JPS63157455A - Lead pin - Google Patents
Lead pinInfo
- Publication number
- JPS63157455A JPS63157455A JP30608986A JP30608986A JPS63157455A JP S63157455 A JPS63157455 A JP S63157455A JP 30608986 A JP30608986 A JP 30608986A JP 30608986 A JP30608986 A JP 30608986A JP S63157455 A JPS63157455 A JP S63157455A
- Authority
- JP
- Japan
- Prior art keywords
- silver solder
- lead pin
- curved surface
- silver
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 77
- 238000009792 diffusion process Methods 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 abstract description 13
- 238000002844 melting Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 10
- 238000005219 brazing Methods 0.000 description 11
- 210000003128 head Anatomy 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000005304 joining Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000001993 wax Substances 0.000 description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、ICセラミックパッケージの外部端子などに
用いるリードピンに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to lead pins used as external terminals of IC ceramic packages.
(従来の技術)
従来において、rcセラミックパッケージの外aB4f
子として用いるリードピンとしては、このリードピンを
パッケージのN Mにろう接するための銀ろうが予めリ
ードピン本体の一端に接合されたものが知られている。(Prior art) In the past, the outer aB4f of the rc ceramic package
As a lead pin used as a lead pin, one in which a silver solder for soldering the lead pin to the NM of the package is bonded in advance to one end of the lead pin body is known.
このような銀ろうが接合されたり−ドビンの製造は次の
ようにして行われている。第4図に示すように、リード
ピン本体11の頭部上面11 a i:銀ろう片13を
載せた状態で、これらを耐火性の治具15にセットした
後、これらを銀ろうの融点以上の温亥;二加熱して銀ろ
う片13を溶融させる。この後に、溶融した銀ろうを凝
固させて、第5図に示すようにリードピン本体11の上
面11aに銀ろう部17を形成し、これによって、リー
ドピン19を得る。Manufacturing of such silver solder joints or dobbins is carried out as follows. As shown in FIG. 4, the top surface 11 a i of the lead pin body 11 with the silver solder piece 13 placed thereon is set in a fire-resistant jig 15, and then heated to a temperature higher than the melting point of the silver solder. Warm: Heat twice to melt the silver solder piece 13. Thereafter, the molten silver solder is solidified to form a silver solder portion 17 on the upper surface 11a of the lead pin body 11 as shown in FIG. 5, thereby obtaining the lead pin 19.
(発明が解決しようとする問題点)
しかしながら、上述のように銀ろうを溶融させる工程を
経て製造されたり−ドピンにおいては、次のような問題
がある。(Problems to be Solved by the Invention) However, there are the following problems with dopine manufactured through the process of melting silver solder as described above.
(1) 銀ろう片をその融点以上に加熱して溶融させ
た場合において、溶融状態の銀ろうは第5図に示すよう
に、その表面張力によって椀形状にリードピン本体の頭
部上面11aに広がり、しかも高さが一定になることが
理想である。しかし、実際には、温度管理を厳密に行う
等して工程管理に細心の注意を払っても、溶融した銀ろ
うの−BBは振動その他の要因でリードピン本体の頭部
上面11aから溢れてしまう。例えば、第6図に示すよ
うに、溶融した銀ろう17aがIJ−ドビン本体の頭部
外周面11bに流れ、あるいは第7図に示すように、リ
ードピン本体の頭部下側11cの部分に廻り込んでしま
う。この結果、リードピン実装時の本ろう付けの際に必
要とされるに足る量の銀ろう部を形成することが困難で
あり、また、充分な銀ろう部を形成するために消費され
る銀ろうが不必要に多量となってしまう上、ろう部の高
さもばらつき、結果的には、リードピンの全長がばらつ
くことになり、実装時に不都合である。(1) When a piece of silver solder is heated above its melting point and melted, the molten silver solder spreads into a bowl shape on the top surface 11a of the head of the lead pin body due to its surface tension, as shown in Figure 5. , and ideally the height should be constant. However, in reality, even if careful attention is paid to process control such as strict temperature control, molten silver solder -BB overflows from the top surface 11a of the head of the lead pin body due to vibration and other factors. . For example, as shown in FIG. 6, the molten silver solder 17a flows onto the outer peripheral surface 11b of the head of the IJ-dobbin main body, or as shown in FIG. It gets confusing. As a result, it is difficult to form a sufficient amount of silver solder for the main brazing when mounting lead pins, and the silver solder is consumed to form a sufficient amount of silver solder. This results in an unnecessarily large amount of lead pins, and the height of the solder portion also varies, resulting in variation in the overall length of the lead pin, which is inconvenient during mounting.
