JPS54134975A - Connection method of semiconductor device - Google Patents
Connection method of semiconductor deviceInfo
- Publication number
- JPS54134975A JPS54134975A JP4213178A JP4213178A JPS54134975A JP S54134975 A JPS54134975 A JP S54134975A JP 4213178 A JP4213178 A JP 4213178A JP 4213178 A JP4213178 A JP 4213178A JP S54134975 A JPS54134975 A JP S54134975A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- film
- plating
- protruding electrode
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4213178A JPS54134975A (en) | 1978-04-12 | 1978-04-12 | Connection method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4213178A JPS54134975A (en) | 1978-04-12 | 1978-04-12 | Connection method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54134975A true JPS54134975A (en) | 1979-10-19 |
JPS6342407B2 JPS6342407B2 (ja) | 1988-08-23 |
Family
ID=12627371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4213178A Granted JPS54134975A (en) | 1978-04-12 | 1978-04-12 | Connection method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54134975A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5171711A (en) * | 1990-10-18 | 1992-12-15 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing integrated circuit devices |
-
1978
- 1978-04-12 JP JP4213178A patent/JPS54134975A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5171711A (en) * | 1990-10-18 | 1992-12-15 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing integrated circuit devices |
Also Published As
Publication number | Publication date |
---|---|
JPS6342407B2 (ja) | 1988-08-23 |
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