JPS4917381A - - Google Patents

Info

Publication number
JPS4917381A
JPS4917381A JP48044237A JP4423773A JPS4917381A JP S4917381 A JPS4917381 A JP S4917381A JP 48044237 A JP48044237 A JP 48044237A JP 4423773 A JP4423773 A JP 4423773A JP S4917381 A JPS4917381 A JP S4917381A
Authority
JP
Japan
Prior art keywords
copper
substrate
metals
heating
direct bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48044237A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5713515B2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4917381A publication Critical patent/JPS4917381A/ja
Publication of JPS5713515B2 publication Critical patent/JPS5713515B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6586—Processes characterised by the flow of gas
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/08—Non-oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/341—Silica or silicates
    • C—CHEMISTRY; METALLURGY
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/346—Titania or titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/403—Refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/408—Noble metals, e.g. palladium, platina or silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/54—Oxidising the surface before joining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/60—Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/74—Forming laminates or joined articles comprising at least two different interlayers separated by a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Chemical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP4423773A 1972-04-20 1973-04-20 Expired JPS5713515B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24588972A 1972-04-20 1972-04-20

Publications (2)

Publication Number Publication Date
JPS4917381A true JPS4917381A (de) 1974-02-15
JPS5713515B2 JPS5713515B2 (de) 1982-03-17

Family

ID=22928519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4423773A Expired JPS5713515B2 (de) 1972-04-20 1973-04-20

Country Status (6)

Country Link
US (1) US3766634A (de)
JP (1) JPS5713515B2 (de)
DE (1) DE2319854C2 (de)
FR (1) FR2181049B1 (de)
GB (1) GB1394322A (de)
IT (1) IT983841B (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102532A (ja) * 1981-12-15 1983-06-18 Toshiba Corp 半導体装置
JPH01308885A (ja) * 1975-07-30 1989-12-13 General Electric Co <Ge> セラミック基体に銅部材を結合する方法
JP2005530353A (ja) * 2002-06-20 2005-10-06 クラミック エレクトロニクス ゲーエムベーハー 電気回路またはモジュール用の金属セラミック基板と、そのような基板およびそのような基板を含むモジュールを製作する方法
JP2021510928A (ja) * 2018-01-19 2021-04-30 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ レーザ部品のためのハウジングカバーを製造する方法、並びにレーザ部品のためのハウジングカバー及びレーザ部品

Families Citing this family (210)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911570A (en) * 1973-08-21 1975-10-14 Electro Oxide Corp Electrical connector and method of making
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
JPS54157277A (en) * 1978-06-01 1979-12-12 Nippon Electric Co Method of printed board for microwave
CH633391A5 (de) * 1978-11-22 1982-11-30 Bbc Brown Boveri & Cie Scheibenrotor fuer eine elektrische maschine.
JPS55104979A (en) * 1979-02-02 1980-08-11 Kogyo Gijutsuin Adhesion of ceramic molded body to transition metal
JPS599510B2 (ja) * 1979-10-15 1984-03-02 昭栄化学工業株式会社 点火栓用セラミツク圧電体の製造方法
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
US4245488A (en) * 1980-01-04 1981-01-20 General Electric Company Use of motor power control circuit losses in a clothes washing machine
DE3036128C2 (de) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
DE3204167A1 (de) * 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten
US4500029A (en) * 1982-06-11 1985-02-19 General Electric Company Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such assembly
DE3223948A1 (de) * 1982-06-26 1983-12-29 Tigra Verschleiß- und Werkzeugtechnik GmbH, 7240 Horb Verfahren zum verloeten keramischer und metallischer werkstoffe untereinander
EP0097944B1 (de) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Verfahren zum direkten Verbinden von keramischen- und Metallkörpern und derartiger Verbundkörper
DE3233022A1 (de) * 1982-09-06 1984-03-08 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Verfahren zum direkten verbinden eines koerpers mit einem keramischen substrat
DE3241926A1 (de) * 1982-11-12 1984-05-17 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Verbindung eines keramischen rotationsbauteils mit einem metallischen rotationsbauteil fuer stroemungsmaschinen, insbesondere gasturbinentriebwerke
JPS59150453A (ja) * 1982-12-23 1984-08-28 Toshiba Corp 半導体モジユ−ル用基板の製造方法
JPS59121860A (ja) * 1982-12-28 1984-07-14 Toshiba Corp 半導体用基板
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
GB8305366D0 (en) * 1983-02-25 1983-03-30 Secr Defence Cathode ray tube
JPS59190279A (ja) * 1983-04-13 1984-10-29 株式会社東芝 セラミツクス構造体及びその製造方法
ATE23080T1 (de) * 1983-06-03 1986-11-15 Bbc Brown Boveri & Cie Kollektor fuer eine elektrische maschine und verfahren zu dessen herstellung.