(2) 上述のように、溶融した銀ろうがリードピン
本体の頭部の下側に廻り込んでそこで凝固した場合には
(第7図参照)、その付着した銀ろうの分だけリードピ
ン本体の径が太くなってしまう。このような頭部下側へ
の銀ろう付着の検出は困難であり、かかるリードピンを
そのまま用いた場合には、ろう付組み立ての際に、リー
ドピンを固定する固定用治具にリードピンを治めること
が出来ないという不具合が生ずる。かかる弊害は、ろう
付組み立て作業を自動化する場合の大きな障害となる。(2) As mentioned above, if the molten silver solder goes under the head of the lead pin body and solidifies there (see Figure 7), the diameter of the lead pin body will be reduced by the amount of the adhered silver solder. becomes thicker. It is difficult to detect such silver solder adhesion to the lower side of the head, and if such lead pins are used as is, it is difficult to fix the lead pins in the fixing jig that fixes them during brazing assembly. The problem arises that it is not possible. Such adverse effects become a major obstacle when automating brazing assembly work.
またこのように不必要な部分に付着した銀ろうは、実装
時に当該部分に応力が作用した場合に、その部分の組織
の結晶粒界に浸透してそこに亀裂を発生させる、いわゆ
る応力割れを惹起しリードピンの破折に至ることがあり
、実装パッケージに重大な欠陥を与えるおそれがある。In addition, silver solder attached to unnecessary areas can penetrate into the grain boundaries of the structure of that area and cause cracks, so-called stress cracking, when stress is applied to the area during mounting. This may lead to breakage of the lead pins, which may cause serious defects to the mounted package.
(3) 銀ろうは、従来のように一旦融点以上に加熱
して溶融、凝固を行うと、再度加熱した場合に於ける流
動性が低下する傾向があり、特にセラミックパッケージ
の外部端子に多用される銀−銅二元系のろうにおいて顕
著である。即ち、従来品では、本ろう付けの際に、銀ろ
う本来の優れた「ぬれ」性やつきまわりが阻害されてい
る。(3) Once silver solder is heated above its melting point to melt and solidify as in the past, its fluidity tends to decrease when it is heated again, so it is often used especially for external terminals of ceramic packages. This is noticeable in silver-copper binary waxes. That is, with conventional products, the excellent "wetting" properties and throwing power inherent to silver solder are inhibited during main brazing.
そこで、このような従来技術の問題点を解決すために、
拡散接合法等を用いて、銀ろう部材を溶融することなく
リードピン本体に接合することが考えられる。Therefore, in order to solve the problems of the conventional technology,
It is conceivable to use a diffusion bonding method or the like to bond the silver solder member to the lead pin body without melting it.
この方法においては、銀ろう部材が溶融されることなく
リードピン本体に接合されることになるので、拡散接合
工程に先立って銀ろう部材をり−ドピン本体に載せた時
の銀ろう部材の高さを一定になるようにしないと、リー
ドピンの全長にばらつきが生じてしまう。また、リード
ピン本体に銀ろう部材を載せた後から拡散接合までの間
においては、銀ろう部材は単に載っているだけの不安定
な状態にあるので、振動等が加わると、リードピン本体
から落下するおそれがある。In this method, the silver solder material is bonded to the lead pin body without being melted, so the height of the silver solder material when placed on the lead pin body prior to the diffusion bonding process is If the lead pins are not kept constant, the overall length of the lead pins will vary. In addition, after the silver solder material is placed on the lead pin body until diffusion bonding, the silver solder material is in an unstable state where it is simply placed on the lead pin body, so if vibration etc. are applied, it may fall from the lead pin body. There is a risk.
本発明の目的は、上記の各問題点を解消した銀ろう付の
リードリードピンを提供することにある。An object of the present invention is to provide a silver soldered lead pin that solves the above-mentioned problems.
