JPS5357971A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5357971A JPS5357971A JP13338476A JP13338476A JPS5357971A JP S5357971 A JPS5357971 A JP S5357971A JP 13338476 A JP13338476 A JP 13338476A JP 13338476 A JP13338476 A JP 13338476A JP S5357971 A JPS5357971 A JP S5357971A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- insulation substrate
- electrodes
- narrow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13338476A JPS5357971A (en) | 1976-11-05 | 1976-11-05 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13338476A JPS5357971A (en) | 1976-11-05 | 1976-11-05 | Production of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5357971A true JPS5357971A (en) | 1978-05-25 |
JPS5751933B2 JPS5751933B2 (ja) | 1982-11-05 |
Family
ID=15103464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13338476A Granted JPS5357971A (en) | 1976-11-05 | 1976-11-05 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5357971A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710258A (en) * | 1980-05-20 | 1982-01-19 | Gao Ges Automation Org | Integrated circuit chip carrier element for identification card |
JPS5789276A (en) * | 1980-11-26 | 1982-06-03 | Alps Electric Co Ltd | Photo chip element |
JP2011072331A (ja) * | 2009-09-29 | 2011-04-14 | Nippon Pachinko Buhin Kk | 遊技機用発光装置及びそれを備えた遊技機 |
JP2016151666A (ja) * | 2015-02-17 | 2016-08-22 | キヤノン株式会社 | 走査光学装置 |
US10281834B2 (en) | 2015-02-17 | 2019-05-07 | Canon Kabushiki Kaisha | Optical scanning device |
JP2019139249A (ja) * | 2019-05-07 | 2019-08-22 | キヤノン株式会社 | 走査光学装置 |
-
1976
- 1976-11-05 JP JP13338476A patent/JPS5357971A/ja active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5710258A (en) * | 1980-05-20 | 1982-01-19 | Gao Ges Automation Org | Integrated circuit chip carrier element for identification card |
JPH041499B2 (ja) * | 1980-05-20 | 1992-01-13 | Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh | |
JPS5789276A (en) * | 1980-11-26 | 1982-06-03 | Alps Electric Co Ltd | Photo chip element |
JP2011072331A (ja) * | 2009-09-29 | 2011-04-14 | Nippon Pachinko Buhin Kk | 遊技機用発光装置及びそれを備えた遊技機 |
JP2016151666A (ja) * | 2015-02-17 | 2016-08-22 | キヤノン株式会社 | 走査光学装置 |
US10281834B2 (en) | 2015-02-17 | 2019-05-07 | Canon Kabushiki Kaisha | Optical scanning device |
US20190243279A1 (en) * | 2015-02-17 | 2019-08-08 | Canon Kabushiki Kaisha | Optical scanning device |
US10649360B2 (en) * | 2015-02-17 | 2020-05-12 | Canon Kabushiki Kaisha | Optical scanning device |
JP2019139249A (ja) * | 2019-05-07 | 2019-08-22 | キヤノン株式会社 | 走査光学装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS5751933B2 (ja) | 1982-11-05 |
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