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik
JPS60107845A (ja) * 1983-11-17 1985-06-13 Toshiba Corp 半導体用回路基板
US4582240A (en) * 1984-02-08 1986-04-15 Gould Inc. Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components
US4563383A (en) * 1984-03-30 1986-01-07 General Electric Company Direct bond copper ceramic substrate for electronic applications
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (de) * 1984-12-10 1988-08-03 Kollmorgen Corporation Verfahren zur Vermeidung der Blasenbildung bei der elektrolosen Metallisierung keramischer Substrate
US4602731A (en) * 1984-12-24 1986-07-29 Borg-Warner Corporation Direct liquid phase bonding of ceramics to metals
US4631099A (en) * 1985-01-04 1986-12-23 Agency Of Industrial Science & Technology Method for adhesion of oxide type ceramics with copper or alloy thereof
DE3633907A1 (de) * 1986-08-02 1988-02-04 Altan Akyuerek Verfahren zum haftfesten verbinden eines kupferkoerpers mit einem substrat
DE3639021A1 (de) * 1986-11-14 1988-05-26 Philips Patentverwaltung Verfahren zum verloeten von keramischen bauteilen
EP0273227A3 (de) * 1986-12-22 1989-01-25 Kalman F. Zsamboky Verfahren zur Verbesserung der Bindefestigkeit zwischen einer Metallschicht und einem nicht-metallischen Substrat
FR2615049B1 (fr) * 1987-05-04 1989-06-16 Alsthom Collecteur pour machine electrique tournante et procede de fabrication de ce collecteur
FR2623046B1 (fr) * 1987-11-10 1990-03-23 Telemecanique Electrique Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant
US4788765A (en) * 1987-11-13 1988-12-06 Gentron Corporation Method of making circuit assembly with hardened direct bond lead frame
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
US4924292A (en) * 1988-04-12 1990-05-08 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US4831723A (en) * 1988-04-12 1989-05-23 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US4879633A (en) * 1988-04-12 1989-11-07 Kaufman Lance R Direct bond circuit assembly with ground plane
US5070602A (en) * 1988-04-12 1991-12-10 Lance R. Kaufman Method of making a circuit assembly
US4902854A (en) * 1988-04-12 1990-02-20 Kaufman Lance R Hermetic direct bond circuit assembly
US5032691A (en) * 1988-04-12 1991-07-16 Kaufman Lance R Electric circuit assembly with voltage isolation
US4990720A (en) * 1988-04-12 1991-02-05 Kaufman Lance R Circuit assembly and method with direct bonded terminal pin
US4860164A (en) * 1988-09-01 1989-08-22 Kaufman Lance R Heat sink apparatus with electrically insulative intermediate conduit portion for coolant flow
DE3930859C2 (de) * 1988-09-20 1997-04-30 Schulz Harder Juergen Verfahren zum Verlöten wenigstens zweier Elemente
DE3930858C2 (de) * 1988-09-20 2002-01-03 Peter H Maier Modulaufbau
US5027255A (en) * 1988-10-22 1991-06-25 Westinghouse Electric Co. High performance, high current miniaturized low voltage power supply
DE3931551C2 (de) * 1989-09-22 1993-11-18 Schulz Harder Juergen Verfahren zum Herstellen eines Substrates
US5100740A (en) * 1989-09-25 1992-03-31 General Electric Company Direct bonded symmetric-metallic-laminate/substrate structures
US5653379A (en) * 1989-12-18 1997-08-05 Texas Instruments Incorporated Clad metal substrate
US5273203A (en) * 1989-12-21 1993-12-28 General Electric Company Ceramic-to-conducting-lead hermetic seal
US5241216A (en) * 1989-12-21 1993-08-31 General Electric Company Ceramic-to-conducting-lead hermetic seal
US4996116A (en) * 1989-12-21 1991-02-26 General Electric Company Enhanced direct bond structure
US5164359A (en) * 1990-04-20 1992-11-17 Eaton Corporation Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate
JP3011433B2 (ja) * 1990-05-25 2000-02-21 株式会社東芝 セラミックス回路基板の製造方法
US5418002A (en) * 1990-12-24 1995-05-23 Harris Corporation Direct bonding of copper to aluminum nitride substrates