(問題点を解決するための手段)
上記の目的を達成するために、本発明のリードピンにお
いては、リードピン本体における銀ろう部材の接合面の
少なくとも一部分に湾曲面または凹部が形成され、これ
らの湾曲面あるいは凹部にほぼ球体形状の銀ろう部材が
拡散接合された構成となっている。(Means for Solving the Problems) In order to achieve the above object, in the lead pin of the present invention, a curved surface or a recess is formed in at least a portion of the joint surface of the silver solder member in the lead pin body, and these curved It has a structure in which a substantially spherical silver solder member is diffusion bonded to the surface or recess.
(作用)
本発明のリードピンの製造においては、銀ろう部材を落
下あるいは振込によってリードピン本体に載せると、球
形の銀ろう部材はリードピン本体に形成した湾曲面また
は凹部に案内されて、位置エネルギーの最も低い位置に
安定した状態で止まる。従って、この湾曲面または凹部
の中心が銀ろう部材接合面の中心に位置するように形成
しておけば、常にその中心位置に銀ろう部材が安定した
状態で設置されることになる。また、銀ろう部材は球形
をしているので、リードピン本体への載せ方にかかわり
なく、その高さが常に一定になる。(Function) In manufacturing the lead pin of the present invention, when a silver solder member is placed on the lead pin body by dropping or transferring, the spherical silver solder member is guided by the curved surface or recess formed in the lead pin body, and the most potential energy is It stays stable in a low position. Therefore, if the center of this curved surface or recess is formed to be located at the center of the silver solder member joint surface, the silver solder member will always be stably installed at the center position. Furthermore, since the silver solder member is spherical, its height is always constant regardless of how it is placed on the lead pin body.
次に、このようにリードピン本体に載せた銀ろう部材は
拡散接合される。従って、銀ろう部材は実質的に熔融せ
ず、原形をそのまま留めており、従来法のように溶融し
た銀ろうがリードピン本体の頂部上面から銀ろうが流れ
落ちることはない。Next, the silver solder member thus placed on the lead pin body is diffusion bonded. Therefore, the silver solder member is not substantially melted and retains its original shape, and the molten silver solder does not flow down from the top surface of the lead pin body as in the conventional method.
また、このように溶融、凝固を経ることなくリードピン
本体に接合された銀ろうは本来の流動特性をそのまま保
持しており、本ろう付け時(パッケージングの際におけ
る電極との接合時)においては、加熱温度が所定の値を
超えると同時に流動が起こり、ろう付けがろう本来の特
性を損なうことなく確実に行われる。In addition, the silver solder that is bonded to the lead pin body without undergoing melting and solidification retains its original flow characteristics, and during the actual brazing (when bonding to the electrode during packaging). , flow occurs as soon as the heating temperature exceeds a predetermined value, ensuring that brazing is performed without damaging the inherent properties of the solder.
この点を、銀−銅二元系ろうを例にして説明する。この
二元系ろうの組織は、銀に冨んだαを目、銅に冨んだβ
相および(α+β)ト目で構成されており、製品に至る
までの組成加工と焼鈍の繰り返しによってほぼ均一な組
織を示す。このため、加熱すると、銀と銅の成分比によ
って決定される融点で融解が始まり、その流動点に達す
ると同時に急速に流動が始まる。しかしながら、従来の
銀ろうクラッドリードピンの場合のように、一旦溶融凝
固を経た後のろう組織は、銀に富んだα相、桐に富んだ
β相および(α+β)相とが明確に分かれたマクロ的混
合体となってしまう。そのため、融解は、共晶組成用か
ら始まり、次に高融点をもった相へと徐々に溶は進むの
で、上記の未溶融のろうに比べて、時間的に遅く流動を
開始するとともにそれが極めて緩慢に進行する。この結
果、ろうきしての流動性、ぬれ性が悪く、ろう付け欠陥
の発生確率が高くなってしまう。これに対して、本発明
の方法によってリードピン本体に取り付けたろうは、均
質な組織のままであるので、流動性およびぬれ性が好適
な状、熊に保持されている。This point will be explained using a silver-copper binary wax as an example. This binary wax structure consists of α-rich eyes in silver and β-rich eyes in copper.
