JPS62177048U - - Google Patents

Info

Publication number
JPS62177048U
JPS62177048U JP6495386U JP6495386U JPS62177048U JP S62177048 U JPS62177048 U JP S62177048U JP 6495386 U JP6495386 U JP 6495386U JP 6495386 U JP6495386 U JP 6495386U JP S62177048 U JPS62177048 U JP S62177048U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
bands
band
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6495386U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6495386U priority Critical patent/JPS62177048U/ja
Publication of JPS62177048U publication Critical patent/JPS62177048U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図と第２図は本考案の一実施例を示すもの
で、第１図はリードフレームの平面図、第２図は
第１図の―線一部省略断面図である。また第
３図と第４図は従来の金型の一部を示すもので、
第３図は金型の平面図、第４図は第３図の―
線一部省略拡大断面図である。 １０…リードフレーム、１１…帯、１３…リー
ド端子、１５…溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 平行な２本の帯と、これら２本の帯の内側方向
    にのばされたリード端子とからなる半導体素子の
    リードフレームにおいて、上記帯には幅方向の一
    側から他側へつながる溝が設けられていることを
    特徴とする半導体素子のリードフレーム。
JP6495386U 1986-04-28 1986-04-28 Pending JPS62177048U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6495386U JPS62177048U (ja) 1986-04-28 1986-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6495386U JPS62177048U (ja) 1986-04-28 1986-04-28

Publications (1)

Publication Number Publication Date
JPS62177048U true JPS62177048U (ja) 1987-11-10

Family

ID=30901580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6495386U Pending JPS62177048U (ja) 1986-04-28 1986-04-28

Country Status (1)

Country Link
JP (1) JPS62177048U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015133363A (ja) * 2014-01-09 2015-07-23 株式会社カネカ 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517382B2 (ja) * 1975-03-03 1980-05-10
JPS576252B2 (ja) * 1975-06-24 1982-02-04
JPS5923534A (ja) * 1982-07-30 1984-02-07 Hitachi Ltd 半導体装置の製造方法
JPS5929442A (ja) * 1982-08-10 1984-02-16 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517382B2 (ja) * 1975-03-03 1980-05-10
JPS576252B2 (ja) * 1975-06-24 1982-02-04
JPS5923534A (ja) * 1982-07-30 1984-02-07 Hitachi Ltd 半導体装置の製造方法
JPS5929442A (ja) * 1982-08-10 1984-02-16 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015133363A (ja) * 2014-01-09 2015-07-23 株式会社カネカ 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置

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