DE4103294C2 (de) * 1991-02-04 2000-12-28 Altan Akyuerek Verfahren zum Herstellen von keramischen Leiterplatten mit Durchkontaktierungen
JPH05219690A (ja) * 1991-02-28 1993-08-27 Hitachi Ltd セラミックス摺動集電体
DE4222973A1 (de) * 1992-07-13 1994-01-20 Asea Brown Boveri Bidirektionaler Halbleiterschalter
DE69329501T2 (de) 1992-07-17 2001-05-03 Vlt Corp Verpackung für elektronische Komponenten
DE4318061C2 (de) * 1993-06-01 1998-06-10 Schulz Harder Juergen Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE4319848C2 (de) * 1993-06-03 1995-12-21 Schulz Harder Juergen Verfahren zum Herstellen eines Metall-Keramik-Substrates
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
EP0667640A3 (de) * 1994-01-14 1997-05-14 Brush Wellman Mehrlagen-Laminatprodukt und seine Herstellung.
US5490627A (en) * 1994-06-30 1996-02-13 Hughes Aircraft Company Direct bonding of copper composites to ceramics
US5586714A (en) * 1994-10-06 1996-12-24 Board Of Regents Of The University Of Nebraska Method of bonding metal to a non-metal substrate
US5644103A (en) 1994-11-10 1997-07-01 Vlt Corporation Packaging electrical components having a scallop formed in an edge of a circuit board
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
AU5960698A (en) * 1997-01-17 1998-08-07 California Institute Of Technology Microwave technique for brazing materials
DE19715540C2 (de) 1997-04-15 2002-02-07 Curamik Electronics Gmbh Verfahren zum Herstellen eines gewölbten Metall-Keramik-Substrates
DE19729677B4 (de) * 1997-07-11 2006-05-18 Curamik Electronics Gmbh Gehäuse für Halbleiterbauelemente, insbesondere für Leistungshalbleiterbauelemente
DE19749987B4 (de) * 1997-07-11 2008-09-25 Curamik Electronics Gmbh Gehäuse für Halbleiterbauelemente, insbesondere für Leistungshalbleiterbauelemente
DE19753149C2 (de) * 1997-11-12 1999-09-30 Curamik Electronics Gmbh Verfahren zum Herstellen eines Keramik-Metall-Substrates
KR20020035631A (ko) 1998-12-07 2002-05-11 가나이 쓰도무 복합재료 및 그 용도
DE19927046B4 (de) * 1999-06-14 2007-01-25 Electrovac Ag Keramik-Metall-Substrat als Mehrfachsubstrat
DE19930207C2 (de) * 1999-06-22 2001-12-06 Schulz Harder Juergen Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte- und Fixierelement zur Verwendung bei diesem Verfahren
DE19945794C2 (de) * 1999-09-15 2002-12-19 Curamik Electronics Gmbh Verfahren zum Herstellen einer Metall-Keramik-Leiterplatte mit DurchKontaktierungen
JP2001156196A (ja) 1999-09-17 2001-06-08 Toshiba Corp 高周波パッケージおよびその製造方法
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
EP1244900B1 (de) 2000-01-06 2005-01-05 Rosemount Inc. Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems)
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
DE10047525B4 (de) * 2000-09-22 2005-06-30 Curamik Electronics Gmbh Verfahren zum Herstellen eines Formkörpers unter Verwendung eines Ausgangsmaterials, welches Siliziumcarbid in Pulver- oder Partikelform sowie Kupfer enthält und so hergestellte Formkörper
EP1227353B1 (de) 2001-01-16 2005-05-04 Curamik Electronics GmbH Spiegel für Laseranwendungen sowie Verfahren zu seiner Herstellung
US6888232B2 (en) * 2001-08-15 2005-05-03 Micron Technology Semiconductor package having a heat-activated source of releasable hydrogen
JP3969987B2 (ja) * 2001-10-01 2007-09-05 Ｄｏｗａホールディングス株式会社 セラミックスと合金の接合体
DE10148550B4 (de) * 2001-10-01 2007-03-29 Electrovac Ag Verfahren zum Herstellen von Metall-Keramik-Verbundmaterialien, insbesondere Metall-Keramik-Substraten
US20030146499A1 (en) * 2001-12-18 2003-08-07 Yasuo Kondo Composite material including copper and cuprous oxide and application thereof
DE10212495B4 (de) 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats
US7754976B2 (en) 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
