JPS54121669A - Manufacture of semiconductor element - Google Patents

Manufacture of semiconductor element

Info

Publication number
JPS54121669A
JPS54121669A JP2867678A JP2867678A JPS54121669A JP S54121669 A JPS54121669 A JP S54121669A JP 2867678 A JP2867678 A JP 2867678A JP 2867678 A JP2867678 A JP 2867678A JP S54121669 A JPS54121669 A JP S54121669A
Authority
JP
Japan
Prior art keywords
layer
film
electrode
plating
vamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2867678A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2867678A priority Critical patent/JPS54121669A/en
Publication of JPS54121669A publication Critical patent/JPS54121669A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To facilitate formation of the metal vamp electrode protruded over the surface of the semiconductor substrate by giving the heat treatment to the Sn plating layer coated on the surface of the Au vamp electrode before the unnecessary area of the foundation metal layer is removed by etching.
CONSTITUTION: Al wiring layer 3 is coated via SiO2 film 2 onto Si substrate 1 to which the active element, the passive element and the like are provided, and SiO2 film 4 is grown while exposing part of layer 3. Then Cr alloy layer 5 (foundation metal layer) along with Pd film 6 are deposited on the entire surface, and the both ends are covered with resist film 7. After this, Au vamp electrode 8 is formed through plating with use of film 7 as the mask, and furthermore Sn plating layer 9 to be used as the solder material layer is coated over electrode 8 by also plating. Then Au-Sn alloy layer 10 is formed on the surface of electrode 8 via the heat treatment, and film 7 is removed to etch away the unnecessary areas of 1st and 2nd foundation metal films 5 and 6. In such way, the area of the protruded electrode can be increased with reduced contact resistance.
COPYRIGHT: (C)1979,JPO&Japio
JP2867678A 1978-03-15 1978-03-15 Manufacture of semiconductor element Pending JPS54121669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2867678A JPS54121669A (en) 1978-03-15 1978-03-15 Manufacture of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2867678A JPS54121669A (en) 1978-03-15 1978-03-15 Manufacture of semiconductor element

Publications (1)

Publication Number Publication Date
JPS54121669A true JPS54121669A (en) 1979-09-20

Family

ID=12255093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2867678A Pending JPS54121669A (en) 1978-03-15 1978-03-15 Manufacture of semiconductor element

Country Status (1)

Country Link
JP (1) JPS54121669A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177654A (en) * 1984-02-24 1985-09-11 Hitachi Ltd Electronic parts and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177654A (en) * 1984-02-24 1985-09-11 Hitachi Ltd Electronic parts and manufacture thereof

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