JPS57124431A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57124431A JPS57124431A JP967281A JP967281A JPS57124431A JP S57124431 A JPS57124431 A JP S57124431A JP 967281 A JP967281 A JP 967281A JP 967281 A JP967281 A JP 967281A JP S57124431 A JPS57124431 A JP S57124431A
- Authority
- JP
- Japan
- Prior art keywords
- film
- alloy
- implanted
- projections
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Abstract
PURPOSE:To prevent the formation of projections on the surface of a metal film when a heat treatment is performed by a method wherein, after the metal wiring film has been formed, a rare-gas element or B, As, P or Si ion is implanted. CONSTITUTION:An SiO2 film 3 is formed on the P type Si substrate 1 whereon an N<+> type diffusion layer was formed, and a contact hole is provided on the SiO2 film 3. On this SiO film 3, an Al-1.5% Si alloy film 5 of approximately 1.0mum is formed by sputtering, and for example, Ar<+>40KeV is ion-implanted at a dosage of 3X10<15>atom/cm<2>. After a resist patterning process has been performed, an Al-Si alloy is etched, and a PSG film for passivation is formed after the resist has been removed. Accordingly, no projections are formed on the alloy film 5 in the heat treatment process when the PSG film is formed, and the breakdown of the insulating film on the alloy film 5 and the breaking of wiring can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP967281A JPS57124431A (en) | 1981-01-27 | 1981-01-27 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP967281A JPS57124431A (en) | 1981-01-27 | 1981-01-27 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57124431A true JPS57124431A (en) | 1982-08-03 |
Family
ID=11726691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP967281A Pending JPS57124431A (en) | 1981-01-27 | 1981-01-27 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57124431A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57183055A (en) * | 1981-05-06 | 1982-11-11 | Mitsubishi Electric Corp | Semiconductor device |
JPS57183053A (en) * | 1981-05-06 | 1982-11-11 | Mitsubishi Electric Corp | Semiconductor device |
JPS59188120A (en) * | 1983-03-12 | 1984-10-25 | Ricoh Co Ltd | Forming method for thin film |
JPS6045040A (en) * | 1983-08-23 | 1985-03-11 | Ricoh Co Ltd | Formation of thin film pattern |
JPS6154644A (en) * | 1984-08-25 | 1986-03-18 | Ricoh Co Ltd | Thin film and manufacture thereof |
JPS6190444A (en) * | 1984-10-11 | 1986-05-08 | Ricoh Co Ltd | Manufacture of thin film |
JPS61137342A (en) * | 1984-12-08 | 1986-06-25 | Ricoh Co Ltd | Manufacture of thin film |
JPH0210856A (en) * | 1988-06-29 | 1990-01-16 | Matsushita Electron Corp | Manufacture of semiconductor device |
JPH0567610A (en) * | 1991-03-19 | 1993-03-19 | Nec Corp | Semiconductor device and manufacture thereof |
-
1981
- 1981-01-27 JP JP967281A patent/JPS57124431A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57183055A (en) * | 1981-05-06 | 1982-11-11 | Mitsubishi Electric Corp | Semiconductor device |
JPS57183053A (en) * | 1981-05-06 | 1982-11-11 | Mitsubishi Electric Corp | Semiconductor device |
JPS59188120A (en) * | 1983-03-12 | 1984-10-25 | Ricoh Co Ltd | Forming method for thin film |
JPS6045040A (en) * | 1983-08-23 | 1985-03-11 | Ricoh Co Ltd | Formation of thin film pattern |
JPS6154644A (en) * | 1984-08-25 | 1986-03-18 | Ricoh Co Ltd | Thin film and manufacture thereof |
JPS6190444A (en) * | 1984-10-11 | 1986-05-08 | Ricoh Co Ltd | Manufacture of thin film |
JPS61137342A (en) * | 1984-12-08 | 1986-06-25 | Ricoh Co Ltd | Manufacture of thin film |
JPH0210856A (en) * | 1988-06-29 | 1990-01-16 | Matsushita Electron Corp | Manufacture of semiconductor device |
JPH0567610A (en) * | 1991-03-19 | 1993-03-19 | Nec Corp | Semiconductor device and manufacture thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4285761A (en) | Process for selectively forming refractory metal silicide layers on semiconductor devices | |
JPS57124431A (en) | Manufacture of semiconductor device | |
JPS5471564A (en) | Production of semiconductor device | |
JPS57145340A (en) | Manufacture of semiconductor device | |
JPS54141585A (en) | Semiconductor integrated circuit device | |
JPS5785246A (en) | Semiconductor device | |
JPS52106675A (en) | Manufacturing method of semiconductor device | |
JPS5394767A (en) | Manufacture of semiconductor device | |
JPS57155775A (en) | Semiconductor device | |
JPS5766651A (en) | Manufacture of semiconductor device | |
JPS54103674A (en) | Production of semiconductor device | |
JPS56130948A (en) | Semiconductor device | |
JPS5478659A (en) | Menufacture of semiconductor device | |
JPS5443466A (en) | Electrode formation method for semiconductor device | |
JPS57183055A (en) | Semiconductor device | |
JPS533066A (en) | Electrode formation method | |
JPS55120170A (en) | Mos type semiconductor device | |
JPS57186341A (en) | Semiconductor device | |
JPS558090A (en) | Semiconductor device | |
JPS5656674A (en) | Mosfet of high pressure resisting property and preparation thereof | |
JPS5489594A (en) | Manufacture for integrated circuit | |
JPS56101756A (en) | Manufacture of semiconductor device | |
JPS524170A (en) | Manufacturing process of semiconductor element | |
JPS5519880A (en) | Manufacturing method of semiconductor device | |
JPS57114254A (en) | Semiconductor device and manufacture thereof |