US6848316B2 (en) 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
JP3868854B2 (ja) * 2002-06-14 2007-01-17 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体およびその製造方法
DE10229711B4 (de) * 2002-07-02 2009-09-03 Curamik Electronics Gmbh Halbleitermodul mit Mikrokühler
DE10229712B4 (de) * 2002-07-02 2009-06-25 Jenoptik Laserdiode Gmbh Halbleitermodul
US7159757B2 (en) * 2002-09-26 2007-01-09 Dowa Mining Co., Ltd. Metal/ceramic bonding article and method for producing same
DE10261402A1 (de) 2002-12-30 2004-07-15 Schulz-Harder, Jürgen, Dr.-Ing. Wärmesenke in Form einer Heat-Pipe sowie Verfahren zum Herstellen einer solchen Wärmesenke
DE10320838B4 (de) * 2003-05-08 2014-11-06 Rogers Germany Gmbh Faserverstärktes Metall-Keramik/Glas-Verbundmaterial als Substrat für elektrische Anwendungen, Verfahren zum Herstellen eines derartigen Verbundmaterials sowie Verwendung dieses Verbundmaterials
DE10327360B4 (de) 2003-06-16 2012-05-24 Curamik Electronics Gmbh Verfahren zum Herstellen eines Keramik-Metall-Substrates
DE102004012232B4 (de) * 2004-02-20 2006-11-16 Electrovac Ag Verfahren zum Herstellen von Plattenstapeln, insbesondere zum Herstellen von aus wenigstens einem Plattenstapel bestehenden Kühlern
JP2005343768A (ja) 2004-06-07 2005-12-15 Toyota Central Res & Dev Lab Inc 金属／セラミック接合体及びその製造方法
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102005042554B4 (de) 2005-08-10 2008-04-30 Curamik Electronics Gmbh Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
DE102007008027A1 (de) 2007-02-13 2008-08-21 Curamik Electronics Gmbh Diodenlaseranordnung sowie Verfahren zum Herstellen einer solchen Anordnung
EP1959528B1 (de) 2007-02-13 2017-04-12 Laserline Gesellschaft für Entwicklung und Vertrieb von Diodenlasern mbH Diodenlaseranordnung sowie Verfahren zum Herstellen einer solchen Anordnung
DE102007030389B4 (de) 2007-03-30 2015-08-13 Rogers Germany Gmbh Moduleinheit mit einer Wärmesenke
DE102009041574A1 (de) 2008-10-29 2010-05-12 Electrovac Ag Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial
DE102009007625A1 (de) * 2008-11-14 2010-05-20 Osram Opto Semiconductors Gmbh Verbundsubstrat für einen Halbleiterchip
DE102009015520A1 (de) 2009-04-02 2010-10-07 Electrovac Ag Metall-Keramik-Substrat
DE102009022877B4 (de) 2009-04-29 2014-12-24 Rogers Germany Gmbh Gekühlte elektrische Baueinheit
US20120069524A1 (en) 2009-05-27 2012-03-22 Schulz-Harder Juergen Cooled electric unit
DE102009033029A1 (de) 2009-07-02 2011-01-05 Electrovac Ag Elektronische Vorrichtung
DE102010007919B4 (de) 2010-02-12 2022-03-03 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
DE202010009472U1 (de) 2010-04-07 2011-02-10 Electrovac Ag Verpackung für Metall-Keramik-Substrate
DE102010018668B4 (de) 2010-04-07 2012-11-15 Curamik Electronics Gmbh Verpackungseinheit für Metall-Keramik-Substrate
DE102010024520B4 (de) 2010-06-21 2017-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erhöhung der thermo-mechanischen Beständigkeit eines Metall-Keramik-Substrats
DE102010025311B4 (de) 2010-06-28 2014-08-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen einer metallischen Schicht auf ein keramisches Substrat, Verwendung des Verfahrens und Materialverbund
DE102010025313A1 (de) 2010-06-28 2011-12-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer strukturierten, elektrisch leitfähigen Schicht auf einem Keramikträger
DE102010049499B4 (de) 2010-10-27 2014-04-10 Curamik Electronics Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines solchen Substrates
DE102012106087B4 (de) 2011-07-29 2015-10-22 Rogers Germany Gmbh Verpackungseinheit für Substrate
DE102012110382B4 (de) 2011-12-21 2021-02-18 Rogers Germany Gmbh Substrat sowie Verfahren zum Herstellen eines Substrates