It is composed of phases and (α+β) eyes, and exhibits a nearly uniform structure due to repeated compositional processing and annealing until the final product. Therefore, when heated, it begins to melt at a melting point determined by the component ratio of silver and copper, and as soon as that pour point is reached, it begins to flow rapidly. However, as in the case of conventional silver solder clad lead pins, once melted and solidified, the solder structure is a macroscopic structure with clearly separated silver-rich α phase, paulownia-rich β phase, and (α+β) phase. It ends up being a mixed bag. Therefore, melting starts from the eutectic composition and then gradually progresses to the phase with a high melting point, so it starts flowing later than the unmelted wax mentioned above, and it also slows down. Progresses extremely slowly. As a result, the fluidity and wettability of the brazing material are poor, and the probability of occurrence of brazing defects is increased. On the other hand, the solder attached to the lead pin body by the method of the present invention remains in a homogeneous structure, so that the solder is maintained in a state with suitable fluidity and wettability.
(発明の効果〉
このように、本発明によれば、リードピン端面に設)す
だ湾曲面または凹部により、銀ろうが確実に端面の中心
に位置されるという利点が得られ、従来のフラット端面
クイプの場合にはとかく起こりがちであった位置ずれが
解消される。また、接合されている銀ろう部材の高さが
一定となったリードピンを確実に得ることがでる。(Effects of the Invention) As described above, according to the present invention, the curved surface or concave portion provided on the end face of the lead pin has the advantage that the silver solder is reliably positioned at the center of the end face, and the conventional flat end face The misalignment that tends to occur in the case of quips is eliminated. Further, it is possible to reliably obtain a lead pin in which the height of the silver soldering member being joined is constant.
一方、銀ろう部材は実質的に溶融凝固を経ることなくリ
ードピン本体に接合されるので、従来の欠点である、溶
融した銀ろうがリードピン本体の頂部上面から流れ、不
必要な部分に付着することに起因する上述の各種の弊害
を回避することが可能になり、リードピン全体のばらつ
きも少なく、実装時の自動化が歩留りよく行われ、銀ろ
うを節約できる等の利点が得られる。さらに、銀ろう部
材の組織は実質的にその取り付け前の均一な状態のまま
であり、銀ろうの流動性、ぬれ性を良好な状態に保持し
たままで本ろう付けを行うことができ、以て、好適なろ
う付けを達成することができろ。On the other hand, since the silver solder material is joined to the lead pin body without substantially undergoing melting and solidification, the molten silver solder flows from the top surface of the lead pin body and adheres to unnecessary parts, which is a drawback of the conventional method. It is possible to avoid the above-mentioned various disadvantages caused by lead pins, there is little variation among the entire lead pins, automation at the time of mounting can be carried out with high yield, and advantages such as being able to save silver solder can be obtained. Furthermore, the structure of the silver solder member remains substantially in the uniform state before installation, and main brazing can be performed while maintaining the fluidity and wettability of the silver solder in good condition. Therefore, a suitable brazing can be achieved.
(実施例)
以下に、第1図ないし第3図を参照して、本発明の詳細
な説明する。(Example) The present invention will be described in detail below with reference to FIGS. 1 to 3.
第1図は本発明にしたがって製造したリードピンの一例
を示す図である。図に示すように、このリードピン1は
、リードピン本体3と銀ろう部材5からなり、リードピ
ン本体3の頂部上面31bに球形の銀ろう部材5が拡散
接合された構造となっている。FIG. 1 is a diagram showing an example of a lead pin manufactured according to the present invention. As shown in the figure, this lead pin 1 consists of a lead pin body 3 and a silver solder member 5, and has a structure in which the spherical silver solder member 5 is diffusion bonded to the top upper surface 31b of the lead pin body 3.
第2図に示すように、上記のり−ドピン本体3は、円盤
状の頭部31と、この下面3Laに同軸状に形成された
円柱状の脚部33とかろなっている。頭部31の上面3
1bには、この上面と同心円状の湾曲面31cが形成さ
れている。この湾曲面の曲率半径は銀ろう部材よりも大
きな値に設定されている。各部分の寸法例を挙げると、
上記の頭部は、その直径が 0.75mm、厚さが0.
