JPS52112273A - Scribing method of semiconductor wafer - Google Patents

Scribing method of semiconductor wafer

Info

Publication number
JPS52112273A
JPS52112273A JP2861876A JP2861876A JPS52112273A JP S52112273 A JPS52112273 A JP S52112273A JP 2861876 A JP2861876 A JP 2861876A JP 2861876 A JP2861876 A JP 2861876A JP S52112273 A JPS52112273 A JP S52112273A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
scribing method
scribing
semiconductor
prescribed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2861876A
Other languages
Japanese (ja)
Inventor
Shigeru Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2861876A priority Critical patent/JPS52112273A/en
Publication of JPS52112273A publication Critical patent/JPS52112273A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To prevent cracks at cross point of braking groove by determining both scribing direction and order in accordance with the crystal surface of semiconductor and then by performing scribing through change of cutter load as prescribed.
COPYRIGHT: (C)1977,JPO&Japio
JP2861876A 1976-03-18 1976-03-18 Scribing method of semiconductor wafer Pending JPS52112273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2861876A JPS52112273A (en) 1976-03-18 1976-03-18 Scribing method of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2861876A JPS52112273A (en) 1976-03-18 1976-03-18 Scribing method of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS52112273A true JPS52112273A (en) 1977-09-20

Family

ID=12253529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2861876A Pending JPS52112273A (en) 1976-03-18 1976-03-18 Scribing method of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS52112273A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002023A1 (en) * 1985-10-04 1987-04-09 Fuel Tech, Inc. Reduction of nitrogen- and carbon-based pollutants

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002023A1 (en) * 1985-10-04 1987-04-09 Fuel Tech, Inc. Reduction of nitrogen- and carbon-based pollutants

Similar Documents

Publication Publication Date Title
JPS5356972A (en) Mesa type semiconductor device
JPS51134071A (en) Method to eliminate crystal defects of silicon
JPS5333050A (en) Production of semiconductor element
JPS52112273A (en) Scribing method of semiconductor wafer
JPS5421265A (en) Forming method of semiconductor oxide film
JPS5253673A (en) Device and production for semiconductor
JPS5249991A (en) Sputtering method
JPS5228879A (en) Semiconductor device and method for its production
JPS5436182A (en) Manufacture for semiconductor device
JPS5378165A (en) Cutting method for semiconductor substrate
JPS531471A (en) Manufacture for semiconductor device
JPS544064A (en) Manufacture for semiconductor device
JPS52140275A (en) Processing method for semiconductor wafer
JPS534476A (en) Mask alignment method to semiconductor substrate
JPS5211761A (en) Method of cutting semiconductor wafers
JPS5353143A (en) Method of plant construction
JPS52122475A (en) Production of semiconductor device
JPS5317064A (en) Impurity diffusion method
JPS5424575A (en) Handling method of wafer
JPS5230171A (en) Method for fabrication of semiconductor device
JPS52144972A (en) Formation method of photo resist film
JPS52127083A (en) Semiconductor strain element
JPS51140198A (en) Crystal working process
JPS52127063A (en) Production of semiconductor ic device
JPS5270772A (en) Semiconductor rectifier