US8448842B1 (en) 2011-12-22 2013-05-28 Vaclong Vacuum Technology Co., Ltd. Advanced copper bonding (ACB) with ceramic substrate technology
DE102012101057A1 (de) 2011-12-27 2013-06-27 Curamik Electronics Gmbh Verfahren zur Herstellung von DCB-Substraten
DE102012102090A1 (de) 2012-01-31 2013-08-01 Curamik Electronics Gmbh Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102012102611B4 (de) 2012-02-15 2017-07-27 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013102797A1 (de) 2012-03-30 2013-10-02 Curamik Electronics Gmbh Tunnelofen
DE102012102787B4 (de) 2012-03-30 2015-04-16 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten
WO2013143534A1 (de) 2012-03-30 2013-10-03 Curamik Electronics Gmbh Tunnelofen
DE102012103786B4 (de) 2012-04-30 2017-05-18 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102012104903B4 (de) 2012-05-10 2023-07-13 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
DE102012107399B4 (de) 2012-07-10 2014-09-11 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie Metall-Keramik-Substrat
DE102012106244B4 (de) 2012-07-11 2020-02-20 Rogers Germany Gmbh Metall-Keramik-Substrat
DE102012107570B4 (de) * 2012-08-17 2017-08-03 Rogers Germany Gmbh Verfahren zur Herstellung von Hohlkörpern, insbesondere von Kühlern, Hohlkörper sowie Kühler enthaltende elektrische oder elektronische Baugruppen
DE102012110322B4 (de) 2012-10-29 2014-09-11 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013102540B4 (de) 2013-02-22 2019-07-04 Rogers Germany Gmbh Metall-Keramik-Substrat, Modulanordnung sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013104739B4 (de) 2013-03-14 2022-10-27 Rogers Germany Gmbh Metall-Keramik-Substrate sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013102637B4 (de) 2013-03-14 2017-08-31 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines derartigen Metall-Keramik-Substrates und Anordnung von derartigen Metall-Keramik-Substraten
DE102013104055B4 (de) 2013-04-22 2023-08-31 Rogers Germany Gmbh Basissubstrat, Metall-Keramik-Substrat hergestellt aus einem Basissubstrat sowie Verfahren zum Herstellen eines Basissubstrates
DE102013105528B4 (de) 2013-05-29 2021-09-02 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013108610A1 (de) 2013-08-06 2015-02-12 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013013842B4 (de) 2013-08-20 2015-10-15 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie Metall-Keramik-Substrat
DE102013113734B4 (de) 2013-12-10 2018-03-08 Rogers Germany Gmbh Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013113736B4 (de) 2013-12-10 2019-11-14 Rogers Germany Gmbh Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102014106694B3 (de) * 2014-05-13 2015-04-02 Rogers Germany Gmbh Verfahren zur Metallisierung zumindest eines plattenförmigen Keramiksubstrates sowie Metall-Keramik-Substrat
DE102014215377B4 (de) 2014-08-05 2019-11-07 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen von doppelseitig metallisierten Keramik-Substraten
DE102014224588B4 (de) 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines plattenförmigen metallisierten Keramik-Substrats, Träger zum Herstellen des Substrats und Verwendung des Trägers
DE102014119386B4 (de) 2014-12-22 2019-04-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Metall-Keramik-Substrates und zugehöriges Metall-Keramik-Substrat
DE102015102657B4 (de) 2015-02-25 2018-07-19 Rogers Germany Gmbh Verfahren zur Herstellung eines Kupfer-Keramik-Verbundsubstrats
JP7032042B2 (ja) 2015-12-22 2022-03-08 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー 厚膜ペーストを用いて改善された直接接合銅（ｄｉｒｅｃｔ－ｂｏｎｄｅｄ ｃｏｐｐｅｒ）基板
DE102016203112B4 (de) 2016-02-26 2019-08-29 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
EP3210957B1 (de) 2016-02-26 2019-01-02 Heraeus Deutschland GmbH & Co. KG Kupfer-keramik-verbund
