JPS523387A - Manufacturing method of semiconductor device - Google Patents

Manufacturing method of semiconductor device

Info

Publication number
JPS523387A
JPS523387A JP50079015A JP7901575A JPS523387A JP S523387 A JPS523387 A JP S523387A JP 50079015 A JP50079015 A JP 50079015A JP 7901575 A JP7901575 A JP 7901575A JP S523387 A JPS523387 A JP S523387A
Authority
JP
Japan
Prior art keywords
manufacturing
semiconductor device
short
circuit
pin hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50079015A
Other languages
English (en)
Other versions
JPS576252B2 (ja
Inventor
Yoshihiko Muraki
Masao Kachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP50079015A priority Critical patent/JPS523387A/ja
Publication of JPS523387A publication Critical patent/JPS523387A/ja
Publication of JPS576252B2 publication Critical patent/JPS576252B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP50079015A 1975-06-24 1975-06-24 Manufacturing method of semiconductor device Granted JPS523387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50079015A JPS523387A (en) 1975-06-24 1975-06-24 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50079015A JPS523387A (en) 1975-06-24 1975-06-24 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS523387A true JPS523387A (en) 1977-01-11
JPS576252B2 JPS576252B2 (ja) 1982-02-04

Family

ID=13678108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50079015A Granted JPS523387A (en) 1975-06-24 1975-06-24 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS523387A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989665A (ja) * 1982-09-27 1984-05-23 セルビ・エ・チ・エツセ・ピ・ア ピペラジン誘導体を有効成分とする抗コリンまたは抗ヒスタミン剤

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138244U (ja) * 1983-03-02 1984-09-14 ロ−ム株式会社 リ−ドフレ−ム
JPS62108562A (ja) * 1985-11-06 1987-05-19 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPS62177048U (ja) * 1986-04-28 1987-11-10
JPS63172147U (ja) * 1987-04-28 1988-11-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989665A (ja) * 1982-09-27 1984-05-23 セルビ・エ・チ・エツセ・ピ・ア ピペラジン誘導体を有効成分とする抗コリンまたは抗ヒスタミン剤
JPS6139289B2 (ja) * 1982-09-27 1986-09-03 Serubi E Co Spa

Also Published As

Publication number Publication date
JPS576252B2 (ja) 1982-02-04

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