2mmであり、上記脚部は、その直径が、0.44+n
a+、脚長が4.5mmである。かかる形状のリードピ
ン本体は、コバールから形成されている。As shown in FIG. 2, the glued pin main body 3 includes a disk-shaped head 31 and a cylindrical leg 33 coaxially formed on the lower surface 3La. Top surface 3 of head 31
1b is formed with a curved surface 31c that is concentric with the upper surface. The radius of curvature of this curved surface is set to a larger value than that of the silver solder member. Here are some examples of dimensions for each part:
The above head has a diameter of 0.75 mm and a thickness of 0.75 mm.
2mm, and the diameter of the leg is 0.44+n
a+, leg length is 4.5 mm. The lead pin main body having such a shape is made of Kovar.
上記の銀ろう部材5はほぼ球形をしており、この銀ろう
部材は、上記のり−ドピン本体の頂部上面内に納まる大
きさとなっており、上記の寸法を有するリードピン本体
に対しては、この銀ろう部材の直径を0.57m+nと
すればよい。また、この銀ろう部材は85銀−銅合金か
らなっている。The silver solder member 5 has a substantially spherical shape, and is sized to fit within the top surface of the lead pin body. The diameter of the silver solder member may be 0.57 m+n. Further, this silver solder member is made of 85 silver-copper alloy.
次に、リードピン本体3と銀ろう部材5との接合工程を
説明する。まず、銀ろう部材5を落下あるいは振込によ
ってリードピン本体3の上面31bに載せる。ここに、
上面31には湾曲面31cが形成されているので、銀ろ
う部材5は湾曲面に案内されて転がり、最も深い中心位
置に自然に止まる。次に、第3図に示すように、これら
を耐火性の治具7内にセットする。この後、これらを、
窒素と水素との混合比を5:lに調整した雰囲気炉中に
入れて、660℃で6分間加熱する。Next, the process of joining the lead pin body 3 and the silver solder member 5 will be explained. First, the silver solder member 5 is placed on the upper surface 31b of the lead pin body 3 by dropping or transferring. Here,
Since a curved surface 31c is formed on the upper surface 31, the silver solder member 5 is guided by the curved surface and rolls, and naturally stops at the deepest center position. Next, as shown in FIG. 3, these are set in a fireproof jig 7. After this, these
The mixture is placed in an atmosphere furnace in which the mixing ratio of nitrogen and hydrogen is adjusted to 5:l, and heated at 660° C. for 6 minutes.
このようにして、銀ろう部材5の原形をほぼそのままに
留め、溶融することもなく、リードピン本体頂部の上面
に形成した湾曲面31Cに拡散接合する。In this way, the original shape of the silver soldering member 5 is kept almost as it is, and without melting, it is diffusion bonded to the curved surface 31C formed on the upper surface of the top of the lead pin main body.
このようにして製造されたリードピンにおいては、銀ろ
う部材が取り付けられていない欠陥品の発生率が極めて
小さく、また接合された銀ろう部材の高さもばらつきが
極めて少なかった。In the lead pins manufactured in this manner, the incidence of defective products in which no silver solder member was attached was extremely low, and the heights of the joined silver solder members also had very little variation.
なお上述の例における各部分の寸法および組成は、それ
らの−例を示すものであり、本発明をこれらに限定する
ことを意図するもではない。特に、湾曲面の形状につい
ては理想的には銀ろうの形状に応じた曲率を持つことが
望ましいが、実用上は銀ろうが安定して位置することの
出来る凹日をそなえていてもよく、所謂ポンチ穴のよう
な形状でも何等差し支えない。Note that the dimensions and compositions of each part in the above-mentioned examples are merely examples, and the present invention is not intended to be limited thereto. In particular, it is ideal that the shape of the curved surface has a curvature that corresponds to the shape of the silver solder, but in practice it may have a concave surface that allows the silver solder to be stably positioned. There is no problem even if it has a shape like a so-called punch hole.
