっては、好ましく
ない場合もある。例えば、Ｂｅ、Ｍｇ、Ｃａ、Ｓｒ、Ｂ
ａ、ＲａのＩＩａ族を用いることが好ましくない場合も
ある。Elements such as I[[b group such as Ga, nb group such as Zn, C'd, and Hg, and alloys thereof are used. Among the elements listed here, there are elements used as components of silver solder and elements with high vapor pressure, which may be undesirable depending on the type of IC. For example, Be, Mg, Ca, Sr, B
In some cases, it may not be preferable to use a group IIa group of a, Ra.
なあ、上述の実施例においては、接合助材となる金属を
、銀ろう部材の全周囲に被覆するようにした。しかし、
例えば立方体の銀ろう部材の一つの面のみに被覆層を形
成せしめたり、或いはリードピン端面に粉体や箔片とし
て載置することにより、これらの接合助材をリードピン
本体と銀ろう部材の間に介在させるように付与してもよ
い。また、接合助材金属も、錫量外の金属を用いてもよ
いことは勿論である。Incidentally, in the above embodiment, the entire periphery of the silver solder member was coated with the metal serving as a joining aid. but,
For example, by forming a coating layer on only one side of a cubic silver brazing member, or by placing a powder or a piece of foil on the end face of a lead pin, these joining aids can be placed between the lead pin body and the silver brazing member. It may be applied in an interposed manner. Furthermore, it goes without saying that metals other than those containing tin may also be used as the bonding aid metal.
さらに、上述の例における各部分の寸法および組成は、
それらの−例であり、本発明をこれらに限定することを
意図するもではない。従って、例えば銀ろう部材の形状
を円柱、多面体、球体等の形状に変更してもよいことは
勿論である。Furthermore, the dimensions and composition of each part in the above example are:
These are examples, and the present invention is not intended to be limited thereto. Therefore, it goes without saying that, for example, the shape of the silver solder member may be changed to a cylinder, polyhedron, sphere, or the like.
第１図は本発明の一実施例のリードビンを示す斜視図、
第２図は第１図のリードピン本体を示す側面図、第３図
は第１図の銀ろうを示す斜視図、第４図は銀ろう部材の
接合工程を説明する断面図、第５図は従来の銀ろう接合
方法を示す断面図、第６図は溶融した銀ろうの理想的な
状態を示す側面図、第７図および第８図はリードピン本
体の頂部上面から流れた銀ろうの状態を示す側面図であ
る。
■ リードビン
３ リードピン本体
５ 銀ろう部材
６〜・ 金属被覆層
７ 治具
３１・−リードピン本体の頂部
３１ａ 頂部下面
３１ｂ ｗ！部上面
３３・ 脚部
第２図
８５図
第６図 第７図 第８図１、事件の表
示 昭和６１年特許願第３０６０９０号２、発明の
名称 リードピンおよびその製造方法３、補正をす
る者
事件との関係 出願人
名 称 株式会社 徳 力 本 居
間 （５９１）三井物産株式会社
４８代理人
５、補正命令の日付 自 発
（１）明細書第１１頁第１８行目の“拡散し易い錫被覆
層６”を「低温で拡散し易い錫被覆層６」に訂正する。
（２）同書第１２頁第８行目の“Ｐｂ、の■族や、”を
ｒｐｂのＩＶｂ族や、」に訂正する。FIG. 1 is a perspective view showing a lead bin according to an embodiment of the present invention;
Fig. 2 is a side view showing the lead pin body of Fig. 1, Fig. 3 is a perspective view showing the silver solder shown in Fig. 1, Fig. 4 is a sectional view illustrating the joining process of the silver solder member, and Fig. 5 is a side view showing the lead pin body of Fig. 1. A cross-sectional view showing the conventional silver solder joining method, Figure 6 is a side view showing the ideal state of molten silver solder, and Figures 7 and 8 show the state of silver solder flowing from the top surface of the lead pin body. FIG. ■ Lead bin 3 Lead pin body 5 Silver brazing member 6~・Metal coating layer 7 Jig 31・- Top portion 31a of lead pin body Top lower surface 31b w! Top surface 33/Legs Fig. 2 Fig. 85 Fig. 6 Fig. 7 Fig. 8 Fig. 1, Indication of case 1985 Patent Application No. 306090 2, Title of invention Lead pin and its manufacturing method 3, Case of person making amendment Relationship with Applicant's name: Tokuriki Co., Ltd. Main living room (591) Mitsui & Co., Ltd. 48 Agent 5, date of amendment order Voluntary action (1) "Easy to diffuse tin coating layer" on page 11, line 18 of the specification 6” is corrected to “tin coating layer 6 that is easily diffused at low temperatures.” (2) On page 12, line 8 of the same book, "Pb, group ■," is corrected to "rpb, group IVb,".
Claims (2)
るリードピンであって、リードピン本体と、このリード
ピン本体の一方の端面に取り付けた銀ろう部材とからな
り、前記銀ろう部材がこの銀ろうの融点より低い温度で
拡散し接合助材として機能する金属を介して、前記リー
ドピン本体に拡散接合されていることを特徴とするリー
ドピン。(1) Lead pins used for external terminals of IC ceramic packages, etc., consisting of a lead pin body and a silver solder member attached to one end face of the lead pin body, the silver solder member having a melting point lower than that of the silver solder. A lead pin characterized in that the lead pin is diffusion bonded to the lead pin body through a metal that diffuses at temperature and functions as a bonding aid.
るリードピンの製造方法であって、前記リードピンはリ
ードピン本体と銀ろう部材とからなり、前記銀ろう部材
の少なくとも一部分に、銀ろうの融点よりも低い温度で
拡散し接合助材として機能する金属を付与し、この金属
部分を介して銀ろう部材を前記リードピン本体に接触さ
せ、これらの両部材を拡散接合するようにしたことを特
徴とするリードピンの製造方法。(2) A method for manufacturing a lead pin used for an external terminal of an IC ceramic package, wherein the lead pin is composed of a lead pin body and a silver solder member, and at least a portion of the silver solder member is heated to a temperature lower than the melting point of the silver solder. A method for producing a lead pin characterized in that a metal is applied that diffuses and functions as a bonding aid, and a silver solder member is brought into contact with the lead pin body via this metal portion, thereby diffusion bonding these two members. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30609086A JPS63157456A (en) | 1986-12-22 | 1986-12-22 | Lead pin and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30609086A JPS63157456A (en) | 1986-12-22 | 1986-12-22 | Lead pin and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157456A true JPS63157456A (en) | 1988-06-30 |
Family
ID=17952907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30609086A Pending JPS63157456A (en) | 1986-12-22 | 1986-12-22 | Lead pin and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157456A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126396A (en) * | 1979-03-24 | 1980-09-30 | Tokuriki Honten Co Ltd | Brazing material |
| JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
| JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
-
1986
- 1986-12-22 JP JP30609086A patent/JPS63157456A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126396A (en) * | 1979-03-24 | 1980-09-30 | Tokuriki Honten Co Ltd | Brazing material |
| JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
| JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
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