FR2623046B1 - Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant - Google Patents

Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant

Info

Publication number
FR2623046B1
FR2623046B1 FR8715547A FR8715547A FR2623046B1 FR 2623046 B1 FR2623046 B1 FR 2623046B1 FR 8715547 A FR8715547 A FR 8715547A FR 8715547 A FR8715547 A FR 8715547A FR 2623046 B1 FR2623046 B1 FR 2623046B1
Authority
FR
France
Prior art keywords
binding
substrate
insulating material
electrically insulating
copper sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8715547A
Other languages
English (en)
Other versions
FR2623046A1 (fr
Inventor
Jannick Guinet
Jean-Claude Hubert
Marie-Francois Martial
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telemecanique SA
Original Assignee
Telemecanique Electrique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telemecanique Electrique SA filed Critical Telemecanique Electrique SA
Priority to FR8715547A priority Critical patent/FR2623046B1/fr
Priority to DE3837788A priority patent/DE3837788C2/de
Priority to JP63283543A priority patent/JPH01261283A/ja
Priority to US07/269,394 priority patent/US4860939A/en
Publication of FR2623046A1 publication Critical patent/FR2623046A1/fr
Application granted granted Critical
Publication of FR2623046B1 publication Critical patent/FR2623046B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
FR8715547A 1987-11-10 1987-11-10 Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant Expired - Lifetime FR2623046B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR8715547A FR2623046B1 (fr) 1987-11-10 1987-11-10 Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant
DE3837788A DE3837788C2 (de) 1987-11-10 1988-11-08 Verfahren zur unmittelbaren Verbindung einer Kupferfolie mit einem Substrat aus elektrisch isolierendem Material
JP63283543A JPH01261283A (ja) 1987-11-10 1988-11-09 電気絶縁材料製の基体への銅板の接合法
US07/269,394 US4860939A (en) 1987-11-10 1988-11-10 Method for bonding a copper sheet to a substrate made of an electrically insulating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8715547A FR2623046B1 (fr) 1987-11-10 1987-11-10 Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant

Publications (2)

Publication Number Publication Date
FR2623046A1 FR2623046A1 (fr) 1989-05-12
FR2623046B1 true FR2623046B1 (fr) 1990-03-23

Family

ID=9356655

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8715547A Expired - Lifetime FR2623046B1 (fr) 1987-11-10 1987-11-10 Procede de liaison d'une feuille de cuivre a un substrat en materiau electriquement isolant

Country Status (4)

Country Link
US (1) US4860939A (fr)
JP (1) JPH01261283A (fr)
DE (1) DE3837788C2 (fr)
FR (1) FR2623046B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100740A (en) * 1989-09-25 1992-03-31 General Electric Company Direct bonded symmetric-metallic-laminate/substrate structures
FR2658504B1 (fr) * 1990-02-20 1993-08-27 Telemecanique Procede de liaison d'une feuille de metal, telle que du cuivre, sur un substrat en nitrure d'aluminium, et produit obtenu.
US5573692A (en) * 1991-03-11 1996-11-12 Philip Morris Incorporated Platinum heater for electrical smoking article having ohmic contact
DE4318061C2 (de) * 1993-06-01 1998-06-10 Schulz Harder Juergen Verfahren zum Herstellen eines Metall-Keramik-Substrates
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
EP0667640A3 (fr) * 1994-01-14 1997-05-14 Brush Wellman Produit à multicouches laminé et procédé de fabrication associé.
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
JPH10158829A (ja) * 1996-12-04 1998-06-16 Sony Corp スパッタリングターゲット組立体の製造方法
US5953511A (en) * 1997-04-08 1999-09-14 National Instruments Corporation PCI bus to IEEE 1394 bus translator
ATE400538T1 (de) * 2001-03-16 2008-07-15 Electrovac Aiuminiumnitridsubstrat sowie verfahren zur vorbereitung dieses substrates auf die verbindung mit einer kupferfolie
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
JP5493399B2 (ja) * 2009-03-12 2014-05-14 株式会社ニコン 製造装置、及び、半導体装置の製造方法
DE102010023637B4 (de) 2010-06-14 2012-01-12 Ixys Semiconductor Gmbh Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten
DE102016220082A1 (de) * 2016-10-14 2018-04-19 Würth Elektronik eiSos Gmbh & Co. KG Verfahren zum Metallisieren von Ferritkeramiken und Bauelement mit einer Ferritkeramik

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH202198A (de) * 1936-10-13 1939-01-15 Licentia Gmbh Verfahren zur Herstellung einer vakuumdichten Verbindung zwischen Keramik und Metall.
GB584931A (en) * 1944-04-17 1947-01-27 K D G Instr Ltd Improvements in or relating to float-controlled apparatus
US2517248A (en) * 1948-03-22 1950-08-01 Leonard J Semeyn Receptacle and support therefor
US2570248A (en) * 1948-06-30 1951-10-09 Gen Electric Method of metalizing and bonding nonmetallic bodies
GB761045A (en) * 1952-08-29 1956-11-07 Lodge Plugs Ltd Improvements in or relating to the bonding of ceramics with copper
US3517432A (en) * 1968-05-02 1970-06-30 Atomic Energy Commission Diffusion bonding of ceramics
US4050956A (en) * 1970-02-20 1977-09-27 Commonwealth Scientific And Industrial Research Organization Chemical bonding of metals to ceramic materials
US3994930A (en) * 1970-08-26 1976-11-30 Hoffmann-La Roche Inc. 6-(3-Cyanopropyl)-2-vinyl tetrahydropyran-2-ol and its tautomer
US3811553A (en) * 1971-12-17 1974-05-21 Owens Illinois Inc Phase compensated multiple moving head inspection apparatus
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
DE3036128C2 (de) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten
DE3204167A1 (de) * 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten
EP0097944B1 (fr) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Procédé pour la liaison directe des pièces céramiques et métalliques et produits stratifiés ainsi obtenus
JPS59190279A (ja) * 1983-04-13 1984-10-29 株式会社東芝 セラミツクス構造体及びその製造方法
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik
JPS60150653A (ja) * 1984-01-18 1985-08-08 Toshiba Corp 半導体装置
US4563383A (en) * 1984-03-30 1986-01-07 General Electric Company Direct bond copper ceramic substrate for electronic applications

Also Published As

Publication number Publication date
US4860939A (en) 1989-08-29
FR2623046A1 (fr) 1989-05-12
JPH01261283A (ja) 1989-10-18
DE3837788C2 (de) 1997-01-30
DE3837788A1 (de) 1989-05-18

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Legal Events

Date Code Title Description
ST Notification of lapse