EP3210951B9 (de) 2016-02-26 2021-05-19 Heraeus Deutschland GmbH & Co. KG Kupfer-keramik-verbund
DE202016008307U1 (de) 2016-02-26 2017-07-10 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE102016203030A1 (de) 2016-02-26 2017-08-31 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE202016008286U1 (de) 2016-02-26 2017-06-21 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
US11584696B2 (en) 2016-02-26 2023-02-21 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
DE102016203058B3 (de) 2016-02-26 2017-05-18 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund und Modul
DE202016008370U1 (de) 2016-02-26 2017-09-11 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE202016008287U1 (de) 2016-02-26 2017-06-21 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE202016008371U1 (de) 2016-02-26 2017-09-11 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
EP3210956B1 (de) 2016-02-26 2018-04-11 Heraeus Deutschland GmbH & Co. KG Kupfer-keramik-verbund
EP3301082A1 (de) 2016-09-30 2018-04-04 Infineon Technologies AG Verfahren zur herstellung eines metall-keramik-substrats und metall-keramik-substrat
DE102016118784A1 (de) 2016-10-04 2018-04-05 Infineon Technologies Ag Chipträger, konfiguriert zur delaminierungsfreien Kapselung und stabilen Sinterung
EP3326986B1 (de) 2016-11-28 2020-11-25 Infineon Technologies AG Verfahren zur herstellung eines metall-keramik-substrats
DE102016125348B4 (de) 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats
DE102017114891A1 (de) 2017-07-04 2019-01-10 Rogers Germany Gmbh Verfahren zur Herstellung einer Durchkontaktierung in einer aus einer Keramik gefertigten Trägerschicht und Trägerschicht mit Durchkontaktierung
DE102017121015A1 (de) 2017-09-12 2019-03-14 Rogers Germany Gmbh Adapterelement zum Anbinden eines Bauelements wie einer Laserdiode an einen Kühlkörper, ein System aus einer Laserdiode, einem Kühlkörper und einem Adapterelement und Verfahren zur Herstellung eines Adapterelements
DE102017128308B4 (de) 2017-11-29 2020-04-23 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats
DE102017128316B4 (de) 2017-11-29 2019-12-05 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und Metall-Keramik-Substrat
DE102018104532B4 (de) 2018-02-28 2023-06-29 Rogers Germany Gmbh Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats
DE102018104521B4 (de) 2018-02-28 2022-11-17 Rogers Germany Gmbh Metall-Keramik-Substrate
DE102018207955B4 (de) 2018-05-22 2023-05-17 Schweizer Electronic Ag Leiterplattenmodul mit integriertem leistungselektronischen Metall-Keramik-Modul sowie Verfahren zu dessen Herstellung
DE102018123681A1 (de) 2018-09-26 2020-03-26 Rogers Germany Gmbh Trägersubstrat für elektrische, insbesondere elektronische Bauteile und Verfahren zum Herstellen eines Trägersubstrats
CN109946249B (zh) * 2019-03-18 2021-06-01 江苏科技大学 一种利用顶空单滴液相微萃取法和智能设备比色测定硫化氢的方法
DE102019110106A1 (de) 2019-04-17 2020-10-22 Rogers Germany Gmbh Verfahren zur Herstellung einer Verbundkeramik und Verbundkeramik hergestellt mit einem solchen Verfahren
DE102019113308A1 (de) 2019-05-20 2020-11-26 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und Metall-Keramik- Substrat, hergestellt mit einem solchen Verfahren
DE102019113714A1 (de) 2019-05-23 2020-11-26 Rogers Germany Gmbh Adapterelement zum Anbinden eines Elektronikbauteils an ein Kühlkörperelement, System mit einem solchen Adapterelement und Verfahren zum Herstellen eines solchen Adapterelements
JP6782996B1 (ja) 2019-07-08 2020-11-11 株式会社ワールドメタル 接合基材と金属層の接合体
DE102019125124A1 (de) 2019-09-18 2021-03-18 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
TWI761734B (zh) 2019-11-26 2022-04-21 財團法人工業技術研究院 覆銅陶瓷基板
DE102019134004A1 (de) 2019-12-11 2021-06-17 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
