JPS5344177A - Production of semiconductor integrated circuit support body - Google Patents

Production of semiconductor integrated circuit support body

Info

Publication number
JPS5344177A
JPS5344177A JP11913876A JP11913876A JPS5344177A JP S5344177 A JPS5344177 A JP S5344177A JP 11913876 A JP11913876 A JP 11913876A JP 11913876 A JP11913876 A JP 11913876A JP S5344177 A JPS5344177 A JP S5344177A
Authority
JP
Japan
Prior art keywords
production
integrated circuit
support body
semiconductor integrated
circuit support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11913876A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP11913876A priority Critical patent/JPS5344177A/en
Publication of JPS5344177A publication Critical patent/JPS5344177A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: The yield of an IC is improved and cost is reduced by bending 180° the end portions of the lead wires protruding from the circumfencial edges of a long-length electric insulation tape toward the central part thereby forming protrusions.
COPYRIGHT: (C)1978,JPO&Japio
JP11913876A 1976-10-04 1976-10-04 Production of semiconductor integrated circuit support body Pending JPS5344177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11913876A JPS5344177A (en) 1976-10-04 1976-10-04 Production of semiconductor integrated circuit support body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11913876A JPS5344177A (en) 1976-10-04 1976-10-04 Production of semiconductor integrated circuit support body

Publications (1)

Publication Number Publication Date
JPS5344177A true JPS5344177A (en) 1978-04-20

Family

ID=14753862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11913876A Pending JPS5344177A (en) 1976-10-04 1976-10-04 Production of semiconductor integrated circuit support body

Country Status (1)

Country Link
JP (1) JPS5344177A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02192747A (en) * 1989-01-20 1990-07-30 Hitachi Cable Ltd Tape carrier for tab
JPH04323837A (en) * 1991-04-24 1992-11-13 Nec Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153467A (en) * 1974-11-06 1976-05-11 Hitachi Ltd Handotaisochino seizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153467A (en) * 1974-11-06 1976-05-11 Hitachi Ltd Handotaisochino seizohoho

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02192747A (en) * 1989-01-20 1990-07-30 Hitachi Cable Ltd Tape carrier for tab
JPH04323837A (en) * 1991-04-24 1992-11-13 Nec Corp Semiconductor device

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