また、銀ろうの接合には、本実施例において述べたよう
な真空あるいは3囲気中での銀ろう融点未満の加熱以外
に、スポット溶接、超音波溶接等を用いることが可能で
あり、これらの接合方法によっても、銀ろう供給時の原
形をほぼ維持しかつ銀ろうの組織も供給時とほぼ同様に
維持したままの接合を達成でき、上記実施例と同様な効
果と機能を発揮することができる。In addition, for joining silver solder, it is possible to use spot welding, ultrasonic welding, etc. in addition to heating below the melting point of silver solder in a vacuum or three atmospheres as described in this example. Depending on the joining method, it is possible to achieve a joining in which the original shape at the time of silver solder supply is maintained and the structure of the silver solder is maintained almost the same as at the time of supply, and the same effects and functions as in the above embodiment can be achieved. can.
第1図は本AgQの一実施例のリードピンを示す斜視図
、第2図は第1図のり−ドビン本体を示す側面図、第3
図は銀ろう部材の接合工程を説明する断面図、第4図は
従来の銀ろう接合方法を示す断面図、第5図は溶融した
銀ろうの理想的な状態を示す側面図、第6図および第7
図はリードピン本体の頂部上面かみ流れた銀ろうの状態
を示す側面図である。
1 リードピン
3 リードピン本体
5 銀ろう部材
7 治具
31 リードピン本体の頂部
312 頂部下面
31b 頂部上面
31c 湾曲面
33 脚部
第2図
特許庁長官 黒 1)明 雄 殿
1.事件の表示 昭和61年特許願第306089
号2、発明の名称 リ − ド ビ ン3、補
正をする者
事件との関係 出願人
名 称 株式会社 徳 力 本 居
間 (591)三井物産株式会社
4、代理人
7、補正の内容Fig. 1 is a perspective view showing the lead pin of one embodiment of this AgQ, Fig. 2 is a side view showing the glue-dobbin main body of Fig. 1, and Fig. 3
The figure is a cross-sectional view explaining the process of joining silver solder members, Figure 4 is a cross-sectional view showing a conventional silver solder joining method, Figure 5 is a side view showing the ideal state of molten silver solder, and Figure 6 and the seventh
The figure is a side view showing the state of the silver solder that has flowed through the top surface of the lead pin body. 1 Lead pin 3 Lead pin main body 5 Silver brazing member 7 Jig 31 Top part 312 of lead pin main body Top bottom surface 31b Top top surface 31c Curved surface 33 Legs Figure 2 Commissioner of the Patent Office Black 1) Akira Yu Tono 1. Display of case 1985 patent application No. 306089
No. 2, Name of the invention Lead Bin 3, Relationship with the case of the person making the amendment Applicant name: Tokuriki Co., Ltd. (591) Mitsui & Co., Ltd. 4, Agent 7, Contents of the amendment
Claims (1)
ードピンであって、リードピン本体と、このリードピン
本体の一方の端面に取り付けたほぼ球体形状をした銀ろ
う部材とからなり、前記リードピン本体の銀ろう取り付
け面の少なくとも一部分には、湾曲面または凹部を有す
る面が形成されており、当該湾曲面に前記銀ろう部材が
拡散接合されていることを特徴とするリードピン。A lead pin used for an external terminal of an IC ceramic package, etc., and consists of a lead pin body and a silver solder member having a substantially spherical shape attached to one end surface of the lead pin body, and at least the silver solder attachment surface of the lead pin body. A lead pin characterized in that a portion thereof is formed with a curved surface or a surface having a recess, and the silver solder member is diffusion bonded to the curved surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30608986A JPS63157455A (en) | 1986-12-22 | 1986-12-22 | Lead pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30608986A JPS63157455A (en) | 1986-12-22 | 1986-12-22 | Lead pin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63157455A true JPS63157455A (en) | 1988-06-30 |
Family
ID=17952895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30608986A Pending JPS63157455A (en) | 1986-12-22 | 1986-12-22 | Lead pin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63157455A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7791185B2 (en) * | 2007-06-05 | 2010-09-07 | Intel Corporation | Pin grid array package substrate including pins having curved pin heads |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
-
1986
- 1986-12-22 JP JP30608986A patent/JPS63157455A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121063A (en) * | 1983-12-02 | 1985-06-28 | Tanaka Kikinzoku Kogyo Kk | Production of lead pin with spherical brazing filler metal |
JPS60166163A (en) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | Brazing method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7791185B2 (en) * | 2007-06-05 | 2010-09-07 | Intel Corporation | Pin grid array package substrate including pins having curved pin heads |
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