DE102019135097A1 (de) 2019-12-19 2021-06-24 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und Metall-Keramik-Substrat, hergestellt mit einem solchen Verfahren
DE102019135099A1 (de) 2019-12-19 2021-06-24 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und Metall-Keramik-Substrat, hergestellt mit einem solchen Verfahren
DE102019135146B4 (de) 2019-12-19 2022-11-24 Rogers Germany Gmbh Metall-Keramik-Substrat
DE102020106521A1 (de) 2020-03-10 2021-09-16 Rogers Germany Gmbh Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls
DE102020119209A1 (de) 2020-07-21 2022-01-27 Rogers Germany Gmbh Leistungsmodul und Verfahren zur Herstellung eines Leistungsmoduls
DE102020119208A1 (de) 2020-07-21 2022-01-27 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren
DE102021100463A1 (de) 2021-01-13 2022-07-14 Rogers Germany Gmbh Verfahren zum Herstellen eines Metall-Keramik-Substrats und Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren
EP4032870A1 (de) 2021-01-22 2022-07-27 Heraeus Deutschland GmbH & Co. KG Verfahren zur strukturierung von metall-keramik-substraten und strukturiertes metall-keramik-substrat
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Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB784931A (de) *
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2564738A (en) * 1947-02-25 1951-08-21 Foerderung Forschung Gmbh Method of forming a vacuum-tight bond between ceramics and metals
GB761045A (en) * 1952-08-29 1956-11-07 Lodge Plugs Ltd Improvements in or relating to the bonding of ceramics with copper
NL83997C (de) * 1953-05-12
US3030704A (en) * 1957-08-16 1962-04-24 Gen Electric Method of making non-rectifying contacts to silicon carbide
US3128545A (en) * 1959-09-30 1964-04-14 Hughes Aircraft Co Bonding oxidized materials
US3366409A (en) * 1965-06-10 1968-01-30 Philips Corp Ceramic-to-metal seal
NL153508B (nl) * 1966-11-30 1977-06-15 Philips Nv Werkwijze voor het vacuuemdicht verbinden van een keramisch voorwerp met een metalen voorwerp en elektrische ontladingsbuis voorzien van een stroomtoevoergeleider verkregen volgens die werkwijze.
US3517432A (en) * 1968-05-02 1970-06-30 Atomic Energy Commission Diffusion bonding of ceramics
BE759209A (fr) * 1969-11-25 1971-04-30 Western Electric Co Procede de soudage de verre a un metal
US3717926A (en) * 1970-01-29 1973-02-27 G Kravetsky Method of joining graphite articles
US3676292A (en) * 1970-10-07 1972-07-11 Olin Corp Composites of glass-ceramic-to-metal,seals and method of making same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01308885A (ja) * 1975-07-30 1989-12-13 General Electric Co <Ge> セラミック基体に銅部材を結合する方法
JPH0427195B2 (de) * 1975-07-30 1992-05-11 Gen Electric
JPS58102532A (ja) * 1981-12-15 1983-06-18 Toshiba Corp 半導体装置
JPH0376578B2 (de) * 1981-12-15 1991-12-05 Tokyo Shibaura Electric Co
JP2005530353A (ja) * 2002-06-20 2005-10-06 クラミック エレクトロニクス ゲーエムベーハー 電気回路またはモジュール用の金属セラミック基板と、そのような基板およびそのような基板を含むモジュールを製作する方法
JP4804751B2 (ja) * 2002-06-20 2011-11-02 クラミック エレクトロニクス ゲーエムベーハー 電気回路またはモジュール用の金属セラミック基板と、そのような基板およびそのような基板を含むモジュールを製作する方法
JP2021510928A (ja) * 2018-01-19 2021-04-30 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ レーザ部品のためのハウジングカバーを製造する方法、並びにレーザ部品のためのハウジングカバー及びレーザ部品
US11652331B2 (en) 2018-01-19 2023-05-16 Osram Oled Gmbh Method for producing a housing cover for a laser component and housing cover for a laser component and laser component

Also Published As

Publication number Publication date
IT983841B (it) 1974-11-11
DE2319854C2 (de) 1983-12-29
FR2181049B1 (de) 1980-04-11
JPS5713515B2 (de) 1982-03-17
GB1394322A (en) 1975-05-14
FR2181049A1 (de) 1973-11-30
US3766634A (en) 1973-10-23
DE2319854A1 (de) 1973-10-25

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